Texas Instruments LM70CIMMX-5
- Part No.:
- LM70CIMMX-5
- Manufacturer:
- Texas Instruments
- Category:
- Analog and Digital Output
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
LM70CIMMX-5.pdf
- Description:
- SENSOR DIGITAL -55C-150C 8VSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:3,887
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LM70CIMMX-5 from Texas Instruments is a SPI/MICROWIRE-compatible 10-bit plus sign digital temperature sensor in VSSOP-8 package, delivering 0.25°C resolution over −55°C to +150°C, with supply voltage range 2.65V–5.5V and typical operating current of 260 μA. It serves as a die-temperature sensing element in thermal management systems for hard disk drives and embedded controllers.
For engineers reviewing the LM70CIMMX-5 datasheet, LM70CIMMX-5 pinout, LM70CIMMX-5 application, or LM70CIMMX-5 equivalent, key selection criteria include its SPI/MICROWIRE interface compatibility, shutdown mode (<12 μA), ±2°C accuracy (−40°C to +85°C), VSSOP-8 footprint, and direct integration into microcontroller-based thermal monitoring without external ADC or signal conditioning.
Technical Context
The LM70CIMMX-5 integrates a band-gap temperature sensor and a ΔΣ ADC with 11-bit two's complement output (LSB = 0.25°C). Its serial interface operates as a slave device, using SI/O bidirectional data line, SC clock input, and CS chip select - all with Schmitt-trigger inputs for noise immunity.
It supports continuous conversion mode by default and enters shutdown on receipt of FFh command, reducing quiescent current to 12 μA typ. The device outputs manufacturer ID (0x81) in shutdown and provides read-only temperature and ID registers alongside a write-only configuration register.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Resolution | 11-bit two's complement output (10 bits + sign); LSB = 0.25°C - enables precise thermal threshold detection at system level. |
| Accuracy | ±2°C max over −40°C to +85°C - sufficient for non-critical thermal protection in PC and office electronics. |
| Supply Voltage | 2.65V to 5.5V - compatible with 3.3V and 5V logic domains without level-shifting. |
| Operating Current | 260 μA typ (active), 12 μA typ (shutdown) - supports battery-backed or low-power intermittent-read thermal monitoring. |
| Temperature Range | −55°C to +150°C - suitable for industrial and automotive under-hood environments where PCB temperature tracking is required. |
| Interface | SPI/MICROWIRE 3-wire (SI/O, SC, CS) - interoperable with standard MCU SPI peripherals without custom firmware drivers. |
| Conversion Time | 210 ms max - defines minimum polling interval for real-time thermal response in closed-loop control. |
Pinout & Package
VSSOP-8 package (Package Drawing DGK), 3.0 mm × 3.0 mm × 1.0 mm body, exposed pad not electrically connected, moisture sensitivity level 1 (unlimited floor life at <30°C/60% RH).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SI/O | Serial I/O bidirectional data line | Tri-state capable; transmits temperature data on falling SC edge, receives commands on rising SC edge - eliminates need for separate SDI/SDO lines. |
| SC | Serial clock input | Schmitt-triggered; accepts 0.16 μs min period - tolerant of noisy clock sources in embedded systems. |
| GND | Power supply ground | Primary thermal path to die; connects directly to backside of silicon - critical for accurate PCB temperature measurement. |
| V+ | Positive supply voltage | Accepts 2.65V–5.5V; requires 0.1 μF ceramic bypass capacitor - supports direct connection to MCU LDO outputs. |
| CS | Chip select input | Active-low; initiates communication and controls tri-state behavior of SI/O - enables multi-drop bus sharing with other SPI peripherals. |
| NC | No connect | Pins 3, 6, 8 are unconnected internally - must be left floating or tied to GND per layout best practice; no routing required. |
Key Features
| Feature | Design Value |
|---|---|
| 0.25°C temperature resolution | Enables fine-grained thermal event detection (e.g., fan speed ramping at 1°C increments) without oversampling or post-processing. |
| Shutdown mode <12 μA | Allows periodic wake-up sampling in energy-constrained applications such as portable instrumentation or remote sensors. |
| SPI/MICROWIRE compatibility | Eliminates need for protocol translation logic; works natively with STM32, MSP430, and PIC SPI modules using standard frame formats. |
| VSSOP-8 space-saving footprint | Reduces PCB area vs SOIC-8 by >50%; compatible with automated SMT assembly and reflow profiles (MSL Level-1). |
| UL recognition | Validates safety compliance for end equipment certification in consumer and industrial thermal management systems. |
Applications
| Hard Disk Drive Thermal Monitoring | Industrial PLC Temperature Sensing |
|---|---|
Use Scenario: Real-time spindle motor and controller IC temperature tracking inside 2.5" and 3.5" HDD enclosures. IC Role / Device Role / Timing Role: Die-temperature sensor reporting via SPI to host controller every 500 ms during active operation. Use Value: Prevents thermal throttling and head crash events by triggering firmware-based spin-down when local PCB temperature exceeds 70°C. | Use Scenario: Ambient and power-stage temperature monitoring in DIN-rail mounted programmable logic controllers. IC Role / Device Role / Timing Role: Local thermal node interfaced to ARM Cortex-M4 MCU via GPIO-controlled SPI bus. Use Value: Enables predictive maintenance alerts and derating of I/O module current limits based on measured enclosure temperature drift. |
| Office Printer Engine Control | Embedded PC Fan Speed Regulation |
Use Scenario: Fuser assembly and toner cartridge temperature feedback in laser printers and multifunction devices. IC Role / Device Role / Timing Role: SPI-connected sensor providing 0.25°C-resolution readings to printer SoC for closed-loop fuser heater control. Use Value: Maintains consistent toner melt temperature across varying ambient conditions, improving print quality and reducing warm-up time. | Use Scenario: CPU and GPU heatsink temperature acquisition in compact embedded PCs and fanless mini-ITX systems. IC Role / Device Role / Timing Role: Direct-soldered VSSOP-8 sensor on motherboard near VRM and chipset thermal pads. Use Value: Delivers accurate board-local temperature data for dynamic PWM fan control, reducing acoustic noise while preventing thermal shutdown. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar digital temperature sensor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM70CILD-5/NOPB | Same electrical specs; WSON-8 (2mm × 2mm) instead of VSSOP-8 - 44% smaller footprint, higher thermal resistance (θJA = 51.3°C/W vs 200°C/W). | Better suited for space-constrained designs where PCB thermal mass is low and die-to-ambient conduction dominates. | Select LM70CILD-5/NOPB only if board area is critical and thermal coupling to PCB copper is limited. |
| MAX6602ESA+ | I²C interface (not SPI), 11-bit resolution, ±2°C accuracy (−40°C to +125°C), 3.0V–5.5V supply, 250 μA operating current. | Requires I²C master; lacks shutdown mode; different register map and command structure - firmware porting effort required. | Choose MAX6602ESA+ only when existing I²C bus infrastructure exists and SPI resource allocation is constrained. |
Compared with LM70CIMMX-5, LM70CILD-5/NOPB offers superior board-area efficiency but reduced thermal tracking fidelity due to lower PCB thermal coupling, while MAX6602ESA+ trades SPI simplicity for I²C compatibility at the cost of firmware adaptation and missing shutdown capability.
Availability
LM70CIMMX-5 is available at Aetrix Electronics and suitable for hard disk drive thermal management, industrial PLC temperature sensing, office printer engine control, embedded PC fan regulation, and electronic test equipment requiring stable component supply across extended temperature ranges.
Supply support for LM70CIMMX-5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in precision sensing, power management, and interface solutions.
The LM70 product line was designed specifically for low-cost, high-accuracy digital temperature monitoring in space- and power-constrained embedded systems - emphasizing SPI compatibility, wide operating range, and minimal external component count.
FAQ
What is the maximum operating temperature specification for the LM70CIMMX-5?
The LM70CIMMX-5 is rated for continuous operation from −55°C to +150°C. At the upper limit, temperature accuracy degrades to +3.5°C/−2.0°C maximum error. This extended range makes LM70CIMMX-5 suitable for under-hood automotive electronics and industrial motor control applications where ambient heat exposure is significant.
Does the LM70CIMMX-5 require external calibration or trimming?
No, the LM70CIMMX-5 is factory-calibrated and requires no external calibration. Its temperature error specifications (e.g., ±2°C max from −40°C to +85°C) are guaranteed over process, voltage, and temperature - eliminating the need for system-level compensation routines or lookup tables in most applications.
How does the LM70CIMMX-5 enter and exit shutdown mode?
The LM70CIMMX-5 enters shutdown mode by receiving an 8-bit command of 0xFF on the SI/O line during the receive phase of SPI communication. It exits shutdown automatically upon receiving any command other than 0xFF (e.g., 0x00). Shutdown reduces current draw to 12 μA typ, and the device remains responsive to SPI commands while in this state.
Can the LM70CIMMX-5 be used with a 3.3V microcontroller SPI interface?
Yes, the LM70CIMMX-5 supports 2.65V–5.5V supply voltage and has CMOS-compatible logic thresholds (VIH = 0.7×V+, VIL = 0.3×V+). When powered from 3.3V, it interfaces directly with 3.3V SPI peripherals without level shifters - SI/O, SC, and CS signals meet timing and voltage requirements per the datasheet.
What is the meaning of "LM70CIMMX-5" in the part number breakdown?
In LM70CIMMX-5: "LM70" is the base device family; "C" denotes commercial temperature grade (−40°C to +85°C qualified); "I" indicates VSSOP package; "MM" specifies tape-and-reel packaging (3500 units/reel); "X" means lead-free (RoHS-compliant); "-5" designates the 4.5V–5.5V optimized version with tighter accuracy specs in that supply range - confirmed in SNIS112G datasheet Section 6.3.
LM70CIMMX-5 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Sensor Type:
- Digital, Local
- Sensing Temperature - Local:
- -55°C ~ 150°C
- Sensing Temperature - Remote:
- -
- Output Type:
- SPI
- Voltage - Supply:
- 2.65V ~ 5.5V
- Resolution:
- 10 b
- Features:
- Shutdown Mode
- Accuracy - Highest (Lowest):
- 1.5°C (-2°C, 3°C)
- Test Condition:
- -10°C ~ 65°C (-55°C ~ 150°C)
- Operating Temperature:
- -55°C ~ 150°C
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 8-VSSOP
LM70CIMMX-5 FAQ
1.How can I place an order for LM70CIMMX-5 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM70CIMMX-5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM70CIMMX-5 reliable?
The price and inventory of LM70CIMMX-5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM70CIMMX-5 is usually 5 days.
3.What payment methods are accepted for LM70CIMMX-5?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM70CIMMX-5 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM70CIMMX-5?
LM70CIMMX-5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM70CIMMX-5 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM70CIMMX-5?
For technical support, including LM70CIMMX-5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM70CIMMX-5 requirements.
6.How does Aetrix verify that LM70CIMMX-5 is sourced from the original manufacturer or authorized distributors?
All LM70CIMMX-5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM70CIMMX-5 meets industry standards.
7.What is the process for return or replacement of LM70CIMMX-5?
All LM70CIMMX-5 units undergo pre-shipment inspection (PSI). If there is an issue with LM70CIMMX-5, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM70CIMMX-5 part is unused and in its original packaging.
Return procedure for LM70CIMMX-5:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LM70CIMMX-5 Tags

-
MCP9700T-E/TT
Microchip Technology

-
MCP9700T-E/LT
Microchip Technology

-
MCP9701T-E/TT
Microchip Technology

-
MCP9701T-E/LT
Microchip Technology

-
TMP235A4DBZR
Texas Instruments

-
MCP9700AT-E/TT
Microchip Technology

-
MCP9700AT-E/LT
Microchip Technology

-
MCP9701AT-E/LT
Microchip Technology

-
MCP9701AT-E/TT
Microchip Technology
,TO-226_straightlead.jpg)
-
LM335Z
STMicroelectronics
-
TMP1075NDRLR
Texas Instruments
-
TMP1075DGKR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

