My Inquiry
My Account
NXP Semiconductors LM75BGD,125
- Part No.:
- LM75BGD,125
- Manufacturer:
- NXP Semiconductors
- Category:
- Analog and Digital Output
- Package:
- 8-XFDFN
- Datasheet:
-
LM75BGD,125.pdf
- Description:
- SENSOR DGTL -55C-125C 8XSON
- Quantity:
- Payment:
- Shipping:
Inventory:1,795
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LM75BGD,125 from NXP Semiconductors is a digital temperature sensor and thermal watchdog IC featuring an on-chip band gap sensor, 11-bit sigma-delta ADC, I²C-bus interface, open-drain OS output, and programmable overtemperature shutdown with hysteresis - used for ambient temperature monitoring and system-level thermal protection in embedded controllers and PC motherboards.
For engineers reviewing the LM75BGD,125 datasheet, LM75BGD,125 pinout, LM75BGD,125 application, or LM75BGD,125 equivalent, key selection criteria include its 0.125 °C resolution, −55 °C to +125 °C operating range, 2.8–5.5 V supply, XSON8U package, and configurable OS comparator/interrupt mode with fault queue.
Technical Context
The LM75BGD,125 implements a dedicated sigma-delta A/D converter with 100 ms conversion period and 10 ms active conversion time, enabling low-power periodic thermal sampling without bus interference. Its I²C interface supports up to 400 kHz operation with built-in 50 ms bus fault timeout to prevent lockup.
Thermal decision logic compares the 11-bit temperature register (0.125 °C resolution) against 9-bit Tos/Thyst set-point registers using only the 9 MSBs; OS output behavior is fully configurable via the Configuration register (B0: shutdown, B1: comparator/interrupt, B2: polarity, B3–B4: fault queue = 1/2/4/6).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Temperature Range | −55 °C to +125 °C - full specification across industrial and extended commercial environments |
| Resolution | 0.125 °C - enables precise detection of thermal drift or small ambient shifts |
| Accuracy | ±2 °C (−25 °C to +100 °C); ±3 °C (−55 °C to +125 °C) - calibrated performance over defined ranges |
| Supply Voltage | 2.8 V to 5.5 V - single-supply compatibility with 3.3 V and 5 V logic domains |
| Shutdown Current | 1.0 μA - enables ultra-low-power thermal monitoring during system sleep states |
| I²C Bus Speed | 20 Hz to 400 kHz - supports standard and fast-mode I²C timing with bus fault recovery |
| OS Output Type | Open-drain - allows wired-OR configuration with external pull-up for flexible voltage-level interfacing |
Pinout & Package
LM75BGD,125 is housed in an 8-terminal XSON8U package (3 mm × 2 mm × 0.5 mm), leadless, UTLP-based, with wettable flank side walls for automated optical inspection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1: SDA | I²C bidirectional data line | Open-drain interface requiring external pull-up; supports multi-master arbitration and clock stretching |
| 2: SCL | I²C serial clock input | Asynchronous edge-triggered clock; tolerates 400 kHz max frequency with internal fault timeout |
| 3: OS | Overtemperature shutdown output | Configurable as comparator or interrupt; active LOW/HIGH; requires external pull-up resistor (≤200 kΩ) |
| 4: GND | Ground reference | Primary return path for analog and digital sections; must be connected to system ground plane |
| 5: A2 | I²C slave address bit 2 | Logic level sets LSB of 7-bit slave address (1001xxx); must not float - tie to VCC or GND |
| 6: A1 | I²C slave address bit 1 | Second LSB of slave address; enables up to eight LM75BGD,125 devices on same I²C bus |
| 7: A0 | I²C slave address bit 0 | Third LSB of slave address; combined with A1/A2 defines unique I²C address per device |
| 8: VCC | Power supply input | Accepts 2.8–5.5 V; bypass capacitor (≥100 nF) required near pin for noise immunity |
Key Features
| Feature | Design Value |
|---|---|
| Pin-compatible upgrade | Direct replacement for LM75/LM75A with identical pinout and register map, plus improved 0.125 °C resolution |
| Programmable thermal thresholds | Tos (shutdown) and Thyst (hysteresis) registers allow user-defined trip points from −55 °C to +125 °C in 0.5 °C steps |
| Configurable OS response | Selectable comparator mode (thermostat-style latching) or interrupt mode (one-shot pulse requiring register read to clear) |
| Fault-tolerant operation | Programmable fault queue (1/2/4/6 consecutive trips) prevents false triggering from transient noise or measurement spikes |
| ESD robustness | 4500 V HBM / 1000 V CDM - meets JEDEC standards for handling in automated assembly lines |
Applications
| Server Thermal Management | Industrial PLC Monitoring |
|---|---|
Use Scenario: Real-time CPU/die temperature tracking and fan speed control in 1U rack servers. IC Role / Device Role / Timing Role: Digital temperature sensor providing 0.125 °C resolution readings every 100 ms to host BMC via I²C. Use Value: Enables precise thermal throttling before critical junction temperatures are exceeded, reducing thermal stress on processors. | Use Scenario: Ambient cabinet temperature supervision in programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: Standalone thermal watchdog with preconfigured 80 °C shutdown threshold and 75 °C hysteresis at power-up. Use Value: Prevents controller lockup due to overheating without firmware intervention - OS output directly disables power stage. |
| PC Motherboard Health Monitoring | Network Switch Thermal Protection |
Use Scenario: Multi-zone thermal sensing across VRMs, chipset, and memory modules on ATX motherboards. IC Role / Device Role / Timing Role: I²C slave device with three address pins allowing eight sensors on one bus for compact layout. Use Value: Eliminates need for discrete thermistors and ADCs - reduces BOM count and PCB area while improving calibration consistency. | Use Scenario: Overtemperature detection for PoE-powered switch ASICs operating in enclosed enclosures. IC Role / Device Role / Timing Role: Thermal watchdog with interrupt-mode OS output triggering hardware reset when die temperature exceeds safe limit. Use Value: Guarantees fail-safe recovery without software dependency - OS signal resets power management IC upon sustained overtemp condition. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar digital temperature sensor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM75BTP,147 | HWSON8 package (2 mm × 3 mm × 0.8 mm); enhanced thermal dissipation; production-tested down to −55 °C | Preferred for sub-zero ambient operation where LM75BGD,125 is not cold-temperature qualified | Select LM75BTP,147 when operating below 0 °C or when higher thermal conductivity is required |
| STTS751DT | 3.3 V-only supply (2.7–3.6 V); 0.0625 °C resolution; integrated EEPROM for calibration offsets | Higher precision and nonvolatile configuration storage; not pin-compatible | Choose STTS751DT when sub-0.125 °C resolution or field-programmable calibration is needed |
Compared with LM75BGD,125, LM75BTP,147 offers verified cold-temperature operation and better thermal resistance, while STTS751DT provides finer resolution and EEPROM-based calibration but requires board redesign due to different pinout and voltage range.
Availability
LM75BGD,125 is available at Aetrix Electronics and suitable for server thermal management, industrial PLC monitoring, and PC motherboard health monitoring requiring stable component supply across long-lifecycle embedded programs.
Supply support for LM75BGD,125 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The LM75B series is part of NXP's precision analog sensor portfolio, designed specifically for reliable, low-power thermal monitoring in space-constrained systems where I²C integration and programmable watchdog functionality are essential.
FAQ
What is the operating temperature range specified for LM75BGD,125?
The LM75BGD,125 is fully specified from −55 °C to +125 °C. However, NXP explicitly notes that LM75BGD units cannot undergo production cold-temperature testing due to manufacturing constraints. For applications requiring guaranteed operation below 0 °C, LM75BTP,147 is recommended instead of LM75BGD,125.
Does LM75BGD,125 support I²C fast-mode operation?
Yes, LM75BGD,125 supports I²C bus speeds up to 400 kHz, meeting Fast-mode specifications. It also includes a 50 ms bus fault timeout to release SDA if held low, preventing bus lockup - a critical feature for robust multi-device I²C systems using LM75BGD,125.
How does the OS output behave in comparator mode versus interrupt mode on LM75BGD,125?
In comparator mode, the OS output of LM75BGD,125 acts like a thermostat: it activates when temperature exceeds Tos and deactivates when it falls below Thyst. In interrupt mode, OS remains active until any register is read - making LM75BGD,125 suitable for event-driven thermal alerts requiring explicit software acknowledgment.
What is the default configuration of LM75BGD,125 at power-up?
At power-up, LM75BGD,125 initializes in normal operation mode, OS comparator mode, with Tos = 80 °C, Thyst = 75 °C, OS active LOW, and fault queue = 1. This allows LM75BGD,125 to function immediately as a standalone thermostat without host initialization.
Can LM75BGD,125 be used in place of the original LM75 without hardware changes?
Yes - LM75BGD,125 is a pin-for-pin and register-compatible replacement for LM75 and LM75A. It retains identical XSON8U footprint, I²C address structure, and register map, while adding 0.125 °C resolution and wider 2.8–5.5 V supply range - no PCB or firmware changes are needed to upgrade to LM75BGD,125.
LM75BGD,125 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 8-XFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Sensor Type:
- Digital, Local
- Sensing Temperature - Local:
- -55°C ~ 125°C
- Sensing Temperature - Remote:
- -
- Output Type:
- I2C
- Voltage - Supply:
- 2.8V ~ 5.5V
- Resolution:
- 11 b
- Features:
- Output Switch, Programmable Limit
- Accuracy - Highest (Lowest):
- ±2°C (±3°C)
- Test Condition:
- -25°C ~ 100°C (-55°C ~ 125°C)
- Operating Temperature:
- -55°C ~ 125°C
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 8-XSON, SOT996-2 (2x3)
LM75BGD,125 FAQ
1.How can I place an order for LM75BGD,125 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM75BGD,125 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM75BGD,125 reliable?
The price and inventory of LM75BGD,125 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM75BGD,125 is usually 5 days.
3.What payment methods are accepted for LM75BGD,125?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM75BGD,125 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM75BGD,125?
LM75BGD,125 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM75BGD,125 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM75BGD,125?
For technical support, including LM75BGD,125 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM75BGD,125 requirements.
6.How does Aetrix verify that LM75BGD,125 is sourced from the original manufacturer or authorized distributors?
All LM75BGD,125 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM75BGD,125 meets industry standards.
7.What is the process for return or replacement of LM75BGD,125?
All LM75BGD,125 units undergo pre-shipment inspection (PSI). If there is an issue with LM75BGD,125, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM75BGD,125 part is unused and in its original packaging.
Return procedure for LM75BGD,125:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LM75BGD,125 Tags
-
MCP9700T-E/TT
Microchip Technology
-
MCP9700T-E/LT
Microchip Technology
-
MCP9701T-E/TT
Microchip Technology
-
MCP9701T-E/LT
Microchip Technology
-
TMP235A4DBZR
Texas Instruments
-
MCP9700AT-E/TT
Microchip Technology
-
MCP9700AT-E/LT
Microchip Technology
-
MCP9701AT-E/LT
Microchip Technology
-
MCP9701AT-E/TT
Microchip Technology
,TO-226_straightlead.jpg)
-
LM335Z
STMicroelectronics
-
TMP1075NDRLR
Texas Instruments
-
TMP1075DGKR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
