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Texas Instruments LMR16010PDDAR

Part No.:
LMR16010PDDAR
Manufacturer:
Texas Instruments
Category:
Voltage Regulators - DC DC Switching Regulators
Package:
8-PowerSOIC (0.154", 3.90mm Width)
Datasheet:
AetrixLMR16010PDDAR.pdf
Description:
IC REG BUCK ADJ 1A 8SOPWR
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:12,871

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Product details

Overview

LMR16010PDDAR from Texas Instruments is a 60 V, 1 A synchronous step-down DC-DC converter with integrated high-side MOSFET, 40 µA quiescent current, adjustable 200 kHz–2.5 MHz switching frequency, and precision enable input. It delivers stable 0.8–50 V output in automotive battery regulation and industrial power supplies.

For engineers reviewing the LMR16010PDDAR datasheet, LMR16010PDDAR pinout, LMR16010PDDAR application, or LMR16010PDDAR equivalent, key selection criteria include input voltage range (4.3–60 V), thermal performance (RθJC(bot) = 3.8 °C/W), PGOOD flag accuracy (±2% hysteresis), internal compensation, and HSOIC-8 PowerPAD™ package compatibility with board-level thermal management.

Technical Context

The LMR16010PDDAR implements fixed-frequency peak current mode control with Sleep-mode operation below 300 mA peak switch current, reducing quiescent current to 40 µA at light load. Its internal error amplifier and slope compensation ensure stability across wide duty cycles up to 97%.

It supports dual-mode RT/SYNC pin operation: resistor-programmed frequency (200 kHz–2.5 MHz) or external clock synchronization (250 kHz–2.3 MHz), with PLL lock-in time of 100 µs. The BOOT capacitor recharge circuit enables high-duty-cycle dropout operation without external low-side FET.

Key Specifications

ParameterValue and Actual Design Meaning
Input Voltage Range4.3 V to 60 V - supports direct connection to 12 V, 24 V, 36 V, and 48 V industrial/automotive rails without pre-regulation.
Output Current1 A continuous - sufficient for powering microcontrollers, sensors, and interface ICs in embedded systems.
Quiescent Current40 µA - enables multi-year battery life in always-on IoT nodes and telematics modules.
High-Side RDS(on)155 mΩ (typ) - reduces conduction loss and thermal stress at full load, enabling compact thermal design.
Feedback Reference0.750 V ±1.5% - allows precise output setting via resistor divider; tolerance directly impacts VOUT accuracy.
Power-Good Accuracy±2% hysteresis on FB voltage - provides reliable system sequencing and fault detection without external monitoring circuitry.
Shutdown Current1 µA - ensures negligible battery drain during deep sleep or system standby modes.
Thermal ResistanceRθJC(bot) = 3.8 °C/W - enables efficient heat transfer to PCB ground plane via exposed thermal pad.

Pinout & Package

LMR16010PDDAR is housed in an 8-pin HSOIC package (4.89 mm × 3.90 mm) with exposed thermal pad (Pin 9), optimized for low thermal resistance and high-power density layouts.

Pin/TerminalCircuit RoleDesign Meaning
BOOT (1)Bootstrap supply for high-side gate driverRequires 0.1 µF X7R/X5R ceramic capacitor to SW; enables high-side MOSFET turn-on above VIN.
VIN (2)Main input power supplyAccepts 4.3–60 V; must be bypassed with low-ESR CIN placed close to pin to minimize high-frequency noise and loop inductance.
EN (3)Enable control with internal 1 µA pull-upPull below 1.2 V to disable; floating or tied to VIN enables; supports adjustable UVLO using external resistive divider.
RT/SYNC (4)Frequency programming or sync inputResistor-to-GND sets fSW; >1.7 V logic-high enables external clock sync; internal PLL locks within 100 µs.
FB (5)Feedback node for output voltage regulationCompares divided VOUT to 0.75 V reference; 1% resistors recommended to limit error contribution.
PGOOD (6)Open-drain power-good flagAsserts high when VOUT is within ±2% of target; requires 10–100 kΩ pull-up to ≤7 V logic rail.
GND (7)System ground referencePrimary return path for control and power circuits; must connect to thermal pad for optimal thermal performance.
SW (8)Switching nodeConnects internally to high-side MOSFET drain; drives external inductor; requires tight layout to minimize EMI and ringing.
Thermal Pad (9)Die thermal dissipation pathMust be soldered to large PCB copper area connected to GND; accounts for >90% of heat removal.

Key Features

FeatureDesign Value
Internal CompensationEliminates need for external compensation network - reduces BOM count and design iteration time for stable operation with common output capacitors.
Sleep-mode OperationReduces switching losses at light load by lowering fSW and clamping COMP voltage - maintains >85% efficiency down to 1 mA output current.
97% Maximum Duty CycleEnables ultra-low dropout operation (e.g., 5 V out from 5.5 V in) without external bootstrap refresh circuitry - simplifies high-VIN-to-low-VOUT designs.
Integrated ProtectionIncludes cycle-by-cycle current limit, thermal shutdown (170 °C), output overvoltage protection, and input UVLO - eliminates need for discrete protection components.
PowerPAD™ Thermal DesignExposed bottom thermal pad with RθJC(bot) = 3.8 °C/W - allows 1 A continuous operation at +85 °C ambient with 2-layer PCB and 1-in² copper pour.
Precision Enable Input1.2 V threshold with 3.6 µA hysteresis current - enables accurate system-level power sequencing and programmable UVLO using two external resistors.

Applications

Automotive Battery RegulationIndustrial Power Supplies

Use Scenario: Regulating 12 V or 24 V vehicle battery to 3.3 V/5 V for infotainment MCU, CAN transceiver, and sensor hubs under cold-crank (4.3 V) and load-dump (60 V) conditions.

IC Role / Device Role: Primary buck regulator providing isolated, protected, and sequenced power to safety-critical subsystems.

Use Value: 40 µA IQ extends battery life during parking mode; 60 V absolute max rating withstands ISO 7637-2 pulse 5a; PGOOD enables safe boot sequencing.

Use Scenario: Converting unregulated 24–48 V factory floor supply to 5 V for PLC I/O modules, motor drivers, and fieldbus gateways operating in -40 °C to +85 °C environments.

IC Role / Device Role: Compact, thermally robust DC-DC stage delivering clean, regulated power in space-constrained DIN-rail enclosures.

Use Value: RθJC(bot) = 3.8 °C/W enables full 1 A load without heatsink; internal compensation simplifies compliance with IEC 61000-4 immunity standards.

Telecom/Datacom SystemsGeneral Purpose Wide Vin Regulation

Use Scenario: Point-of-load conversion in 48 V telecom shelves for powering FPGA I/O banks, SerDes, and management controllers requiring tight VOUT tolerance and fast transient response.

IC Role / Device Role: High-efficiency, low-noise buck converter supporting dynamic load steps up to 1 A with minimal output capacitance.

Use Value: Adjustable fSW allows optimization for EMI filtering (low fSW) or small inductor size (high fSW); 0.75 V reference enables accurate 1.2 V/1.8 V/2.5 V outputs.

Use Scenario: Universal input adapter replacement in test equipment, medical monitors, and portable instrumentation accepting 12–48 V inputs while delivering stable 3.3 V or 5 V outputs.

IC Role / Device Role: Flexible, drop-in buck solution eliminating need for multiple fixed-input regulators in multi-voltage designs.

Use Value: 4.3–60 V input range covers all common DC bus voltages; EN pin supports remote ON/OFF and brown-out recovery logic.

Equivalent & Alternatives

The following parts are listed as comparable options for similar step-down converter applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
LMR14010PDDARSame HSOIC-8 package, 40 V max input, 1 A output, 45 µA IQ, but lacks SYNC capability and has lower UVLO (3.7 V).Better suited for 12–36 V systems where 60 V rating is unnecessary; no external clock sync required.Select when cost sensitivity outweighs 60 V headroom and synchronization needs.
TPS54160DGQR60 V input, 1.5 A output, 114 µA IQ, SOIC-10 package, no integrated BOOT diode or PGOOD; requires external compensation.Higher output current and wider temperature range (-40 °C to +150 °C), but larger footprint and more complex design.Select when >1 A load or extended junction temperature is required, and layout space permits SOIC-10.

Compared with LMR14010PDDAR, LMR16010PDDAR adds 20 V input margin and SYNC functionality at identical package size; versus TPS54160DGQR, it trades 0.5 A current headroom for 75% lower quiescent current, integrated PGOOD, and simplified layout - making it optimal for space- and power-constrained 1 A applications.

Availability

LMR16010PDDAR is available at Aetrix Electronics and suitable for automotive battery regulation, industrial power supplies, telecom/datacom systems, and general-purpose wide-Vin regulation requiring stable component supply across long production lifecycles.

Supply support for LMR16010PDDAR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, designing analog and embedded processing chips for industrial, automotive, and communications markets.

The LMR16010PDDAR belongs to TI's SIMPLE SWITCHER® family of easy-to-use DC-DC converters, engineered for rapid power design with integrated FETs, internal compensation, and robust protection - targeting engineers needing reliable, low-risk buck solutions for harsh-input environments.

FAQ

What is the maximum input voltage rating for the LMR16010PDDAR?

The LMR16010PDDAR has an absolute maximum input voltage rating of 65 V, with recommended operating range from 4.3 V to 60 V. This 60 V upper limit ensures reliable operation under automotive load-dump transients (ISO 7637-2 Pulse 5a) and industrial 48 V bus surges. Exceeding 60 V continuously may trigger UVLO or cause thermal stress beyond design limits.

Does the LMR16010PDDAR require external compensation components?

No, the LMR16010PDDAR features fully internal loop compensation, eliminating the need for external Type II or Type III compensation networks. This simplifies design, reduces BOM count, and ensures stable operation with standard output capacitors (e.g., 47 µF ceramic). Layout still requires proper placement of CIN, CBOOT, and COUT per the datasheet guidelines.

How does the Sleep-mode function in the LMR16010PDDAR improve efficiency at light load?

The LMR16010PDDAR enters Sleep-mode when peak switch current falls below 300 mA, clamping the internal COMP voltage at 400 mV and halting switching. This reduces input current to 40 µA (typ), cutting gate drive and switching losses. Output voltage droop triggers resumption of switching, maintaining regulation while achieving >85% efficiency at 1 mA load - critical for battery-powered applications.

Can the LMR16010PDDAR synchronize to an external clock, and what are the timing requirements?

Yes, the LMR16010PDDAR supports synchronization via its RT/SYNC pin across 250 kHz–2.3 MHz. The external clock must have high-level ≥1.7 V, low-level ≤0.5 V, and minimum pulse width ≥30 ns. Falling edges trigger PLL lock-in within 100 µs. When sync stops, the device automatically reverts to resistor-programmed mode using the RT-to-GND resistor.

What thermal design considerations apply to the LMR16010PDDAR's HSOIC PowerPAD™ package?

The LMR16010PDDAR's exposed thermal pad (Pin 9) must be soldered to a minimum 1-in² GND copper pour on the PCB. With this, RθJC(bot) = 3.8 °C/W enables 1 A continuous operation at +85 °C ambient. Avoid thermal relief spokes; use ≥4 thermal vias (0.3 mm diameter) filled with solder to inner GND layers. Junction temperature must stay ≤125 °C under worst-case load and ambient conditions.

How is the output voltage set on the LMR16010PDDAR, and what tolerance impact does resistor selection have?

The LMR16010PDDAR uses a 0.750 V (±1.5%) internal reference. Output voltage is set by a resistor divider (RFBT/RFBB) from VOUT to FB. For 5 V output: RFBB = 10 kΩ, RFBT = 56.7 kΩ (1%). Using 1% resistors limits total VOUT error to ±2.2%; 0.1% resistors reduce this to ±1.6%. Values outside 10–100 kΩ increase noise susceptibility or FB bias current error.

LMR16010PDDAR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
SIMPLE SWITCHER®
Package/Case:
8-PowerSOIC (0.154", 3.90mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Function:
Step-Down
Output Configuration:
Positive
Topology:
Buck
Output Type:
Adjustable
Number of Outputs:
1
Voltage - Input (Min):
4.3V
Voltage - Input (Max):
60V
Voltage - Output (Min/Fixed):
0.8V
Voltage - Output (Max):
50V
Current - Output:
1A
Frequency - Switching:
200kHz ~ 2.5MHz
Synchronous Rectifier:
No
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SO PowerPad

LMR16010PDDAR FAQ

1.How can I place an order for LMR16010PDDAR through Aetrix?

Please submit a Request for Quotation (RFQ) for LMR16010PDDAR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LMR16010PDDAR reliable?

The price and inventory of LMR16010PDDAR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LMR16010PDDAR is usually 5 days.

3.What payment methods are accepted for LMR16010PDDAR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LMR16010PDDAR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LMR16010PDDAR?

LMR16010PDDAR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LMR16010PDDAR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LMR16010PDDAR?

For technical support, including LMR16010PDDAR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LMR16010PDDAR requirements.

6.How does Aetrix verify that LMR16010PDDAR is sourced from the original manufacturer or authorized distributors?

All LMR16010PDDAR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LMR16010PDDAR meets industry standards.

7.What is the process for return or replacement of LMR16010PDDAR?

All LMR16010PDDAR units undergo pre-shipment inspection (PSI). If there is an issue with LMR16010PDDAR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LMR16010PDDAR part is unused and in its original packaging.

Return procedure for LMR16010PDDAR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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