Texas Instruments LM70CILDX-3

Overview

LM70CILDX-3 from Texas Instruments is a SPI/MICROWIRE-compatible 10-bit plus sign digital temperature sensor in an 8-pin WSON package, delivering 0.25°C resolution over −55°C to +150°C, with 260 μA typical operating current and shutdown mode drawing only 12 μA - used for real-time thermal monitoring in disk drives and embedded controllers.

For engineers reviewing the LM70CILDX-3 datasheet, LM70CILDX-3 pinout, LM70CILDX-3 application, or LM70CILDX-3 equivalent, this page provides verified functional identity, validated WSON-8 pin mapping, confirmed temperature accuracy bands (±2°C max from −40°C to +85°C), SPI timing compliance (t3 ≤ 70 ns), and direct alternative part comparisons grounded in TI's official documentation.

Technical Context

The LM70CILDX-3 integrates a band-gap temperature sensor and a ΔΣ ADC with 11-bit two's complement output format (LSB = 0.25°C). Its serial interface operates as a slave device compatible with both SPI and MICROWIRE protocols, using SI/O bidirectional data, SC clock, and CS chip select - all with Schmitt-trigger inputs for noise immunity.

It features three internal registers: read-only temperature register (D5–D15 = temperature data), write-only configuration register (D0 = shutdown control), and read-only manufacturer ID register (0x8100). Power-up defaults to continuous conversion mode, and shutdown is entered by writing FFh to the configuration register - reducing supply current to <12 μA while retaining bus responsiveness.

Key Specifications

Pinout & Package

LM70CILDX-3 is housed in an 8-pin WSON package (TI package code NGK0008A), thermally enhanced with exposed pad for improved junction-to-board conduction. Pin 7 is GND; pin 5 is V+; pins 1 (SI/O), 3 (SC), and 8 (CS) form the full SPI/MICROWIRE interface; pins 2, 4, and 6 are NC (no connect).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar digital temperature sensor applications.

Compared with LM70CIMMX-3/NOPB, LM70CILDX-3 offers 40% smaller PCB area and superior thermal coupling to the board, while MAX6626ETA+ trades SPI compatibility for higher resolution and SMBus integration - making LM70CILDX-3 optimal for space-constrained, SPI-native thermal monitoring in storage and embedded compute.

Availability

LM70CILDX-3 is available at Aetrix Electronics and suitable for hard disk drives, office electronics thermal management, and electronic test equipment requiring stable component supply across long-lifecycle industrial programs.

Supply support for LM70CILDX-3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of experience in precision sensing and signal chain solutions.

The LM70 series was designed specifically for low-power, SPI-compatible digital temperature sensing in space-constrained computing and storage subsystems - emphasizing resolution, wide temperature range, and seamless microcontroller integration.

FAQ

What is the exact package type and dimensions of the LM70CILDX-3?

The LM70CILDX-3 uses the WSON-8 package (TI drawing NGK0008A), measuring 3.0 mm × 3.0 mm with 0.65 mm pin pitch and an exposed thermal pad. This compact footprint is confirmed in TI's PACKAGE OPTION ADDENDUM dated 23-Sep-2013 and matches the LM70CILD-3/NOPB variant. The LM70CILDX-3 shares identical mechanical specifications with that part, including moisture sensitivity level (MSL-3) and RoHS-compliant Cu-Sn lead finish.

Does the LM70CILDX-3 support true SPI mode with CPOL=0 and CPHA=0?

Yes, the LM70CILDX-3 supports standard SPI Mode 0 (CPOL=0, CPHA=0): data is sampled on the rising edge of SC and shifted out on the falling edge. This is explicitly defined in the "Serial Bus Interface" section of the SNIS112G datasheet, which states "data is clocked out on the falling edge of SC, while data is clocked in on the rising edge of SC." The LM70CILDX-3 does not require clock inversion or phase adjustment for compatibility with most hardware SPI peripherals.

What is the temperature accuracy specification for the LM70CILDX-3 at 25°C?

At TA = 25°C, the LM70CILDX-3 exhibits typical temperature error within ±0.5°C, though the datasheet only guarantees ±2.0°C maximum over −40°C to +85°C. The −10°C to +65°C band specifies +1.5/−2.0°C max, and the full −55°C to +150°C range is +3.5/−2.0°C max. These values are measured under specified V+ conditions (2.65V–3.6V for LM70-3 variants like LM70CILDX-3) and include power supply variation effects.

How does shutdown mode affect communication capability in the LM70CILDX-3?

In shutdown mode, the LM70CILDX-3 draws ≤12 μA and outputs its Manufacturer ID (0x8100) continuously on SI/O when CS is asserted. The serial bus remains fully responsive: CS can be pulsed to read the ID or issue new commands, and writing 00h restores continuous conversion. Shutdown does not disable the interface - it only halts temperature conversions and reduces current, enabling low-power polling architectures.

Is the LM70CILDX-3 pin-compatible with other LM70 variants such as LM70CIMM-3/NOPB?

No, the LM70CILDX-3 (WSON-8, NGK) is not pin-compatible with LM70CIMM-3/NOPB (VSSOP-8, DGK): although both have 8 pins and share identical pin functions (SI/O, SC, CS, V+, GND), their physical layouts differ - WSON places GND on pin 7 and V+ on pin 5, while VSSOP places GND on pin 4 and V+ on pin 5. PCB layout and stencil design must be unique to each package; no direct footprint substitution is possible without redesign.