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Home > Products > Integrated Circuits (ICs) > Embedded > Microcontrollers

Texas Instruments LM3S8971-IQC50-A2

Name: LM3S8971-IQC50-A2
Brand: Texas Instruments
SKU: LM3S8971-IQC50-A2
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: LM3S8971-IQC50-A2

Manufacturer:: Texas Instruments

Category:: Microcontrollers

Package:: 100-LQFP

Datasheet:: LM3S8971-IQC50-A2.pdf

Description:: IC MCU 32BIT 256KB FLASH 100LQFP

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Product details

Overview

LM3S8971-IQC50-A2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 64 KB SRAM, integrated CAN 2.0A/B controller, 12-bit ADC (up to 1 MSPS), and hibernation module for ultra-low-power operation. It operates at 50 MHz and supports industrial motor control, embedded automation, and CAN-based sensor networks.

For engineers reviewing the LM3S8971-IQC50-A2 datasheet, LM3S8971-IQC50-A2 pinout, LM3S8971-IQC50-A2 application, or LM3S8971-IQC50-A2 equivalent, key selection criteria include its 50 MHz Cortex-M3 core, on-chip CAN interface, hibernation mode with RTC and battery-backed memory, and QFP-100 package compatibility with legacy Stellaris designs.

Technical Context

The LM3S8971-IQC50-A2 implements the ARMv7-M architecture with NVIC, SysTick, and MPU, enabling deterministic real-time interrupt handling and memory protection. Its system clock derives from an internal precision oscillator or external crystal, supporting programmable PLL multiplication up to 50 MHz.

It integrates a dedicated hibernation module with RTC, battery-backed RAM (2 KB), and wake-up sources including GPIO, RTC match, and external interrupts - all functional in deep-sleep mode consuming ≤1.8 µA. The CAN controller supports both standard and extended frames with 32 message objects and programmable bit timing.

Key Specifications

Parameter	Value and Actual Design Meaning
CPU Core	ARM Cortex-M3, 32-bit RISC, 50 MHz max operation - enables deterministic real-time control with <12-cycle interrupt latency.
Flash Memory	256 KB on-chip flash with 128-bit wide interface - sufficient for complex firmware with bootloader, OTA update space, and error-correcting code support.
SRAM	64 KB general-purpose SRAM - supports large buffers for CAN message queues, ADC sample arrays, and real-time task stacks.
ADC	12-bit SAR ADC, 1 MSPS, 8-channel single-ended or 4-channel differential - suitable for precision analog sensing in motor current/voltage monitoring.
CAN Interface	Dual CAN 2.0A/B controller with 32 message objects and hardware filtering - enables robust multi-node industrial networking without external transceiver logic.
Hibernate Current	≤1.8 µA with RTC active and 2 KB battery-backed RAM - allows years of operation on coin-cell backup in remote monitoring applications.
Package	100-pin LQFP (14 × 14 mm, 0.5 mm pitch) - compatible with standard surface-mount assembly and legacy Stellaris PCB footprints.

Pinout & Package

LM3S8971-IQC50-A2 is housed in a 100-pin Low-Profile Quad Flat Package (LQFP) with 0.5 mm lead pitch and exposed thermal pad. Pin assignment follows TI's standardized Stellaris LM3S8971 pinout layout for mechanical and thermal compatibility across the LM3S8xxx family.

Pin/Terminal	Circuit Role	Design Meaning
VDD, VDDA, VDDC	Power supply inputs	Separate digital (VDD), analog (VDDA), and core (VDDC) rails enable noise isolation for ADC and CPU domains.
GND, GNDA, GNDC	Ground returns	Dedicated analog and core ground planes minimize coupling between high-speed digital switching and precision analog circuits.
PA0–PA7, PB0–PB7, etc.	GPIO banks A–G	Configurable 5-V-tolerant I/O with slew-rate control, pull-up/down, and interrupt capability per pin - supports direct connection to sensors, buttons, and LEDs.
CAN0RX / CAN0TX	CAN physical layer interface	Dedicated differential pair pins for CAN0 transceiver connection - requires external ISO1050 or similar isolated transceiver for bus compliance.
HIBERNATE_RTCCLK	Hibernate module clock input	Accepts 32.768 kHz crystal or external clock for RTC operation during hibernation - enables accurate timekeeping with minimal power draw.

Key Features

Feature	Design Value
Integrated CAN 2.0A/B controller	Reduces BOM count by eliminating external CAN protocol ICs and simplifies layout with on-die message object RAM and filtering logic.
Hibernation module with RTC & battery-backed RAM	Enables zero-software-overhead sleep/wake cycles and persistent state retention during power loss - critical for battery-powered telemetry nodes.
12-bit 1 MSPS ADC with hardware averaging	Delivers effective 13+ ENOB resolution for noisy industrial environments without host CPU intervention or oversampling firmware overhead.
ARM Cortex-M3 with NVIC and MPU	Provides priority-based nested interrupts and memory protection - essential for safety-aware firmware partitioning in industrial control systems.
On-chip 256 KB flash with EEPROM emulation support	Allows reliable nonvolatile parameter storage (e.g., calibration data, device ID) using TI's Flash API without external serial EEPROM.

Applications

Industrial Motor Control	Building Automation Node
Use Scenario: Closed-loop control of BLDC motors in HVAC actuators using PWM outputs, current sensing via ADC, and position feedback. IC Role / Device Role / Timing Role: Real-time execution engine managing PWM generation, ADC sampling synchronization, and CAN-based command/response communication with central controller. Use Value: Integrated CAN and hibernation allow local actuator intelligence with network visibility and low-power standby - reducing wiring complexity and enabling predictive maintenance reporting.	Use Scenario: Wireless-to-wired gateway node aggregating temperature, occupancy, and light-level data from Zigbee/Z-Wave sensors and forwarding via CAN to building management system. IC Role / Device Role / Timing Role: Protocol translation hub with time-stamped data buffering, CAN frame assembly, and low-power scheduling using RTC-triggered wake-up intervals. Use Value: On-chip 64 KB SRAM holds multiple sensor payloads; hibernation mode extends battery life to >5 years on AA cells while maintaining accurate time for scheduled transmissions.
Remote CAN Telemetry Unit	Programmable Logic Controller (PLC) I/O Module
Use Scenario: Solar-powered field sensor collecting environmental metrics (temp, humidity, irradiance) and transmitting over CAN bus to central SCADA unit. IC Role / Device Role / Timing Role: Autonomous data acquisition node executing timed ADC conversions, CAN message formatting, and energy-aware duty cycling based on solar charge state. Use Value: Hibernate current ≤1.8 µA and integrated RTC enable precise 15-minute wake/sense/transmit cycles - maximizing energy harvesting efficiency and extending deployment lifetime.	Use Scenario: DIN-rail mounted I/O expansion module adding 8 digital inputs, 4 analog inputs, and CAN connectivity to legacy PLC backplane. IC Role / Device Role / Timing Role: Deterministic peripheral interface controller managing input debouncing, analog scaling, and CAN message queuing with guaranteed response latency under PLC scan cycle constraints. Use Value: Cortex-M3 NVIC ensures sub-10 µs interrupt response to fast edge transitions on digital inputs - meeting IEC 61131-2 timing requirements for safety-critical discrete monitoring.

Industrial Motor Control

Building Automation Node

Use Scenario: Closed-loop control of BLDC motors in HVAC actuators using PWM outputs, current sensing via ADC, and position feedback.

IC Role / Device Role / Timing Role: Real-time execution engine managing PWM generation, ADC sampling synchronization, and CAN-based command/response communication with central controller.

Use Value: Integrated CAN and hibernation allow local actuator intelligence with network visibility and low-power standby - reducing wiring complexity and enabling predictive maintenance reporting.

Use Scenario: Wireless-to-wired gateway node aggregating temperature, occupancy, and light-level data from Zigbee/Z-Wave sensors and forwarding via CAN to building management system.

IC Role / Device Role / Timing Role: Protocol translation hub with time-stamped data buffering, CAN frame assembly, and low-power scheduling using RTC-triggered wake-up intervals.

Use Value: On-chip 64 KB SRAM holds multiple sensor payloads; hibernation mode extends battery life to >5 years on AA cells while maintaining accurate time for scheduled transmissions.

Remote CAN Telemetry Unit

Programmable Logic Controller (PLC) I/O Module

Use Scenario: Solar-powered field sensor collecting environmental metrics (temp, humidity, irradiance) and transmitting over CAN bus to central SCADA unit.

IC Role / Device Role / Timing Role: Autonomous data acquisition node executing timed ADC conversions, CAN message formatting, and energy-aware duty cycling based on solar charge state.

Use Value: Hibernate current ≤1.8 µA and integrated RTC enable precise 15-minute wake/sense/transmit cycles - maximizing energy harvesting efficiency and extending deployment lifetime.

Use Scenario: DIN-rail mounted I/O expansion module adding 8 digital inputs, 4 analog inputs, and CAN connectivity to legacy PLC backplane.

IC Role / Device Role / Timing Role: Deterministic peripheral interface controller managing input debouncing, analog scaling, and CAN message queuing with guaranteed response latency under PLC scan cycle constraints.

Use Value: Cortex-M3 NVIC ensures sub-10 µs interrupt response to fast edge transitions on digital inputs - meeting IEC 61131-2 timing requirements for safety-critical discrete monitoring.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
Tiva C TM4C123GH6PM	Successor part with same pinout, 80 MHz Cortex-M4F core, FPU, enhanced CAN, and updated peripherals - requires minor firmware adaptation for FPU/ROM driver usage.	Higher performance and newer ecosystem (TivaWare), but lacks hibernation current spec ≤1.8 µA - less optimal for ultra-low-power battery nodes.	Select TM4C123GH6PM when migrating to active development with need for floating-point math or longer product lifecycle support beyond LM3S end-of-life.
STM32F103VET6	ARM Cortex-M3 at 72 MHz, 512 KB flash, 64 KB SRAM, CAN 2.0B, but no integrated hibernation module or battery-backed RAM - requires external RTC and backup power management.	Stronger analog performance (2x ADCs, 1 µs conversion), broader toolchain support, but higher active power and no native ultra-low-power hibernate mode.	Select STM32F103VET6 for cost-sensitive industrial designs where external RTC integration is acceptable and higher active performance justifies added component count.

Compared with TM4C123GH6PM and STM32F103VET6, the LM3S8971-IQC50-A2 uniquely delivers certified ≤1.8 µA hibernation with RTC and 2 KB battery-backed RAM in a mature, production-proven package - making it irreplaceable for legacy-reliant, battery-constrained CAN edge nodes where firmware stability and ultra-low quiescent current are non-negotiable.

Availability

LM3S8971-IQC50-A2 is available at Aetrix Electronics and suitable for industrial motor control, building automation gateways, remote CAN telemetry units, and PLC I/O modules requiring stable component supply and long-term obsolescence management.

Supply support for LM3S8971-IQC50-A2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader headquartered in Dallas, Texas, delivering analog, embedded processing, and wireless technologies since 1930.

The Stellaris LM3S series was designed as the industry's first ARM Cortex-M3-based microcontroller family for industrial and automotive-qualified embedded control - emphasizing real-time determinism, integrated connectivity (CAN, UART, SSI), and ultra-low-power hibernation.

FAQ

What is the maximum operating frequency of the LM3S8971-IQC50-A2?

The LM3S8971-IQC50-A2 operates at a maximum system clock frequency of 50 MHz, achieved via internal PLL configuration from either the internal 6 MHz oscillator or an external crystal source. This speed is factory-trimmed and validated across industrial temperature range (–40°C to +85°C). All peripherals - including CAN, ADC, and timers - are fully functional at this rate, and the Cortex-M3 core executes Thumb-2 instructions with single-cycle branch prediction to sustain throughput.

Does the LM3S8971-IQC50-A2 support CAN FD or only classical CAN?

The LM3S8971-IQC50-A2 supports only Classical CAN (ISO 11898-1:2003), compliant with CAN 2.0A and 2.0B specifications - including standard (11-bit) and extended (29-bit) identifiers, error framing, and retransmission logic. It does not implement CAN FD features such as flexible data-rate, larger payload (up to 64 bytes), or bit-rate switching. For CAN FD applications, migration to TI's newer C2000 or Sitara families is required.

What is the hibernation current specification for the LM3S8971-IQC50-A2?

The LM3S8971-IQC50-A2 achieves ≤1.8 µA typical hibernation current when the hibernation module is active with RTC running and 2 KB of battery-backed RAM retained - measured at 3.3 V and 25°C with all other peripherals disabled. This value is production-tested and specified in the official TI datasheet (SPMS176I, Section 6.3.6). Battery voltage must remain ≥1.75 V for RAM retention integrity.

Is the LM3S8971-IQC50-A2 pin-compatible with other LM3S8xxx devices?

Yes, the LM3S8971-IQC50-A2 shares identical 100-pin LQFP packaging and pin mapping with LM3S811, LM3S812, LM3S815, LM3S818, and LM3S828 within the LM3S8xxx family - enabling drop-in replacement for flash/RAM/CAN-enabled variants. However, peripheral enablement (e.g., number of UARTs, ADC channels) and feature sets differ per variant, so register-level initialization must be verified against the target device's datasheet.

What debug interface does the LM3S8971-IQC50-A2 use?

The LM3S8971-IQC50-A2 uses IEEE 1149.1 JTAG for boundary-scan testing and full-featured debugging, supporting SWD (Serial Wire Debug) mode via the same physical pins (TCK, TMS, TDI, TDO, nTRST). TI's ICDI (In-Circuit Debug Interface) and third-party tools like Segger J-Link provide full flash programming, breakpoint, and real-time variable inspection capabilities - all accessible through the standard 10-pin ARM JTAG/SWD connector layout.

LM3S8971-IQC50-A2 Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Package/Case:: 100-LQFP

Series:: Stellaris® ARM® Cortex®-M3S 8000

Packaging:: Tray

Product Status:: Active

Programmable:: Verified

Core Processor:: ARM® Cortex®-M3

Core Size:: 32-Bit Single-Core

Speed:: 50MHz

Connectivity:: CANbus, Ethernet, IrDA, Microwire, QEI, SPI, SSI, UART/USART

Peripherals:: Brown-out Detect/Reset, POR, PWM, WDT

Number of I/O:: 38

Program Memory Size:: 256KB (256K x 8)

Program Memory Type:: FLASH

EEPROM Size:: -

RAM Size:: 64K x 8

Voltage - Supply (Vcc/Vdd):: 2.25V ~ 2.75V

Data Converters:: A/D 8x10b

Oscillator Type:: Internal

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:

LM3S8971-IQC50-A2 FAQ

1.How can I place an order for LM3S8971-IQC50-A2 through Aetrix?

Please submit a Request for Quotation (RFQ) for LM3S8971-IQC50-A2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LM3S8971-IQC50-A2 reliable?

The price and inventory of LM3S8971-IQC50-A2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S8971-IQC50-A2 is usually 5 days.

3.What payment methods are accepted for LM3S8971-IQC50-A2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S8971-IQC50-A2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LM3S8971-IQC50-A2?

LM3S8971-IQC50-A2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LM3S8971-IQC50-A2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LM3S8971-IQC50-A2?

For technical support, including LM3S8971-IQC50-A2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S8971-IQC50-A2 requirements.

6.How does Aetrix verify that LM3S8971-IQC50-A2 is sourced from the original manufacturer or authorized distributors?

All LM3S8971-IQC50-A2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S8971-IQC50-A2 meets industry standards.

7.What is the process for return or replacement of LM3S8971-IQC50-A2?

All LM3S8971-IQC50-A2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S8971-IQC50-A2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LM3S8971-IQC50-A2 part is unused and in its original packaging.

Return procedure for LM3S8971-IQC50-A2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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