My Inquiry
My Account
Texas Instruments LM3S8971-IBZ50-A2T
- Part No.:
- LM3S8971-IBZ50-A2T
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 108-LFBGA
- Datasheet:
-
LM3S8971-IBZ50-A2T.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 108BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,876
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LM3S8971-IBZ50-A2T from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated CAN 2.0B controller, 12-bit ADC (up to 1 MSPS), and hibernation module for ultra-low-power operation. It operates at 50 MHz and targets industrial motor control, building automation, and embedded CAN networks.
For engineers reviewing the LM3S8971-IBZ50-A2T datasheet, LM3S8971-IBZ50-A2T pinout, LM3S8971-IBZ50-A2T application, or LM3S8971-IBZ50-A2T equivalent, key selection criteria include its 50 MHz Cortex-M3 core, on-chip CAN interface, hibernation power management, 12-bit ADC performance, and QFP-100 package compatibility with legacy Stellaris designs.
Technical Context
The LM3S8971-IBZ50-A2T implements the ARMv7-M architecture with NVIC, SysTick, and MPU support. It integrates a dedicated CAN 2.0B controller with 32 message objects, hardware FIFO, and bit-rate configuration registers - enabling deterministic real-time messaging without CPU overhead.
Its analog subsystem includes a 12-bit, 1-MSPS ADC with four sample sequencers and internal temperature sensor, while the hibernation module supports RTC wake-up, battery-backed memory (2 KB), and sub-1 µA deep-sleep current - all managed via dedicated clock gating and voltage regulation circuitry.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 50 MHz max - delivers deterministic interrupt latency & Thumb-2 code density for real-time control loops. |
| Flash Memory | 256 KB - sufficient for complex firmware with bootloader, CAN protocol stack, and safety monitoring routines. |
| SRAM | 64 KB - supports large CAN message buffers, ADC data arrays, and real-time task stacks. |
| ADC | 12-bit, 1 MSPS, 8-channel - enables high-resolution current/voltage sensing in motor drives and power supplies. |
| CAN Interface | CAN 2.0B compliant, 32 message objects - supports multi-node industrial networks with prioritized message arbitration. |
| Hibernate Current | <1 µA - allows battery-powered remote nodes to operate for years on coin-cell batteries. |
| Package | 100-pin LQFP (14 × 14 mm) - compatible with standard surface-mount assembly and thermal management for industrial PCBs. |
Pinout & Package
LM3S8971-IBZ50-A2T is housed in a 100-pin LQFP (Leadless Quad Flat Package) with 0.5 mm pitch, JEDEC MS-026AC compliant, and exposed thermal pad for enhanced heat dissipation in industrial environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Power supply inputs | Dedicated domains for digital logic (VDD), analog (VDDA), and core (VDDC) - enable noise isolation and independent voltage scaling. |
| GND, GNDA, GNDC | Ground returns | Separate ground planes minimize coupling between analog, digital, and core circuits - critical for ADC accuracy and CAN signal integrity. |
| CAN0RX / CAN0TX | CAN physical layer interface | Differential pair routed to external transceiver - supports ISO 11898-2 compliant bus communication up to 1 Mbps. |
| SSI0CLK / SSI0FSS / SSI0RX / SSI0TX | Synchronous serial interface | Four-pin SPI-compatible port - used for display drivers, EEPROM, or sensor interfaces with programmable clock polarity/phase. |
| ADC0CH0–ADC0CH7 | Analog input channels | Eight single-ended or four differential inputs - directly connect to current shunts, thermistors, or potentiometers without external signal conditioning. |
| HIB, RTCCLK, HIBRST | Hibernation control signals | Enable deep-sleep entry, RTC timekeeping, and wake-up reset - managed independently of main system clock domain. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated CAN 2.0B Controller | Hardware-accelerated message filtering and transmission - eliminates software polling and reduces CPU load in multi-node systems. |
| Hibernation Module with RTC | Sub-1 µA sleep mode with battery-backed 2 KB RAM and calendar-based wake-up - extends battery life in wireless sensors and remote I/O. |
| 12-bit, 1-MSPS ADC | Four independent sample sequencers with hardware averaging - supports simultaneous sampling of motor phase currents and DC bus voltage. |
| ARM Cortex-M3 Core | Thumb-2 instruction set, NVIC with 32 priority levels, and MPU - enables RTOS integration and memory protection in safety-critical applications. |
| GPIO with Peripheral Control | 100+ configurable pins with direct peripheral mapping - allows timer capture, UART flow control, and PWM output without software intervention. |
Applications
| Industrial Motor Control | Building Automation Node |
|---|---|
Use Scenario: Closed-loop control of BLDC motors in HVAC fans and pumps using field-oriented control (FOC). IC Role / Device Role / Timing Role: Real-time execution of FOC algorithms, PWM generation, current sensing via ADC, and CAN-based command distribution. Use Value: 50 MHz Cortex-M3 core ensures sub-10 µs loop timing; integrated CAN simplifies multi-drive coordination without external protocol ICs. | Use Scenario: Distributed sensor node collecting temperature, humidity, and occupancy data across commercial buildings. IC Role / Device Role / Timing Role: Low-power data acquisition, local decision-making, and CAN bus reporting to central BMS controller. Use Value: Hibernate mode draws <1 µA during idle periods; on-chip ADC and CAN reduce component count and board space. |
| Energy Metering Gateway | Factory Floor I/O Module |
Use Scenario: Aggregating pulse outputs and RS-485 meter readings into a CAN backbone for smart grid telemetry. IC Role / Device Role / Timing Role: Protocol translation hub with time-stamped event logging and secure firmware updates over CAN. Use Value: 256 KB flash stores dual-bank firmware images; hibernation RTC maintains accurate timestamping during mains failure. | Use Scenario: Modular digital I/O unit interfacing PLCs with solenoids, relays, and proximity sensors on production lines. IC Role / Device Role / Timing Role: Deterministic I/O scanning, CAN message framing, and watchdog supervision of field devices. Use Value: 32-message-object CAN controller handles concurrent status reporting and command reception; GPIO commit registers prevent glitch-induced actuator misfires. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Tiva C TM4C123GH6PM | Successor device with same pinout, 80 MHz Cortex-M4F core, FPU, and enhanced CAN features (CAN-FD readiness); requires minor firmware adaptation. | Supports floating-point math for advanced motor control and higher CAN bandwidth requirements. | Select when upgrading legacy Stellaris designs for improved performance and future-proofing. |
| STM32F103VET6 | ARM Cortex-M3 at 72 MHz, 512 KB flash, 64 KB SRAM, but no native CAN 2.0B controller - requires external CAN transceiver + software stack. | Lacks integrated hibernation module and battery-backed RTC; higher active power consumption. | Choose for cost-sensitive applications where CAN is optional or implemented externally. |
Compared with TM4C123GH6PM and STM32F103VET6, the LM3S8971-IBZ50-A2T offers proven industrial reliability, full CAN 2.0B hardware offload, and ultra-low hibernate current - making it optimal for long-lifecycle CAN edge nodes where firmware stability and power predictability outweigh raw speed gains.
Availability
LM3S8971-IBZ50-A2T is available at Aetrix Electronics and suitable for industrial motor control, building automation, and energy metering gateways requiring stable component supply and long-term obsolescence management.
Supply support for LM3S8971-IBZ50-A2T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 90 years of innovation in industrial and automotive electronics.
The Stellaris LM3S series was designed specifically for real-time industrial control applications demanding integrated CAN, low-power hibernation, and deterministic interrupt response - positioning LM3S8971-IBZ50-A2T as a purpose-built solution for rugged embedded networks.
FAQ
What is the maximum operating frequency of the LM3S8971-IBZ50-A2T?
The LM3S8971-IBZ50-A2T operates at a maximum system clock frequency of 50 MHz, derived from an internal PLL that multiplies the crystal oscillator input. This frequency is specified under industrial temperature range (-40°C to +85°C) and 3.3 V supply conditions per the official Texas Instruments production datasheet DS-LM3S8971-15852.2743.
Does the LM3S8971-IBZ50-A2T include an integrated CAN controller?
Yes, the LM3S8971-IBZ50-A2T integrates a fully compliant CAN 2.0B controller with 32 message objects, hardware FIFO, and programmable bit-timing registers. It supports both standard and extended identifiers and requires only an external CAN transceiver (e.g., SN65HVD230) to interface with the physical bus.
What power-saving modes does the LM3S8971-IBZ50-A2T support?
The LM3S8971-IBZ50-A2T supports multiple low-power states including Sleep, Deep-Sleep, and Hibernation. In Hibernation mode, it achieves less than 1 µA typical current draw while maintaining RTC operation and 2 KB of battery-backed SRAM - enabled via dedicated hibernation module and separate VBAT supply path.
What is the ADC resolution and sampling rate of the LM3S8971-IBZ50-A2T?
The LM3S8971-IBZ50-A2T features a 12-bit successive-approximation ADC capable of up to 1 million samples per second (1 MSPS). It includes eight analog input channels, four independent sample sequencers, and hardware averaging - supporting precise current, voltage, and temperature measurements in real-time control systems.
Is the LM3S8971-IBZ50-A2T pin-compatible with other Stellaris devices?
The LM3S8971-IBZ50-A2T uses a 100-pin LQFP package identical to several other LM3S family members (e.g., LM3S811, LM3S8962), enabling layout reuse across designs. However, peripheral mapping and memory size differ - so firmware and pinmux configuration must be validated per device, even when footprint matches.
LM3S8971-IBZ50-A2T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 108-LFBGA
- Series:
- Stellaris® ARM® Cortex®-M3S 8000
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- CANbus, Ethernet, IrDA, Microwire, QEI, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 38
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S8971-IBZ50-A2T FAQ
1.How can I place an order for LM3S8971-IBZ50-A2T through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S8971-IBZ50-A2T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S8971-IBZ50-A2T reliable?
The price and inventory of LM3S8971-IBZ50-A2T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S8971-IBZ50-A2T is usually 5 days.
3.What payment methods are accepted for LM3S8971-IBZ50-A2T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S8971-IBZ50-A2T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3S8971-IBZ50-A2T?
LM3S8971-IBZ50-A2T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S8971-IBZ50-A2T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S8971-IBZ50-A2T?
For technical support, including LM3S8971-IBZ50-A2T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S8971-IBZ50-A2T requirements.
6.How does Aetrix verify that LM3S8971-IBZ50-A2T is sourced from the original manufacturer or authorized distributors?
All LM3S8971-IBZ50-A2T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S8971-IBZ50-A2T meets industry standards.
7.What is the process for return or replacement of LM3S8971-IBZ50-A2T?
All LM3S8971-IBZ50-A2T units undergo pre-shipment inspection (PSI). If there is an issue with LM3S8971-IBZ50-A2T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S8971-IBZ50-A2T part is unused and in its original packaging.
Return procedure for LM3S8971-IBZ50-A2T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LM3S8971-IBZ50-A2T Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
