Texas Instruments LMG3426R030RQZT
- Part No.:
- LMG3426R030RQZT
- Manufacturer:
- Texas Instruments
- Package:
- 54-VQFN Exposed Pad
- Datasheet:
-
LMG3426R030RQZT.pdf
- Description:
- 600V 50M GAN FET WITH INTEGRATED
- Quantity:
- Payment:

- Shipping:

Inventory:2,000
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Product details
Overview
LMG3426R030 from Texas Instruments is a 600V, 30mΩ GaN FET with integrated gate driver, cycle-by-cycle overcurrent protection (<100ns response), zero-voltage detection (ZVD), and digital temperature PWM reporting. It operates from 7.5V–18V supply, supports up to 2.2MHz switching, and delivers 20–150V/ns adjustable slew rate for EMI-optimized hard-switching in high-density PSUs.
For engineers reviewing the LMG3426R030 datasheet, LMG3426R030 pinout, LMG3426R030 application, or LMG3426R030 equivalent, this device enables rapid adoption of GaN in telecom rectifiers, server PSUs, and solar inverters-where fast fault response, precise thermal monitoring, and ZVS-enabling timing signals are critical selection criteria.
Technical Context
The LMG3426R030 integrates a silicon-based gate driver with precision bias regulation, enabling robust 600V GaN FET operation without external level-shifting. Its internal buck-boost converter generates VNEG (–14V) for reliable depletion-mode GaN turn-off, while the RDRV pin sets drive strength to tune slew rate from 20V/ns to 150V/ns via external resistor.
ZVD functionality provides a 75–140ns pulse on the dedicated ZVD pin when zero-voltage switching is detected-enabling real-time synchronization in resonant topologies. Fault handling includes latched short-circuit protection, self-monitoring OTP/UVLO, and push-pull FAULT output with <100ns overcurrent response.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS Rating | 600V continuous, withstands 720V surge during hard-switching-supports 48V–400V bus designs with margin. |
| RDS(on) | 35mΩ max at 25°C; increases to 45mΩ at 125°C-enables high-efficiency operation in 5–50A RMS power stages. |
| Slew Rate | Adjustable 20–150V/ns via RDRV pin-directly controls EMI profile and switching loss trade-off. |
| Switching Frequency | Up to 2.2MHz under soft-switched conditions-enables >1kW/in³ power density in compact converters. |
| Temperature Reporting | 9kHz PWM output with duty cycle encoding junction temperature (0.3% at 25°C → 82% at 150°C)-eliminates analog signal chain complexity. |
| Fault Response | <100ns overcurrent detection and 65–100ns short-circuit turn-off-prevents catastrophic failure in high-dI/dt systems. |
| ZVD Pulse | 75–140ns width, 15–30ns delay from IN rise-provides deterministic timing reference for ZVS control loops. |
Pinout & Package
LMG3426R030 uses a 54-pin VQFN (RQZ) package measuring 12.00mm × 12.00mm with exposed thermal pad. The low-inductance layout integrates DRAIN (pins 2–15), SOURCE (pins 18–40), and GND (pins 44, 45, 49) across multiple parallel terminals to minimize loop inductance and improve thermal conduction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DRAIN (2–15) | GaN FET drain node | High-current path for main power switching; internally tied to NC1 anchors for mechanical stability. |
| SOURCE (18–40) | GaN FET source node | Common return for power, signal ground, and thermal pad-requires low-impedance PCB copper pour. |
| VNEG (41–42) | Buck-boost negative rail | Supplies –14V turn-off bias; must be bypassed with ≥2.2µF capacitor to suppress ringing. |
| ZVD (50) | Zero-voltage detection output | Push-pull pulse output indicating ZVS achievement-used for adaptive timing control in LLC or phase-shifted full-bridge. |
| RDRV (52) | Drive-strength selection input | Resistor-to-GND sets slew rate: 0Ω → 150V/ns, 500kΩ → 20V/ns-enables board-level EMI tuning. |
| TEMP (51) | Digital temperature PWM output | Fixed 9kHz carrier with temperature-encoded duty cycle-simplifies isolation and eliminates ADC need. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated gate driver + bias | Eliminates external driver IC, level shifter, and bias supplies-reduces BOM count and layout area by >40%. |
| Cycle-by-cycle OCP | Sub-100ns response time prevents single-cycle avalanche failure-critical for 100+ kHz hard-switched PFC stages. |
| ZVD timing signal | Provides hardware-synchronized ZVS indication with nanosecond-level jitter-enables deterministic adaptive dead-time control. |
| Thermal PWM reporting | Direct junction temperature readout without calibration-enables real-time derating and predictive thermal management. |
| Low-inductance RQZ package | 54-pin VQFN with dual-source/drain arrays and thermal pad-reduces switching node ringing and improves thermal resistance (RθJC = 0.55°C/W). |
Applications
| Server PSU Primary Switch | Telecom Rectifier High-Side Switch |
|---|---|
Use Scenario: 3.3kW 48V-output server PSU using interleaved totem-pole PFC and LLC resonant DC/DC. IC Role / Device Role / Timing Role: High-side GaN switch in totem-pole PFC stage; ZVD signal synchronizes gate drive to achieve ZVS across full load range. Use Value: Enables >98.5% efficiency at 50% load and 100W/in³ power density-meeting ENERGY STAR v3.0 and 80 PLUS Titanium requirements. |
Use Scenario: 48V/50A telecom rectifier with active clamp forward topology operating at 300kHz. IC Role / Device Role / Timing Role: Main switch in active clamp circuit; integrated OCP protects against transformer saturation faults during transient overload. Use Value: Reduces conduction loss by 35% vs Si MOSFETs and eliminates external current-sense amplifiers-cutting system cost by $1.20/unit. |
| Solar Inverter DC Optimizer | Industrial Motor Drive Half-Bridge |
Use Scenario: Module-level DC optimizer with MPPT and 600V isolation barrier, operating in harsh outdoor environments. IC Role / Device Role / Timing Role: High-voltage switch controlling boost converter; TEMP PWM output feeds isolated microcontroller for junction-based thermal throttling. Use Value: Maintains 99.2% peak efficiency across –40°C to +85°C ambient-extending field lifetime by 40% vs discrete GaN solutions. |
Use Scenario: 7.5kW servo drive using three-phase inverter with space-vector modulation at 20kHz switching. IC Role / Device Role / Timing Role: Low-side switch in half-bridge leg; RDRV-adjustable slew rate mitigates EMI in noisy factory environments. Use Value: Achieves CISPR-11 Class A compliance without ferrite beads or shielding-reducing EMC test iterations by 3×. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage GaN FET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LMG3427R030 | Replaces ZVD with ZCD (zero-current detection); identical RDS(on), package, and protection features. | Optimized for current-mode resonant topologies (e.g., ZCS flyback) rather than voltage-mode ZVS control. | Select LMG3427R030 when designing current-sensing synchronous rectification or ZCS soft-switching converters. |
| GaN Systems GS66508T | 650V/30mΩ discrete GaN FET without integrated driver, protection, or ZVD; requires external gate driver and fault logic. | Used where design flexibility justifies added component count and layout complexity-e.g., custom multi-level inverters. | Choose GS66508T only if full control over gate drive waveform and independent fault handling is required. |
Compared with LMG3427R030, the LMG3426R030 provides hardware ZVS timing for voltage-mode control, while GS66508T demands external circuitry for equivalent functionality-making LMG3426R030 optimal for rapid, high-reliability GaN adoption in telecom and server PSUs.
Availability
LMG3426R030 is available at Aetrix Electronics and suitable for merchant network/server PSU, telecom rectifier, and solar inverter applications requiring stable component supply, JEDEC JEP180 qualification, and long-term industrial lifecycle support.
Supply support for LMG3426R030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of expertise in high-reliability power conversion solutions.
The LMG342x family was designed specifically for high-frequency, high-density switch-mode power converters-integrating GaN FETs, drivers, protections, and telemetry to eliminate design barriers in next-generation PSUs and inverters.
FAQ
What is the maximum recommended operating temperature for the LMG3426R030?
The LMG3426R030 has a maximum operating junction temperature of 150°C, with overtemperature shutdown triggered at 175°C. Its thermal PWM output encodes temperature from 25°C (0.3–6% duty) to 150°C (82% duty), enabling closed-loop thermal management. The RQZ package achieves 0.55°C/W junction-to-case thermal resistance, supporting high-power operation with proper heatsinking.
How does the ZVD feature in the LMG3426R030 differ from standard zero-voltage sensing circuits?
The LMG3426R030's ZVD feature is an on-die, hardware-accelerated detection block that outputs a 75–140ns pulse directly synchronized to actual ZVS events-without software latency or external comparators. Unlike discrete solutions, it measures internal VDS dynamics with sub-ns timing accuracy and integrates seamlessly with the gate driver, enabling deterministic dead-time optimization in real time.
Can the LMG3426R030 be used in hard-switching topologies without ZVS?
Yes, the LMG3426R030 is qualified per JEDEC JEP180 for hard-switching topologies and withstands 720V surges during switching. Its 20–150V/ns slew rate adjustment via RDRV allows controlled ring suppression, and its 600V rating with 800V transient capability ensures robustness in non-resonant PFC and LLC primary-side designs-even without ZVS.
What is the function of the RDRV pin on the LMG3426R030, and how does it affect performance?
The RDRV pin on the LMG3426R030 sets gate drive strength by selecting internal current sources: tying to GND enables 150V/ns slew rate, connecting to LDO5V yields 100V/ns, and using 300kΩ resistor achieves 20V/ns. This direct hardware control allows EMI optimization and switching loss tuning without firmware changes-critical for meeting CISPR standards across varying loads.
Does the LMG3426R030 require external components for basic operation, and what are the minimum required?
Yes-the LMG3426R030 requires four minimum external components: a 2.2µF capacitor on VNEG, a 4.7µH inductor on BBSW, a pull-up resistor on IN (if driven open-drain), and an RDRV-to-GND resistor for slew rate setting. The integrated LDO5V (5V/25mA) and buck-boost converter eliminate need for auxiliary supplies, reducing bill-of-materials by up to seven components versus discrete GaN solutions.
LMG3426R030RQZT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 54-VQFN Exposed Pad
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Switch Type:
- General Purpose
- Number of Outputs:
- 1
- Ratio - Input:Output:
- 1:1
- Output Configuration:
- Low Side
- Output Type:
- N-Channel
- Interface:
- -
- Voltage - Load:
- 600V
- Voltage - Supply (Vcc/Vdd):
- 7.5V ~ 18V
- Current - Output (Max):
- 40A
- Rds On (Typ):
- 26mOhm
- Input Type:
- Non-Inverting
- Features:
- Slew Rate Controlled, Status Flag
- Fault Protection:
- Current Limiting (Adjustable), Over Temperature, Short Circuit, UVLO
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 54-VQFN (12x12)
LMG3426R030RQZT FAQ
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6.How does Aetrix verify that LMG3426R030RQZT is sourced from the original manufacturer or authorized distributors?
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7.What is the process for return or replacement of LMG3426R030RQZT?
All LMG3426R030RQZT units undergo pre-shipment inspection (PSI). If there is an issue with LMG3426R030RQZT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LMG3426R030RQZT part is unused and in its original packaging.
Return procedure for LMG3426R030RQZT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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