NXP Semiconductors LM75ADP/DG,118
- Part No.:
- LM75ADP/DG,118
- Manufacturer:
- NXP Semiconductors
- Category:
- Analog and Digital Output
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
LM75ADP/DG,118.pdf
- Description:
- SENSOR DIGITAL -55C-125C 8TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
LM75ADP/DG,118 from NXP Semiconductors is a digital temperature sensor and thermal watchdog IC featuring an on-chip bandgap sensor and 11-bit sigma-delta ADC, delivering 0.125 °C temperature resolution over −55 °C to +125 °C. It provides programmable overtemperature shutdown (Tos = 80 °C default), hysteresis (Thyst = 75 °C default), and open-drain OS output with comparator or interrupt mode-used in PC thermal management, industrial controllers, and embedded system protection.
For engineers reviewing the LM75ADP/DG,118 datasheet, LM75ADP/DG,118 pinout, LM75ADP/DG,118 application, or LM75ADP/DG,118 equivalent, key selection criteria include I²C-bus compatibility (up to 8 devices), TSSOP8 package footprint, ±2 °C accuracy from −25 °C to +100 °C, 3.5 µA shutdown current, and configurable OS fault queue (1–6 consecutive faults).
Technical Context
The LM75ADP/DG,118 implements a sigma-delta A-to-D conversion architecture with internal bandgap reference and oscillator, performing temperature measurements every 100 ms in normal mode. Its 11-bit temperature register stores 2's complement data with 0.125 °C LSB, while Tos and Thyst registers use 9-bit 2's complement format (0.5 °C LSB) for comparison logic.
OS output behavior is determined by configuration bits: B1 selects comparator vs. interrupt mode; B2 sets active-HIGH/LOW polarity; B3–B4 define fault queue depth (1/2/4/6 conversions); and B0 controls normal/shutdown operation. The device powers up with Tos = 80 °C, Thyst = 75 °C, OS comparator mode, active-LOW, and fault queue = 1.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Temperature Range | −55 °C to +125 °C - supports operation in harsh industrial and automotive under-hood environments. |
| Resolution | 0.125 °C - enables precise detection of thermal drift in CPU/GPU thermal monitoring and power supply derating. |
| Accuracy | ±2 °C (−25 °C to +100 °C) - meets requirements for closed-loop fan control and system-level thermal throttling. |
| Supply Voltage | 2.8 V to 5.5 V - compatible with 3.3 V and 5 V logic domains without level-shifting. |
| Shutdown Current | 3.5 µA - allows integration into battery-backed systems and low-power IoT edge nodes. |
| I²C Address Pins | A0–A2 - enable up to eight LM75ADP/DG,118 devices on one bus, simplifying multi-zone thermal sensing. |
| OS Output Type | Open-drain - permits wired-OR connection to shared interrupt lines and flexible pull-up voltage selection (up to 5.5 V). |
Pinout & Package
TSSOP8 package (SOT505-1), 3 mm body width, 0.65 mm pitch - surface-mount compatible with standard reflow profiles and space-constrained PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1: SDA | I²C bidirectional data line | Open-drain interface requiring external pull-up; supports standard/fast-mode I²C up to 400 kHz. |
| 2: VCC | Power supply input | Accepts 2.8–5.5 V; decoupling capacitor (0.1 µF) required per typical application circuit. |
| 3: SCL | I²C clock input | Input-only; requires external pull-up; VIH ≥ 0.7×VCC ensures reliable clock edge detection. |
| 4: A0 | Address bit 0 | Logic level defines LSB of 7-bit I²C slave address (1001xxx); must be tied HIGH/LOW, not floating. |
| 5: OS | Overtemperature shutdown output | Open-drain alert signal; sinks up to 10 mA; requires external pull-up (10 kΩ typical) to monitor thermal events. |
| 6: A1 | Address bit 1 | Second address bit; combined with A0/A2 to select one of eight unique I²C addresses on shared bus. |
| 7: GND | Ground reference | System ground return path; must be low-impedance connection to minimize measurement error. |
| 8: A2 | Address bit 2 | MSB of address bits; completes 3-bit address extension for multi-device I²C topology. |
Key Features
| Feature | Design Value |
|---|---|
| Pin-compatible upgrade to LM75 | Maintains identical TSSOP8 footprint and I²C protocol while improving resolution from 0.5 °C to 0.125 °C. |
| Configurable OS response mode | Comparator mode provides thermostat-like hysteresis control; interrupt mode delivers latched alerts until register read. |
| Programmable fault queue | Prevents false triggers by requiring 1–6 consecutive out-of-limit readings before asserting OS output. |
| Stand-alone thermostat at power-up | Operates immediately with Tos = 80 °C / Thyst = 75 °C-no host initialization needed for basic thermal protection. |
| ESD robustness | 2000 V HBM rating enables handling in standard assembly environments without special ESD controls. |
Applications
| Server Rack Thermal Monitoring | Industrial PLC Temperature Guarding |
|---|---|
Use Scenario: Real-time ambient and component temperature tracking across multiple blades in a 19-inch server rack. IC Role / Device Role / Timing Role: Digital temperature sensor providing I²C-accessible 0.125 °C-resolution readings to BMC firmware for dynamic fan speed control and alarm escalation. Use Value: Enables precise thermal margining and early warning of cooling failure using pre-programmed Tos/Thyst thresholds without host CPU intervention. | Use Scenario: Overtemperature protection for motor drive modules and I/O expansion units in factory automation cabinets. IC Role / Device Role / Timing Role: Thermal watchdog asserting OS output to disable power stages when enclosure temperature exceeds safe limits. Use Value: Prevents thermal runaway via hardware-latched OS interrupt mode, ensuring fail-safe shutdown even during firmware hangs. |
| Embedded Edge Gateway Thermal Management | Network Switch ASIC Junction Monitoring |
Use Scenario: Compact gateway devices with limited airflow require accurate die temperature estimation for thermal throttling decisions. IC Role / Device Role / Timing Role: Local temperature sensor placed near processor SoC, reporting via I²C to Linux thermal framework for passive/active cooling policies. Use Value: High resolution (0.125 °C) detects subtle thermal gradients critical for predictive thermal management in fanless designs. | Use Scenario: Monitoring junction temperature of high-speed Ethernet switch ASICs where thermal hotspots impact packet latency and BER. IC Role / Device Role / Timing Role: Secondary thermal sensor adjacent to ASIC package, feeding real-time data to switch controller for adaptive link rate reduction. Use Value: Tight ±2 °C accuracy over −25 °C to +100 °C ensures reliable correlation between sensed ambient and actual die temperature. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar digital temperature sensor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STLM75DT | Same 0.125 °C resolution and TSSOP8 package; ±2 °C accuracy over −25 °C to +100 °C; identical I²C address scheme (1001xxx). | Pinout matches LM75ADP/DG,118; supports same OS comparator/interrupt modes and fault queue programming. | Drop-in replacement with identical register map and timing-ideal for dual-sourcing and second-source qualification. |
| MAX31826ATM+ | Higher accuracy (±1 °C) and integrated 1-Wire interface instead of I²C; includes built-in EEPROM for calibration offsets and user configuration storage. | Requires 1-Wire master instead of I²C controller; no native OS output-thermal alert must be polled or implemented in firmware. | Preferred when higher accuracy or non-volatile configuration retention is required, but mandates interface redesign and firmware adaptation. |
Compared with STLM75DT, LM75ADP/DG,118 offers identical functionality and drop-in compatibility; versus MAX31826ATM+, it provides simpler I²C integration and hardware OS signaling but trades off absolute accuracy and non-volatile storage.
Availability
LM75ADP/DG,118 is available at Aetrix Electronics and suitable for server rack thermal monitoring, industrial PLC guarding, and embedded edge gateway thermal management requiring stable component supply across extended product lifecycles.
Supply support for LM75ADP/DG,118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The LM75A product line was designed as a precision, low-power digital temperature sensor family targeting thermal management in resource-constrained embedded systems-emphasizing I²C simplicity, hardware-based thermal alerting, and wide industrial temperature range compliance.
FAQ
What is the default power-up configuration of the LM75ADP/DG,118?
At power-up, the LM75ADP/DG,118 initializes in normal operation mode with OS comparator mode enabled, Tos set to 80 °C, Thyst to 75 °C, OS active-LOW, and fault queue = 1. The temperature register begins conversion after ~100 ms and is ready for readout. This allows immediate stand-alone thermostat operation without host initialization-critical for safety-critical thermal guardrails in the LM75ADP/DG,118.
How does the LM75ADP/DG,118 handle I²C bus contention with multiple devices?
The LM75ADP/DG,118 uses three hardware address pins (A2–A0) to generate a unique 7-bit I²C slave address (1001xxx), supporting up to eight devices on the same bus without software arbitration. Each pin must be hard-wired to VCC or GND-floating inputs are prohibited. This deterministic addressing eliminates bus collisions and simplifies multi-sensor thermal mapping in systems using the LM75ADP/DG,118.
Can the LM75ADP/DG,118 operate reliably at 2.8 V supply?
Yes-the LM75ADP/DG,118 is fully specified from 2.8 V to 5.5 V. At 2.8 V, it maintains ±2 °C accuracy (−25 °C to +100 °C), 100 ms conversion time, and functional I²C communication. Supply current remains ≤100 µA in normal mode, making it suitable for low-voltage battery-powered applications where the LM75ADP/DG,118 delivers consistent thermal sensing performance.
What is the maximum sink current capability of the OS output on the LM75ADP/DG,118?
The OS output of the LM75ADP/DG,118 is rated for up to 10 mA sink current per Absolute Maximum Ratings (Table 15). In typical operation with a 10 kΩ pull-up to 3.3 V, it delivers ~0.33 mA-well within safe operating limits. This ensures robust interfacing with microcontroller interrupt inputs, optocouplers, or discrete transistor switches in thermal protection circuits using the LM75ADP/DG,118.
Does the LM75ADP/DG,118 support both comparator and interrupt modes for the OS output?
Yes-the LM75ADP/DG,118 supports two distinct OS output behaviors via Configuration Register bit B1. Comparator mode toggles OS based on Tos/Thyst hysteresis (like a hardware thermostat), while interrupt mode latches OS active until any register is read. Both modes are fully programmable and retain state through shutdown, enabling flexible thermal alert strategies in systems deploying the LM75ADP/DG,118.
LM75ADP/DG,118 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Sensor Type:
- Digital, Local
- Sensing Temperature - Local:
- -55°C ~ 125°C
- Sensing Temperature - Remote:
- -
- Output Type:
- I2C
- Voltage - Supply:
- 2.8V ~ 5.5V
- Resolution:
- 11 b
- Features:
- Output Switch, Programmable Limit, Programmable Resolution, Shutdown Mode
- Accuracy - Highest (Lowest):
- ±2°C (±3°C)
- Test Condition:
- -25°C ~ 100°C (-55°C ~ 125°C)
- Operating Temperature:
- -55°C ~ 125°C
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 8-TSSOP
LM75ADP/DG,118 FAQ
1.How can I place an order for LM75ADP/DG,118 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM75ADP/DG,118 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM75ADP/DG,118 reliable?
The price and inventory of LM75ADP/DG,118 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM75ADP/DG,118 is usually 5 days.
3.What payment methods are accepted for LM75ADP/DG,118?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM75ADP/DG,118 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM75ADP/DG,118?
LM75ADP/DG,118 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM75ADP/DG,118 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM75ADP/DG,118?
For technical support, including LM75ADP/DG,118 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM75ADP/DG,118 requirements.
6.How does Aetrix verify that LM75ADP/DG,118 is sourced from the original manufacturer or authorized distributors?
All LM75ADP/DG,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM75ADP/DG,118 meets industry standards.
7.What is the process for return or replacement of LM75ADP/DG,118?
All LM75ADP/DG,118 units undergo pre-shipment inspection (PSI). If there is an issue with LM75ADP/DG,118, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM75ADP/DG,118 part is unused and in its original packaging.
Return procedure for LM75ADP/DG,118:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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