Texas Instruments LM70CIMM-3-TI
- Part No.:
- LM70CIMM-3-TI
- Manufacturer:
- Texas Instruments
- Category:
- Analog and Digital Output
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
LM70CIMM-3-TI.pdf
- Description:
- SERIAL SWITCH/DIGITAL SENSOR, 11
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
LM70CIMM-3-TI from Texas Instruments is a SPI/MICROWIRE-compatible 10-bit plus sign digital temperature sensor in VSSOP-8 package, delivering 0.25°C resolution over −55°C to +150°C, with shutdown current <12 μA and supply range 2.65V–5.5V. It serves as a die-temperature sensing element in thermal management circuits for hard disk drives and office electronics.
For engineers reviewing the LM70CIMM-3-TI datasheet, LM70CIMM-3-TI pinout, LM70CIMM-3-TI application, or LM70CIMM-3-TI equivalent, key selection factors include its ΔΣ ADC architecture, tri-state serial I/O timing, shutdown command protocol (0xFF write), and VSSOP-8 thermal resistance (θJA = 200°C/W).
Technical Context
The LM70CIMM-3-TI integrates a band-gap temperature sensor with a 10-bit plus sign delta-sigma ADC, outputting data in two's complement format where one LSB equals 0.25°C. Its serial interface operates in slave mode, compatible with both SPI and MICROWIRE protocols using SI/O bidirectional data line and Schmitt-triggered SC clock.
Communication requires 32 serial clocks per full transaction: 16 clocks for temperature readback (MSB-first, 11-bit signed value), followed by 16 clocks for configuration write - including shutdown activation via 0xFF command. The device powers up in continuous conversion mode and supports manufacturer ID readback during shutdown.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Temperature Range | −55°C to +150°C operating range; enables use in high-temp industrial and storage environments. |
| Resolution | 11-bit two's complement output (10 bits + sign); 0.25°C per LSB provides fine-grained thermal monitoring. |
| Accuracy | +3.5/−2.0°C max error over full range; ±2.0°C max from −40°C to +85°C for commercial-grade reliability. |
| Supply Current | 260 μA typical active current; 12 μA typical shutdown current - critical for battery-backed or low-power thermal logging. |
| Supply Voltage | 2.65V to 5.5V operation; supports direct connection to 3.3V or 5V system rails without regulation. |
| Interface Protocol | SPI/MICROWIRE 3-wire bus (CS, SC, SI/O); eliminates need for I²C pull-ups and simplifies microcontroller GPIO usage. |
| Conversion Time | 210 ms maximum; defines minimum polling interval for real-time thermal response in closed-loop systems. |
Pinout & Package
VSSOP-8 package (Package Drawing DGK), 3.0 mm × 3.0 mm body, 0.65 mm pitch, exposed pad not present. Thermal resistance θJA = 200°C/W when mounted on standard PCB with 2 oz copper.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SI/O | Serial Input/Output | Bidirectional data line with Schmitt trigger input; transmits temperature data on falling SC edge, receives commands on rising SC edge. |
| SC | Serial Clock | Schmitt-triggered clock input; master-controlled timing signal defining data sampling and shifting edges. |
| GND | Ground Reference | Primary thermal path to die; PCB copper area under GND pin directly affects measurement accuracy and self-heating. |
| V+ | Positive Supply | 2.65V–5.5V input requiring local 0.1 μF ceramic bypass capacitor to stabilize ADC reference and reduce noise. |
| CS | Chip Select | Active-low enable; initiates communication and controls SI/O tri-state behavior - must be stable before SC transitions. |
| NC | No Connect | Pins 3, 6, and 8 are internally unconnected; must remain floating or grounded per layout best practices to avoid EMI coupling. |
Key Features
| Feature | Design Value |
|---|---|
| ΔΣ ADC Architecture | Provides inherent noise rejection and stable 0.25°C resolution without external filtering components. |
| Shutdown Mode Control | Reduces quiescent current to 12 μA via simple 0xFF write command - enables ultra-low-duty-cycle thermal sampling. |
| SPI/MICROWIRE Compatibility | Eliminates protocol translation logic; interoperates with legacy and modern MCUs without firmware abstraction layer. |
| Manufacturer ID Register | Verifies TI origin during startup or diagnostics; outputs fixed 0x81xx pattern in shutdown mode for firmware validation. |
| Tri-State Output Behavior | SI/O automatically enters high-impedance state after 14-bit transmission - prevents bus contention in multi-device configurations. |
Applications
| Hard Disk Drive Thermal Monitoring | Office Equipment Temperature Control |
|---|---|
|
Use Scenario: Real-time spindle motor and controller IC temperature tracking inside 2.5" and 3.5" HDD enclosures. IC Role / Device Role / Timing Role: Die-temperature sensor feeding thermal throttle signals to host controller every 210 ms. Use Value: Prevents thermal runaway during sustained write operations by triggering speed reduction before exceeding 70°C junction limit. |
Use Scenario: Ambient and power-supply FET temperature supervision in laser printers and multifunction copiers. IC Role / Device Role / Timing Role: Standalone thermal watchdog interfaced to MCU GPIO via SPI, polling at 1 Hz during standby. Use Value: Enables fan speed modulation and sleep-mode entry based on measured board temperature, reducing acoustic noise and idle power. |
| Industrial PC System Management | Electronic Test Equipment Calibration |
|
Use Scenario: CPU voltage regulator and chipset thermal margin verification in fanless IPCs deployed in factory automation cabinets. IC Role / Device Role / Timing Role: Secondary temperature node co-located with VRM MOSFETs, sampled synchronously with system health monitor. Use Value: Detects localized hotspots exceeding 95°C that indicate inadequate heatsink contact or aging thermal interface material. |
Use Scenario: Reference temperature stabilization in benchtop DMMs and oscilloscope front-end amplifiers requiring <±0.5°C drift stability. IC Role / Device Role / Timing Role: Embedded calibration sensor providing real-time die temperature correction to analog signal chain offset registers. Use Value: Compensates for gain/offset drift induced by ambient changes, maintaining 16-bit measurement accuracy across 15°C–35°C lab environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar digital temperature sensor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX6602ESA+ | 12-bit resolution (0.0625°C), I²C-only interface, 1.7V–3.6V supply, ±2°C accuracy over −40°C to +125°C. | Requires I²C bus and level-shifting for 5V systems; better resolution but narrower voltage and temp range than LM70CIMM-3-TI. | Select for higher-resolution, low-voltage embedded systems where I²C is already implemented. |
| ADT7301ARMZ | 16-bit resolution (0.0078°C), SPI interface, 2.7V–5.5V supply, ±0.5°C accuracy over −40°C to +150°C, internal 2.5V reference. | Higher precision and accuracy, but larger 8-lead MSOP package and higher cost; no shutdown mode below 100 μA. | Select when sub-degree accuracy and long-term stability are required in mission-critical thermal protection circuits. |
Compared with MAX6602ESA+ and ADT7301ARMZ, the LM70CIMM-3-TI offers optimal balance of SPI compatibility, wide supply range, ultra-low shutdown current, and VSSOP-8 footprint - making it ideal for cost-sensitive, space-constrained thermal monitoring where 0.25°C resolution suffices.
Availability
LM70CIMM-3-TI is available at Aetrix Electronics and suitable for hard disk drives, office electronics, industrial PCs, electronic test equipment, and system thermal management requiring stable component supply across extended temperature ranges.
Supply support for LM70CIMM-3-TI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, designing and manufacturing analog and embedded processing chips for industrial, automotive, and consumer applications.
The LM70 series was developed specifically for low-cost, SPI-based thermal monitoring in space-constrained storage and computing platforms - emphasizing simplicity, low power, and robust serial interface operation.
FAQ
What is the operating temperature range of the LM70CIMM-3-TI?
The LM70CIMM-3-TI operates from −55°C to +150°C. This full-range specification is validated per the datasheet's Operating Ratings table and applies across the entire supply voltage range of 2.65V to 5.5V. At extremes, accuracy degrades to +3.5/−2.0°C, while tighter ±2.0°C tolerance holds from −40°C to +85°C - making LM70CIMM-3-TI suitable for both industrial and commercial thermal sensing roles.
How does the LM70CIMM-3-TI enter and exit shutdown mode?
The LM70CIMM-3-TI enters shutdown mode by receiving an 0xFF command during the write phase of a 32-clock SPI transaction - specifically, writing XX FF to the configuration register. It exits shutdown upon any subsequent valid command (e.g., 0x00) or power cycle. In shutdown, LM70CIMM-3-TI draws ≤12 μA and outputs its Manufacturer ID (0x81xx) on SI/O, enabling firmware identification without waking the sensor.
What is the meaning of "10-bit plus sign" resolution in the LM70CIMM-3-TI?
"10-bit plus sign" means the LM70CIMM-3-TI outputs an 11-bit two's complement word: one sign bit plus ten magnitude bits. Each LSB represents 0.25°C, yielding a total span of −55°C to +150°C with uniform 0.25°C quantization steps. This format allows direct interpretation of temperature data without scaling math - for example, 0x001F = 0°C, 0x003F = +0.25°C, and 0xFFF = −0.25°C.
Does the LM70CIMM-3-TI require external components for basic operation?
Yes - the LM70CIMM-3-TI requires a 0.1 μF ceramic bypass capacitor between V+ and GND, placed as close as possible to the pins. No external oscillator, reference, or filtering components are needed due to its integrated ΔΣ ADC and band-gap sensor. Pull-up resistors are unnecessary because SI/O uses tri-state control synchronized to CS and SC, eliminating bus contention risks.
Is the LM70CIMM-3-TI RoHS compliant and what is its moisture sensitivity level?
Yes, the LM70CIMM-3-TI/NOPB variant is RoHS compliant (Green, lead-free, no Sb/Br) and rated MSL Level-1 (unlimited floor life at ≤30°C/60% RH). Per TI's Package Option Addendum, it uses Sn (matte tin) lead finish and is qualified for reflow up to 260°C peak temperature - confirming full compatibility with standard lead-free PCB assembly processes.
LM70CIMM-3-TI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Packaging:
- Bulk
- Product Status:
- Active
- Sensor Type:
- Digital, Local
- Sensing Temperature - Local:
- -55°C ~ 150°C
- Sensing Temperature - Remote:
- -
- Output Type:
- SPI
- Voltage - Supply:
- 2.65V ~ 5.5V
- Resolution:
- 11 b
- Features:
- Shutdown Mode
- Accuracy - Highest (Lowest):
- 1.5°C (-2°C, 3.5°C)
- Test Condition:
- -10°C ~ 65°C (-55°C ~ 150°C)
- Operating Temperature:
- -55°C ~ 150°C
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 8-MSOP
LM70CIMM-3-TI FAQ
1.How can I place an order for LM70CIMM-3-TI through Aetrix?
Please submit a Request for Quotation (RFQ) for LM70CIMM-3-TI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM70CIMM-3-TI reliable?
The price and inventory of LM70CIMM-3-TI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM70CIMM-3-TI is usually 5 days.
3.What payment methods are accepted for LM70CIMM-3-TI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM70CIMM-3-TI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM70CIMM-3-TI?
LM70CIMM-3-TI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM70CIMM-3-TI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM70CIMM-3-TI?
For technical support, including LM70CIMM-3-TI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM70CIMM-3-TI requirements.
6.How does Aetrix verify that LM70CIMM-3-TI is sourced from the original manufacturer or authorized distributors?
All LM70CIMM-3-TI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM70CIMM-3-TI meets industry standards.
7.What is the process for return or replacement of LM70CIMM-3-TI?
All LM70CIMM-3-TI units undergo pre-shipment inspection (PSI). If there is an issue with LM70CIMM-3-TI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM70CIMM-3-TI part is unused and in its original packaging.
Return procedure for LM70CIMM-3-TI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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