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Texas Instruments LMQ66410MC3RXBRQ1
- Part No.:
- LMQ66410MC3RXBRQ1
- Manufacturer:
- Texas Instruments
- Package:
- 14-PowerTFQFN
- Datasheet:
-
LMQ66410MC3RXBRQ1.pdf
- Description:
- IC REG BUCK ADJ/1V 1A 14VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,198
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Product details
Overview
LMQ66410MC3RXBRQ1 from Texas Instruments is an AEC-Q100 Grade 1 qualified, 36V input, 1A synchronous step-down DC/DC converter with integrated VIN bypass and CBOOT capacitors in a 2.6mm × 2.6mm enhanced HotRod QFN package. It delivers fixed 3.3V output at 2.2MHz switching frequency, supports 42V load dump transients, achieves ≥85% efficiency at 1mA, and enables CISPR 25 Class 5 compliance in automotive radar ECU power rails.
For engineers reviewing the LMQ66410MC3RXBRQ1 datasheet, LMQ66410MC3RXBRQ1 pinout, LMQ66410MC3RXBRQ1 application, or LMQ66410MC3RXBRQ1 equivalent, key selection considerations include its ultra-low quiescent current (1.5µA), ZEN 2 switcher architecture for EMI reduction, dual-random spread spectrum, internal compensation, and functional safety documentation support for ASIL-B system integration.
Technical Context
The LMQ66410MC3RXBRQ1 employs peak-current-mode control with auto mode enabling frequency foldback below 1mA, ensuring high light-load efficiency and <1.5µA no-load input current at 13.5VIN. Its ZEN 2 architecture integrates two 22-nF VIN bypass capacitors and a 0.1-µF bootstrap capacitor internally, eliminating external placement while minimizing switch-node ringing via the bond-wire-free HotRod QFN package.
It features a precision enable input (VEN-VOUT = 1.23V ±70mV) with 350mV hysteresis, open-drain power-good flag with 2.5ms activation delay, and MODE/SYNC pin supporting PFM/FPWM selection or external clock synchronization from 200kHz to 2.5MHz - all optimized for automotive cold-crank (3VIN) and load-dump (42V) robustness.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 3.0V–36V after start-up; supports 42V transients - enables direct connection to automotive battery without pre-regulator. |
| Output Current | 1A continuous - sufficient for powering SoC cores, radar MMIC bias, or infotainment MCU subsystems. |
| Fixed Output Voltage | 3.3V ±0.9% over –40°C to +125°C - meets tight rail tolerance for automotive microcontrollers and sensors. |
| Switching Frequency | 2.2MHz fixed - allows use of small 1µH inductors and avoids AM-band interference in vehicle RF environments. |
| Quiescent Current | 1.5µA at 13.5VIN, no load - sustains always-on functionality in ADAS domain controllers with minimal battery drain. |
| Thermal Shutdown | 168°C trip with 20°C hysteresis - protects against sustained overload in enclosed under-hood modules. |
| EMI Mitigation | Dual-random spread spectrum + enhanced HotRod QFN - reduces peak emissions by >10dB, easing CISPR 25 Class 5 certification. |
Pinout & Package
LMQ66410MC3RXBRQ1 uses the RXB (VQFN-FCRLF, 14-pin) package: 2.6mm × 2.6mm body with wettable flanks and thermal DAP (GND/DAP) on bottom. Pin pitch is 0.4mm; corner anchor pins enhance solder joint reliability in automotive thermal cycling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 EN/UVLO | Enable & input UVLO control | Logic-level input (VEN-WAKE = 0.7V typ); connects directly to VIN for simple on/off control; must not float. |
| 3 VIN | Main power input | Supplies internal LDO and power stage; two 22-nF bypass caps integrated between VIN and PGND - external bulk cap still required. |
| 6 PGND | Power ground return | Low-inductance path for high di/dt currents; requires short, wide PCB trace to input capacitor and DAP. |
| 7 SW | Switch node | Connects to inductor; high dv/dt node - layout critical to minimize EMI; benefits from HotRod's low-parasitic package. |
| 8 BOOT | Bootstrap supply | Internally connected to SW via 0.1-µF capacitor - eliminates external boot cap and routing complexity. |
| 10 VCC | Internal LDO output | 3.3V ±3.5% regulated supply for control circuitry; decoupled with 1-µF ceramic to GND; can drive PG pull-up. |
| 11 VOUT/FB | Output voltage sense / feedback | Fixed 3.3V output; connect directly to VOUT node - no external resistors needed for this variant. |
| 13 MODE/SYNC | Operating mode control | Selects Auto (PFM), FPWM, or external sync; logic thresholds VMODE_L = 1V, VMODE_H = 1.6V - compatible with 3.3V GPIO. |
| 14 PG | Power-good flag | Open-drain output; asserts high after 2.5ms soft-start when VOUT reaches 90%; 100Ω on-resistance enables direct MCU interrupt. |
| GND/DAP | Thermal pad & ground | Mandatory solder connection to PCB ground plane; primary thermal path - accounts for >70% of heat dissipation. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated bypass & boot capacitors | Two 22-nF VIN-to-PGND caps + 0.1-µF BOOT-to-SW cap - reduce BOM count by 3 passive components and shrink layout area by ~15mm². |
| ZEN 2 switcher architecture | Combines dual-random spread spectrum + optimized HotRod pinout - lowers peak EMI by >10dB vs conventional buck, simplifying EMC filter design. |
| Ultra-low IQ in Auto mode | 1.5µA typical no-load current at 13.5VIN - extends battery life in always-on ADAS modules during vehicle sleep mode. |
| Functional safety documentation | Available FIT rate, FMEA reports, and safety analysis summary - accelerates ISO 26262 ASIL-B hardware integration without custom qualification effort. |
| NC pins between HV nodes | Three NC pins isolate VIN, SW, and BOOT - improves pin-level FMEA score and prevents creepage failure under humidity/contamination. |
Applications
| Radar ECU Power Supply | Infotainment Head Unit Core Rail |
|---|---|
|
Use Scenario: Powers 77GHz radar transceiver SoC requiring stable 3.3V at up to 800mA with minimal EMI coupling into RF front-end. IC Role / Device Role / Timing Role: Primary point-of-load regulator delivering low-noise, fast-transient 3.3V from 12V battery; operates in Auto mode during standby, FPWM during active chirp bursts. Use Value: Integrated spread spectrum and HotRod package eliminate need for common-mode chokes, reducing bill-of-materials and board space by 30% versus discrete solutions. |
Use Scenario: Supplies core logic voltage to ARM-based infotainment MCU during ignition-on and always-on telematics functions. IC Role / Device Role / Timing Role: Always-on buck converter with 1.5µA quiescent current; enables low-power wake-on-LIN/CAN while maintaining 3.3V regulation across cold-crank (3VIN) and load-dump (42V) events. Use Value: Internal compensation and fixed 3.3V output eliminate external feedback resistors and loop compensation components - cuts design time and validation risk. |
| Automotive Body Control Module | eCall System Backup Power |
|
Use Scenario: Provides regulated 3.3V to door module MCUs, LED drivers, and LIN transceivers in harsh under-dash environment. IC Role / Device Role / Timing Role: Robust DC/DC with AEC-Q100 Grade 1 rating (–40°C to +125°C TA) and 150°C junction limit - withstands under-hood thermal cycling and vibration. Use Value: 42V transient tolerance and integrated protection (thermal shutdown, overcurrent, PG flag) replace discrete protection circuits - improves system MTBF by >25%. |
Use Scenario: Powers eCall cellular modem and GPS receiver during vehicle crash, using backup supercapacitor or battery. IC Role / Device Role / Timing Role: Low-IQ buck converter operating from 3VIN–36VIN input; maintains 3.3V output during extended cold-crank events where main battery drops to 3V. Use Value: 3.0V minimum input and 0.2V dropout at 1A ensure uninterrupted operation during 10s+ cranking - meets UNECE R151 eCall continuity requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck converter applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM61480QRVJRQ1 | 36V, 8A, 2.1MHz, no integrated bypass caps, larger 3.5mm × 4.5mm VQFN package | Higher current, less EMI-optimized; requires external 22nF VIN bypass and 0.1µF BOOT caps | Choose for systems needing >1A output or multi-rail sequencing; avoid if board space or CISPR 25 Class 5 is critical. |
| TPS62903RTER | 36V, 3A, 2.2MHz, no AEC-Q100 qualification, no integrated capacitors, 3mm × 2mm WQFN | Commercial-grade only; lacks automotive transient robustness and functional safety documentation | Consider only for non-safety-critical industrial or consumer applications where cost is prioritized over qualification and EMI performance. |
Compared with LMQ66410MC3RXBRQ1, LM61480QRVJRQ1 offers higher current but increases layout complexity and EMI risk due to missing integrated capacitors, while TPS62903RTER sacrifices automotive qualification and fails CISPR 25 Class 5 readiness - making LMQ66410MC3RXBRQ1 the optimal choice for space-constrained, safety-compliant automotive POE designs.
Availability
LMQ66410MC3RXBRQ1 is available at Aetrix Electronics and suitable for advanced driver assistance systems (radar ECU), infotainment head units, and body electronics modules requiring stable component supply, automotive qualification, and long-term production continuity.
Supply support for LMQ66410MC3RXBRQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and automotive ICs, with decades of automotive qualification expertise and broad AEC-Q100 portfolio coverage.
The LMQ664x0-Q1 product line was designed specifically for ultra-compact, low-EMI, always-on automotive power rails - targeting radar, camera, and domain controller applications where board space, thermal performance, and CISPR 25 compliance are critical.
FAQ
What is the minimum input voltage required for LMQ66410MC3RXBRQ1 to start switching?
The LMQ66410MC3RXBRQ1 requires a minimum input voltage of 3.35V (typical) at the VIN pin to initiate start-up. Once operational, it sustains regulation down to 3.0V input - enabling reliable function during automotive cold-crank events where battery voltage dips to 3V. This behavior is confirmed in Section 6.3 Recommended Operating Conditions of the datasheet.
Does LMQ66410MC3RXBRQ1 require external feedback resistors for its 3.3V output?
No, LMQ66410MC3RXBRQ1 is the fixed 3.3V output variant - the VOUT/FB pin is internally configured for 3.3V regulation, eliminating the need for external feedback resistors. This simplifies layout, reduces BOM count, and ensures factory-trimmed accuracy of ±0.9% over temperature, as specified in Section 6.5 Electrical Characteristics.
How does the integrated bypass capacitor in LMQ66410MC3RXBRQ1 improve EMI performance?
The LMQ66410MC3RXBRQ1 integrates two 22-nF capacitors in series between VIN and PGND, placed directly inside the package adjacent to the power switches. This minimizes high-frequency loop inductance, suppresses input ripple at the source, and reduces common-mode noise injection - a key factor enabling CISPR 25 Class 5 compliance without external ferrite beads or common-mode chokes.
Can LMQ66410MC3RXBRQ1 be synchronized to an external clock, and what is the supported frequency range?
Yes, the MODE/SYNC pin of LMQ66410MC3RXBRQ1 supports external clock synchronization from 200kHz to 2.5MHz. When driven with a clean square wave, the device locks its switching frequency to the external source using an internal PLL - preserving regulation stability while eliminating beat frequencies in multi-rail systems, as detailed in Section 7.3.2 of the datasheet.
What thermal management provisions does LMQ66410MC3RXBRQ1 include for automotive under-hood use?
LMQ66410MC3RXBRQ1 features a junction temperature limit of 150°C, thermal shutdown at 168°C (±10°C), and 20°C hysteresis. Its enhanced HotRod QFN package includes a thermally exposed GND/DAP pad that must be soldered to a PCB ground plane - achieving 26.2°C/W junction-to-board thermal resistance per JEDEC 4-layer test board, enabling reliable operation in ambient temperatures up to +125°C.
LMQ66410MC3RXBRQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 14-PowerTFQFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Function:
- Step-Down
- Output Configuration:
- Positive
- Topology:
- Buck
- Output Type:
- Adjustable (Fixed)
- Number of Outputs:
- 1
- Voltage - Input (Min):
- 3V
- Voltage - Input (Max):
- 36V
- Voltage - Output (Min/Fixed):
- 1V (3.3V)
- Voltage - Output (Max):
- 18V
- Current - Output:
- 1A
- Frequency - Switching:
- 2.2MHz
- Synchronous Rectifier:
- Yes
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 14-VQFN (2.6x2.6)
LMQ66410MC3RXBRQ1 FAQ
1.How can I place an order for LMQ66410MC3RXBRQ1 through Aetrix?
Please submit a Request for Quotation (RFQ) for LMQ66410MC3RXBRQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LMQ66410MC3RXBRQ1 reliable?
The price and inventory of LMQ66410MC3RXBRQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LMQ66410MC3RXBRQ1 is usually 5 days.
3.What payment methods are accepted for LMQ66410MC3RXBRQ1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LMQ66410MC3RXBRQ1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LMQ66410MC3RXBRQ1?
LMQ66410MC3RXBRQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LMQ66410MC3RXBRQ1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LMQ66410MC3RXBRQ1?
For technical support, including LMQ66410MC3RXBRQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LMQ66410MC3RXBRQ1 requirements.
6.How does Aetrix verify that LMQ66410MC3RXBRQ1 is sourced from the original manufacturer or authorized distributors?
All LMQ66410MC3RXBRQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LMQ66410MC3RXBRQ1 meets industry standards.
7.What is the process for return or replacement of LMQ66410MC3RXBRQ1?
All LMQ66410MC3RXBRQ1 units undergo pre-shipment inspection (PSI). If there is an issue with LMQ66410MC3RXBRQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LMQ66410MC3RXBRQ1 part is unused and in its original packaging.
Return procedure for LMQ66410MC3RXBRQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LMQ66410MC3RXBRQ1 Tags
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