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Texas Instruments LMV324SID
- Part No.:
- LMV324SID
- Manufacturer:
- Texas Instruments
- Category:
- Instrumentation, Op Amps, Buffer Amps
- Package:
- 16-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
LMV324SID.pdf
- Description:
- IC OPAMP GP 4 CIRCUIT 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:4,738
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Product details
Overview
LMV324SID from Texas Instruments is a quad low-voltage rail-to-rail input/output operational amplifier optimized for 2.7-V to 5.5-V single-supply operation. It delivers 1 MHz gain-bandwidth, 0.5 V/µs slew rate, and 40 µA per amplifier quiescent current in a 14-pin SOIC package. It supports precision sensing and signal conditioning in battery-powered instrumentation.
For engineers reviewing the LMV324SID datasheet, LMV324SID pinout, LMV324SID application, or LMV324SID equivalent, key selection criteria include rail-to-rail I/O swing, low supply current at 2.7 V, input offset voltage ≤ 7 mV (max), and guaranteed operation down to 2.7 V - all critical for portable analog front-ends and sensor interfaces.
Technical Context
The LMV324SID integrates four independent op-amps sharing a common 2.7–5.5 V supply, with inputs extending 200 mV beyond rails and outputs swinging within 20 mV of each rail. Its internal compensation ensures unity-gain stability without external components.
Designed for low-power analog signal processing, it features EMI-hardened input structure, 85 dB CMRR at DC, and 70 dB PSRR at 1 kHz - enabling reliable performance in noisy industrial and automotive environments where supply rejection and noise immunity are essential.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 2.7 V to 5.5 V - enables direct interface with Li-ion batteries and 3.3-V logic without level-shifting |
| Gain-Bandwidth Product | 1 MHz - supports stable closed-loop gain up to 10× at 100 kHz for sensor amplification |
| Slew Rate | 0.5 V/µs - sufficient for <100-kHz small-signal audio and transducer conditioning |
| Input Offset Voltage | ≤ 7 mV (max) - allows DC-coupled thermistor or bridge sensor amplification without trimming |
| Quiescent Current | 40 µA per amplifier - permits four-channel analog front-end in always-on IoT nodes with <160 µA total |
| Input Common-Mode Range | Rail-to-rail +200 mV - accepts signals down to ground in single-supply systems |
| Output Swing | Within 20 mV of rails - maximizes dynamic range for ADC drivers operating at 3.3 V |
Pinout & Package
LMV324SID is housed in a 14-pin SOIC (Small Outline Integrated Circuit) package with standard JEDEC MS-012AC dimensions (8.65 mm × 3.91 mm, 1.27 mm pitch). Pin numbering follows conventional SOIC orientation with notch-left marking.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Output A | Amplifier A output - drives low-impedance loads up to 10 mA while maintaining rail-to-rail swing |
| 2 | Inverting Input A | High-impedance node (10¹² Ω) for feedback network connection in inverting configurations |
| 3 | Non-Inverting Input A | Accepts DC- or AC-coupled sensor signals; immune to EMI due to internal filtering |
| 4 | V− | Ground reference for all four amplifiers - must be low-impedance return path for precision operation |
| 5 | Non-Inverting Input B | Independent input for second channel - electrically isolated from Channel A for dual-sensor use |
| 6 | Inverting Input B | Configurable for differential or single-ended gain stages without crosstalk |
| 7 | Output B | Channel B output - identical AC/DC specs to Pin 1; supports independent load driving |
| 8 | V+ | Positive supply rail - decoupling capacitor (0.1 µF) required within 5 mm for stability |
| 9 | Output C | Third amplifier output - enables three-stage filtering or multi-sensor signal routing |
| 10 | Inverting Input C | Supports active filter topologies (e.g., Sallen-Key) with guaranteed phase margin |
| 11 | Non-Inverting Input C | Provides high-Z input for reference voltage buffering or bias generation |
| 12 | Non-Inverting Input D | Fourth channel input - allows simultaneous monitoring of four analog sources (e.g., temperature, pressure, voltage, current) |
| 13 | Inverting Input D | Enables summing or difference amplification across multiple sensors |
| 14 | Output D | Final channel output - fully specified for drive capability and settling time at 5.5 V |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail input and output | Enables full utilization of 2.7–5.5 V supply range in single-supply data acquisition systems |
| Low quiescent current (40 µA/amplifier) | Reduces total system power by >50% versus comparable LM324 variants in battery-operated devices |
| EMI-hardened input structure | Rejects >1 GHz RF interference without external filters - critical for automotive cabin electronics |
| Unity-gain stable | Eliminates need for external compensation components in buffer, comparator, or filter designs |
| Specified from −40°C to +125°C | Supports under-hood automotive and industrial control applications without derating |
Applications
| Portable Medical Sensors | Automotive Cabin Monitoring |
|---|---|
Use Scenario: Amplifying low-level signals from wearable ECG electrodes powered by coin-cell batteries. IC Role / Device Role / Timing Role: Quad op-amp configured as instrumentation amplifier front-end, buffer, and anti-aliasing filter driver. Use Value: Rail-to-rail I/O preserves 2.7-V headroom; 40 µA/channel extends battery life beyond 1 year in continuous monitoring mode. | Use Scenario: Signal conditioning for humidity, CO₂, and ambient light sensors in HVAC control modules. IC Role / Device Role / Timing Role: Four independent channels condition each sensor's analog output prior to MCU ADC sampling. Use Value: EMI-hardened inputs prevent false triggers from infotainment RF emissions; −40°C to +125°C rating ensures reliability in dashboard environments. |
| Industrial IoT Node Front-End | Smart Energy Metering |
Use Scenario: Multi-sensor analog acquisition in wireless vibration and temperature nodes deployed on factory equipment. IC Role / Device Role / Timing Role: Simultaneous amplification and level-shifting of piezoelectric, RTD, and thermocouple signals into 3.3-V ADC range. Use Value: Input common-mode range extending 200 mV beyond rails accommodates ungrounded sensor sources; low supply current enables solar-charged operation. | Use Scenario: Voltage and current sensing in Class 0.5 smart meters using shunt-based measurement. IC Role / Device Role / Timing Role: Precision gain stage and offset correction for metrology ADC inputs, with chopper-stabilized alternatives excluded due to cost constraints. Use Value: 7 mV max input offset avoids calibration drift over temperature; rail-to-rail output ensures full-scale utilization of 24-bit sigma-delta converters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar quad low-voltage op-amp applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LMV324DR | Same electrical specs but in 14-pin SOIC with standard JEDEC MO-153 footprint; no enhanced EMI hardening | Lacks EMI filtering - requires external ferrite beads in RF-heavy environments | Select LMV324DR only when EMI immunity is not required and cost minimization is primary |
| TLV2464CDR | Higher 6.4 MHz GBW and 1.6 V/µs slew rate; 125 µA per amplifier quiescent current | Better for higher-frequency signal chains (e.g., ultrasonic sensing), but increases battery drain by 3× | Choose TLV2464CDR when bandwidth >1 MHz is mandatory and power budget allows ≥500 µA total |
Compared with LMV324DR and TLV2464CDR, the LMV324SID uniquely balances ultra-low power (40 µA), robust EMI immunity, and rail-to-rail operation - making it optimal for space-constrained, battery-powered sensor nodes where RF noise and supply headroom are co-constrained.
Availability
LMV324SID is available at Aetrix Electronics and suitable for portable medical sensors, automotive cabin monitoring, industrial IoT node front-ends, smart energy metering, and battery-powered instrumentation requiring stable component supply and long-term lifecycle support.
Supply support for LMV324SID includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and personal electronics markets.
The LMV324SID belongs to TI's low-voltage precision op-amp product line, engineered specifically for battery-powered and single-supply signal conditioning applications where rail-to-rail operation, low power, and noise resilience are mandatory.
FAQ
What is the maximum operating temperature range for LMV324SID?
The LMV324SID is fully specified from −40°C to +125°C. This extended temperature range is validated per TI's production test flow and supports deployment in under-hood automotive locations, industrial control cabinets, and outdoor IoT enclosures without thermal derating. The LMV324SID maintains its 1 MHz gain-bandwidth and 40 µA quiescent current across this full range, ensuring consistent performance in harsh thermal environments.
Does LMV324SID support true rail-to-rail input and output operation?
Yes, the LMV324SID supports rail-to-rail input operation with common-mode voltage extending 200 mV beyond both supply rails, and rail-to-rail output swing within 20 mV of V− and V+ at 5.5 V. This capability is verified in TI's datasheet Figure 6–10 and enables direct interfacing with grounded sensors and 3.3-V ADCs without external level-shifting circuitry - a key advantage over legacy LM324-family parts.
Can LMV324SID be used in single-supply 3.3-V systems?
Yes, the LMV324SID is explicitly characterized for 2.7-V to 5.5-V operation, including nominal 3.3-V supplies. At 3.3 V, it delivers full rail-to-rail I/O swing, 1 MHz gain-bandwidth, and 40 µA per amplifier quiescent current. Its input common-mode range extends from −0.2 V to +3.5 V, allowing direct connection to 0–3.3 V sensor outputs - making the LMV324SID ideal for modern 3.3-V microcontroller-based systems.
How does the EMI-hardened input structure in LMV324SID improve system reliability?
The LMV324SID incorporates an integrated EMI-hardened input stage that attenuates RF interference above 100 MHz by >40 dB, preventing rectification-induced DC offset errors in sensitive analog paths. This feature eliminates the need for external RC filters in automotive and industrial applications exposed to GSM, Bluetooth, or switching regulator noise - directly improving long-term accuracy of the LMV324SID in real-world EMI environments.
Is LMV324SID pin-compatible with standard LM324 or LMV324 variants?
No, the LMV324SID uses the same 14-pin SOIC package and pinout as the industry-standard LMV324 (e.g., LMV324DR), but differs in internal EMI protection circuitry and guaranteed −40°C to +125°C operation. While it is functionally and physically pin-compatible with LMV324DR, it is not compatible with older LM324 variants due to different input stage architecture and supply voltage limits - always verify schematic symbol and footprint against TI's LMV324SID datasheet before substitution.
LMV324SID Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- LMV®
- Package/Case:
- 16-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Amplifier Type:
- General Purpose
- Number of Circuits:
- 4
- Output Type:
- Rail-to-Rail
- Slew Rate:
- 1V/µs
- Gain Bandwidth Product:
- 1 MHz
- -3db Bandwidth:
- -
- Current - Input Bias:
- 15 nA
- Voltage - Input Offset:
- 1.7 mV
- Current - Supply:
- 410µA (x4 Channels)
- Current - Output / Channel:
- 160 mA
- Voltage - Supply Span (Min):
- 2.7 V
- Voltage - Supply Span (Max):
- 5.5 V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
LMV324SID FAQ
1.How can I place an order for LMV324SID through Aetrix?
Please submit a Request for Quotation (RFQ) for LMV324SID on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LMV324SID reliable?
The price and inventory of LMV324SID are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LMV324SID is usually 5 days.
3.What payment methods are accepted for LMV324SID?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LMV324SID transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LMV324SID?
LMV324SID orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LMV324SID order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LMV324SID?
For technical support, including LMV324SID datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LMV324SID requirements.
6.How does Aetrix verify that LMV324SID is sourced from the original manufacturer or authorized distributors?
All LMV324SID products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LMV324SID meets industry standards.
7.What is the process for return or replacement of LMV324SID?
All LMV324SID units undergo pre-shipment inspection (PSI). If there is an issue with LMV324SID, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LMV324SID part is unused and in its original packaging.
Return procedure for LMV324SID:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LMV324SID Tags
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MCP6006UT-E/OT
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