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NXP Semiconductors LM75BDP/DG,118

Part No.:
LM75BDP/DG,118
Manufacturer:
NXP Semiconductors
Category:
Analog and Digital Output
Package:
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Datasheet:
AetrixLM75BDP/DG,118.pdf
Description:
SENSOR DIGITAL -55C-125C 8TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,727

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Product details

Overview

LM75BDP/DG,118 from NXP Semiconductors is a digital temperature sensor and thermal watchdog IC featuring an on-chip bandgap sensor, 11-bit sigma-delta ADC, I²C-bus interface, open-drain OS output, and programmable overtemperature shutdown with hysteresis - used for ambient temperature monitoring and system-level thermal protection in embedded controllers.

For engineers reviewing the LM75BDP/DG,118 datasheet, LM75BDP/DG,118 pinout, LM75BDP/DG,118 application, or LM75BDP/DG,118 equivalent, key selection considerations include its 0.125 °C resolution, −55 °C to +125 °C operating range, 2.8 V–5.5 V supply, TSSOP8 package, and configurable OS comparator/interrupt mode with fault queue.

Technical Context

The LM75BDP/DG,118 implements a sigma-delta A-to-D converter with 100 ms conversion period and 10 ms active conversion time, enabling low-power periodic sensing without bus interference. Its I²C interface supports up to 400 kHz clock rate and includes bus fault timeout (50 ms min) to prevent lockup.

Temperature data is stored in an 11-bit two's complement Temp register (0.125 °C resolution), while Tos and Thyst set-point registers use 9-bit two's complement format (0.5 °C resolution) for overtemperature threshold and hysteresis comparison - with only the 9 MSB of Temp used during comparison logic.

Key Specifications

Parameter Value and Actual Design Meaning
Temp resolution 0.125 °C - enables precise detection of thermal drift or runaway in sensitive analog/RF subsystems
Operating range −55 °C to +125 °C - qualified for industrial and extended-temperature embedded applications
Accuracy ±2 °C (−25 °C to +100 °C); ±3 °C (full range) - meets thermal management requirements for PC and controller thermal throttling
Supply voltage 2.8 V to 5.5 V - compatible with 3.3 V and 5 V logic domains without level-shifting
Shutdown current 1.0 μA - allows battery-backed systems to retain thermal monitoring capability with negligible drain
I²C address options 8 unique addresses via A2/A1/A0 pins - supports multi-sensor thermal mapping on single bus
OS response modes Configurable comparator or interrupt mode - enables direct fan control or host CPU interrupt signaling

Pinout & Package

TSSOP8 package (SOT505-1), 3 mm × 3 mm body, 0.65 mm pitch, lead-free, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
1 - SDA I²C bidirectional data line Open-drain; requires external pull-up; supports multi-master arbitration and clock stretching
2 - VCC Power supply input 2.8 V–5.5 V operation; decoupling capacitor recommended near pin for noise immunity
3 - SCL I²C serial clock input Input-only; accepts 20 Hz–400 kHz; internal bus fault timeout prevents hang on SDA low
4 - A0 Address bit 0 Logic level sets LSB of 7-bit slave address (1001xxx); must be tied HIGH or LOW - no floating
5 - OS Overtemperature shutdown output Open-drain; active-low by default; configurable polarity and fault queue (1/2/4/6 consecutive trips)
6 - A1 Address bit 1 Second LSB of slave address; determines unique I²C address among up to eight devices
7 - GND Ground reference System ground return path; must be low-impedance connection to minimize measurement error
8 - A2 Address bit 2 MSB of address bits; completes 3-bit address field (A2A1A0) for full 8-device addressing

Key Features

Feature Design Value
Stand-alone thermostat at power-up Defaults to normal mode, 80 °C shutdown / 75 °C hysteresis - enables immediate thermal protection without host initialization
Programmable OS fault queue 1/2/4/6 consecutive overtemperature events required before OS assertion - suppresses false triggers from transient noise
I²C bus fault recovery Automatic reset if SDA held low >50 ms - eliminates need for host-side bus reset logic or watchdog intervention
Low-power shutdown mode 1.0 μA quiescent current with full I²C register access retained - ideal for always-on thermal supervision in energy-constrained systems
ESD robustness 4500 V HBM / 1000 V CDM - withstands handling and board-level ESD events without latch-up or parameter shift

Applications

Server CPU Thermal Monitoring Industrial PLC Temperature Guarding

Use Scenario: Real-time die temperature tracking for x86/ARM server CPUs with dynamic thermal throttling.

IC Role / Device Role / Timing Role: Primary ambient temperature sensor feeding thermal management firmware; OS output directly drives hardware throttle enable.

Use Value: 0.125 °C resolution enables accurate modeling of thermal gradient across multi-core dies, improving throttling precision and performance retention.

Use Scenario: Overtemperature detection in programmable logic controller cabinets exposed to variable ambient conditions.

IC Role / Device Role / Timing Role: Standalone thermal watchdog asserting OS signal to cut power to motor drivers upon sustained overheating.

Use Value: Preconfigured 80 °C/75 °C thresholds at power-up provide immediate protection without firmware dependency - critical for safety-critical automation.

Embedded Network Switch Fan Control Medical Diagnostic Equipment Thermal Safety

Use Scenario: Closed-loop fan speed control based on switch ASIC junction temperature in Layer 3 switches.

IC Role / Device Role / Timing Role: I²C-accessible sensor providing real-time temp data to MCU; OS output triggers emergency fan ramp-up.

Use Value: Configurable OS interrupt mode allows host to log trip events and initiate diagnostics before thermal shutdown - reducing unplanned downtime.

Use Scenario: Thermal interlock for X-ray generator power supplies where overheating risks component failure or patient exposure.

IC Role / Device Role / Timing Role: Redundant thermal sensor with independent OS output wired to safety relay - failsafe shutdown path outside main control loop.

Use Value: −55 °C to +125 °C rating ensures reliable operation under sterilization cycles and high-power burst modes without calibration drift.

Equivalent & Alternatives

The following parts are listed as comparable options for similar digital temperature sensor applications.

Alternative Part Technical Difference Application Difference Selection Advice
LM75BD,118 SO8 package (SOT96-1); same electrical specs and register map; 3.9 mm body width vs. TSSOP8's 3.0 mm Preferred for through-hole prototyping or legacy PCBs with SO8 footprints; higher thermal resistance than TSSOP8 Select LM75BD,118 when board layout uses SO8 land pattern or requires greater mechanical robustness in vibration-prone environments.
LM75BTP,147 HWSON8 package (SOT1069-2); 2 mm × 3 mm, thermal-enhanced; identical functionality and timing Better thermal coupling to PCB; lower θJA enables faster response in sealed enclosures or high-power density designs Choose LM75BTP,147 for space-constrained medical or telecom modules where thermal responsiveness and footprint size are critical.

Compared with LM75BDP/DG,118, the LM75BD,118 offers identical performance in a larger SO8 package suited for manual assembly and thermal margin, while the LM75BTP,147 delivers superior thermal performance in a smaller, thermally optimized HWSON8 package - both share full register compatibility and pinout alignment within their respective packages.

Availability

LM75BDP/DG,118 is available at Aetrix Electronics and suitable for industrial controllers, embedded network switches, and medical diagnostic equipment requiring stable component supply across long production lifecycles.

Supply support for LM75BDP/DG,118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in mixed-signal and sensor integration.

The LM75B product line was designed specifically for embedded thermal management - delivering high-resolution, I²C-compatible temperature sensing with autonomous watchdog capability in compact, industry-standard packages.

FAQ

What is the default power-up configuration of the LM75BDP/DG,118?

At power-up, the LM75BDP/DG,118 initializes in normal operation mode with OS comparator mode enabled, OS active low, Tos = 80 °C, Thyst = 75 °C, and fault queue = 1. This allows immediate stand-alone thermostat operation without host initialization. The first temperature reading after power-up is invalid and must be discarded; subsequent reads reflect accurate conversions updated every 100 ms.

How does the LM75BDP/DG,118 handle I²C bus faults?

The LM75BDP/DG,118 incorporates built-in bus fault timeout: if SDA remains low for >50 ms, the device automatically resets its I²C interface to idle state and releases SDA, preventing bus lockup. This feature eliminates the need for external bus recovery circuitry and ensures robust communication in noisy industrial environments where the LM75BDP/DG,118 is commonly deployed.

Can the LM75BDP/DG,118 operate from a 3.3 V supply?

Yes, the LM75BDP/DG,118 operates across 2.8 V to 5.5 V, making it fully compatible with standard 3.3 V logic systems. Its I²C interface functions correctly at 3.3 V with appropriate pull-up resistors (typically 10 kΩ), and all specifications - including accuracy, resolution, and OS timing - are guaranteed across this entire voltage range per the official NXP datasheet Rev. 6.1.

What is the meaning of "TSSOP8" in the LM75BDP/DG,118 package designation?

TSSOP8 refers to the LM75BDP/DG,118's plastic thin shrink small outline package with 8 leads and 3.0 mm body width (SOT505-1). It features gull-wing leads, 0.65 mm pitch, and is RoHS-compliant. This package provides better thermal performance and smaller footprint than SO8, while remaining compatible with standard SMT reflow processes - a key reason for selecting LM75BDP/DG,118 in space-constrained industrial designs.

How does the OS output behave in comparator versus interrupt mode on the LM75BDP/DG,118?

In comparator mode, the LM75BDP/DG,118's OS output asserts when temperature exceeds Tos and de-asserts when it falls below Thyst - behaving like a hardware thermostat. In interrupt mode, OS asserts on Tos crossing and remains asserted until any register is read, enabling host-driven event logging. Both modes support programmable polarity and fault queue, but only interrupt mode requires software interaction to clear the OS flag.

LM75BDP/DG,118 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Sensor Type:
Digital, Local
Sensing Temperature - Local:
-55°C ~ 125°C
Sensing Temperature - Remote:
-
Output Type:
I2C
Voltage - Supply:
2.8V ~ 5.5V
Resolution:
11 b
Features:
Output Switch, Programmable Limit
Accuracy - Highest (Lowest):
±2°C (±3°C)
Test Condition:
-25°C ~ 100°C (-55°C ~ 125°C)
Operating Temperature:
-55°C ~ 125°C
Mounting Type:
Surface Mount
Grade:
-
Qualification:
-
Supplier Device Package:
8-TSSOP

LM75BDP/DG,118 FAQ

1.How can I place an order for LM75BDP/DG,118 through Aetrix?

Please submit a Request for Quotation (RFQ) for LM75BDP/DG,118 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LM75BDP/DG,118 reliable?

The price and inventory of LM75BDP/DG,118 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM75BDP/DG,118 is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM75BDP/DG,118 transactions.

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LM75BDP/DG,118 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LM75BDP/DG,118 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LM75BDP/DG,118?

For technical support, including LM75BDP/DG,118 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM75BDP/DG,118 requirements.

6.How does Aetrix verify that LM75BDP/DG,118 is sourced from the original manufacturer or authorized distributors?

All LM75BDP/DG,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM75BDP/DG,118 meets industry standards.

7.What is the process for return or replacement of LM75BDP/DG,118?

All LM75BDP/DG,118 units undergo pre-shipment inspection (PSI). If there is an issue with LM75BDP/DG,118, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LM75BDP/DG,118 part is unused and in its original packaging.

Return procedure for LM75BDP/DG,118:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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