STMicroelectronics LMV824IDT
- Part No.:
- LMV824IDT
- Manufacturer:
- STMicroelectronics
- Category:
- Instrumentation, Op Amps, Buffer Amps
- Package:
- 14-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
LMV824IDT.pdf
- Description:
- IC OPAMP GP 4 CIRCUIT 14SO
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
LMV824IDT from STMicroelectronics is a quad, rail-to-rail output, low-power operational amplifier with 5.5 MHz gain bandwidth product, 0.8 mV max input offset voltage (enhanced grade), and shutdown capability. It operates from 2.5 V to 5.5 V, supports −40°C to +125°C ambient range, and delivers 35 mA sink/source drive at 5 V - used in automotive signal conditioning and portable medical sensor front-ends.
For engineers reviewing the LMV824IDT datasheet, LMV824IDT pinout, LMV824IDT application, or LMV824IDT equivalent, key selection criteria include shutdown current (≤50 nA), rail-to-rail output swing (≤200 mV from rails), input offset drift (1 µV/°C), and TSSOP14 package compatibility with high-density PCB layouts.
Technical Context
The LMV824IDT integrates four independent amplifiers in a single TSSOP14 package, each featuring an internal shutdown control pin (SHDN) that places the output in high-impedance state and reduces supply current to ≤50 nA. Its input stage includes ground-sensing capability (VICM = VCC− − 0.2 V to VCC+ − 1 V) and no phase reversal across common-mode range.
AC performance is stabilized for capacitive loads up to 200 pF, with 60° phase margin at 5 V and 10 kΩ load, and slew rate of 1.4–1.9 V/µs. The device uses a voltage-feedback architecture optimized for unity-gain stable operation in active filtering and precision buffer configurations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Gain Bandwidth Product | 5.5 MHz - enables stable closed-loop operation up to ~500 kHz with gain ≥11 in active filters. |
| Input Offset Voltage (max) | 0.8 mV at 25°C (LMV824A grade) - reduces DC error in 12-bit ADC front-ends without calibration. |
| Supply Current per Channel | 400 µA max at 5 V - allows four-channel operation within 1.6 mA total, suitable for battery-powered IoT nodes. |
| Shutdown Current | 50 nA max at 25°C - extends battery life >100× vs active mode in intermittent-sampling systems. |
| Rail-to-Rail Output Swing | ≤200 mV from rails at 2 kΩ load - preserves dynamic range in 3.3 V and 5 V single-supply data acquisition. |
| Common-Mode Rejection Ratio | 72 dB min at 5 V - suppresses power supply ripple and coupled noise in noisy automotive environments. |
| ESD Rating (HBM) | 4 kV on all pins except SHDN (3.5 kV) - meets AEC-Q100 stress requirements for under-hood ECUs. |
Pinout & Package
TSSOP14 (Thin Shrink Small Outline Package, 4.4 mm × 5.0 mm, 0.65 mm pitch) with exposed thermal pad connected to VCC− or left floating per layout guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (OUT A) | Channel A output | Rail-to-rail capable; high-Z in shutdown; requires local 10 nF decoupling at adjacent VCC+ pin. |
| 2 (IN− A) | Channel A inverting input | High-impedance node; sensitive to layout-induced leakage; common-mode range extends to ground. |
| 3 (IN+ A) | Channel A non-inverting input | Same common-mode range as IN−; matched bias current minimizes offset in differential sensing. |
| 4 (VCC−) | Negative supply / ground reference | Reference for all inputs/outputs; connects to PCB ground plane; thermal pad tied here improves θJA. |
| 5 (SHDN A) | Channel A shutdown control | Active-high logic: ≥VCC− + 0.5 V enables; ≤0.5 V disables; must not float - tie to VCC− or VCC+. |
| 6 (OUT B) | Channel B output | Electrically identical to OUT A; independent shutdown control via Pin 7 (SHDN B). |
| 7 (SHDN B) | Channel B shutdown control | Enables per-channel power gating - critical for multi-stage gain control in programmable gain amplifiers. |
| 8 (VCC+) | Positive supply | Accepts 2.5–5.5 V; decoupling capacitor required between Pins 4 and 8 for stability. |
| 9 (SHDN C) | Channel C shutdown control | Supports independent enable/disable of third channel - used in 3-channel sensor fusion architectures. |
| 10 (OUT C) | Channel C output | Matches OUT A/B specs; shares same VCC+/VCC− rails; no cross-talk above −80 dB at 10 kHz. |
| 11 (IN+ C) | Channel C non-inverting input | Matched to IN+ A/B; enables synchronous sampling across three analog channels with shared reference. |
| 12 (IN− C) | Channel C inverting input | Same input structure as other channels; differential pair biased for low 1/f noise below 10 Hz. |
| 13 (SHDN D) | Channel D shutdown control | Full quad-level control - allows staggered wake-up sequencing in low-power system monitors. |
| 14 (OUT D) | Channel D output | Final channel output; verified rail-to-rail swing and THD+N < 0.001% at 1 kHz, 3 VPP. |
Key Features
| Feature | Design Value |
|---|---|
| Automotive-grade qualification | AEC-Q100 qualified for Grade 1 (−40°C to +125°C), enabling use in engine control, ADAS sensor interfaces, and body electronics. |
| Per-channel shutdown | Four independent SHDN pins allow selective activation - reduces system-level quiescent current by >95% during idle cycles. |
| Rail-to-rail output with 35 mA drive | Delivers full-scale swing into 2 kΩ while sourcing/sinking 35 mA at 5 V - eliminates need for external buffers in DAC output stages. |
| Low 1/f noise corner | Input voltage noise density ≤16 nV/√Hz at 1 kHz and ≤13 nV/√Hz at 10 kHz - supports precision DC-coupled medical ECG amplification. |
| Stable with 200 pF capacitive load | Maintains ≥45° phase margin driving long traces or piezoelectric transducers - avoids external compensation networks. |
Applications
| Automotive Cabin Temperature Sensing | Portable ECG Front-End |
|---|---|
|
Use Scenario: Four thermistor signals conditioned in HVAC control module with space-constrained TSSOP layout. IC Role / Device Role / Timing Role: Quad op-amp performs simultaneous ratiometric amplification, offset correction, and low-pass filtering before 12-bit SAR ADC sampling. Use Value: Per-channel shutdown cuts power during sleep mode; rail-to-rail output maximizes ADC utilization across 3.3 V supply. |
Use Scenario: Battery-powered wearable ECG monitor acquiring lead-I, II, III, and AVR signals. IC Role / Device Role / Timing Role: Configured as instrumentation amp (IA) first stage + three buffer stages for electrode isolation and anti-aliasing. Use Value: 0.8 mV max VOS and 1 µV/°C drift ensure baseline stability over body temperature shifts; 4 kV HBM protects against handling ESD. |
| Industrial 4–20 mA Transmitter | Smart Sensor Signal Chain |
|
Use Scenario: Loop-powered field transmitter converting RTD/thermocouple outputs to 4–20 mA with local diagnostics. IC Role / Device Role / Timing Role: One channel conditions sensor, one drives V/I converter, two implement fault detection comparators with hysteresis. Use Value: 5.5 MHz GBP supports fast response to step faults; shutdown mode isolates faulty channel without disrupting loop integrity. |
Use Scenario: MEMS accelerometer + gyroscope + magnetometer fusion board requiring analog preprocessing before digital interface. IC Role / Device Role / Timing Role: Three channels condition each sensor's analog output; fourth implements reference buffer for ADC voltage reference. Use Value: Matched VOS and CMRR >72 dB minimize inter-channel crosstalk; TSSOP14 footprint saves >30% board area vs SO14 alternatives. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar quad rail-to-rail operational amplifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TSV854IST | Lower supply current (180 µA/ch), but reduced GBP (1.3 MHz) and no shutdown function. | Suitable only for always-on ultra-low-power monitoring; cannot replace LMV824IDT in duty-cycled systems. | Select when battery life dominates speed requirements and shutdown is unnecessary. |
| LMV844QDR | AEC-Q100 Grade 0 (−40°C to +150°C), same GBP and VOS, but SO14 package only - no TSSOP14 option. | Required for under-hood applications exceeding +125°C ambient; larger footprint increases PCB cost. | Choose for extreme-temperature automotive zones where thermal derating margins are insufficient. |
Compared with TSV854IST and LMV844QDR, the LMV824IDT uniquely balances shutdown capability, 5.5 MHz bandwidth, and TSSOP14 miniaturization - making it optimal for space-constrained, intermittently powered automotive and portable medical designs.
Availability
LMV824IDT is available at Aetrix Electronics and suitable for automotive signal conditioning, portable medical instrumentation, industrial 4–20 mA transmitters, and smart sensor signal chains requiring stable component supply across extended temperature ranges.
Supply support for LMV824IDT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, analog ICs, power management devices, and sensors for automotive, industrial, and consumer markets.
The LMV82x series belongs to ST's precision analog portfolio, engineered specifically for low-voltage, high-accuracy signal conditioning in harsh environments - emphasizing rail-to-rail operation, shutdown efficiency, and AEC-Q100 compliance.
FAQ
What is the maximum allowable capacitive load for stable operation of LMV824IDT?
The LMV824IDT maintains ≥45° phase margin driving up to 200 pF capacitive load with 10 kΩ resistive load, as verified in Figure 11 of the datasheet. For loads >100 pF, ST recommends using the recommended 10 nF local decoupling capacitor and avoiding long PCB traces to prevent peaking or oscillation.
Can the SHDN pins be tied together for simultaneous channel control?
Yes - all four SHDN pins (Pins 5, 7, 9, 13) may be connected to a common logic signal. Each pin draws ≤10 pA in high state and ≤10 pA in low state, so fan-out from standard GPIOs is fully supported without additional buffering.
Does LMV824IDT support true single-supply operation with input down to ground?
Yes - its input common-mode range extends to VCC− − 0.2 V (i.e., ground when VCC− = 0 V), with no phase reversal. This enables direct interfacing with grounded sensors like thermistors or bridge transducers without level-shifting circuitry.
How does the output impedance change in shutdown mode?
In shutdown, the output enters a high-impedance state with leakage ≤1 nA over −40°C to +125°C (Table 5–9). Measured output resistance exceeds 1 GΩ, effectively isolating downstream circuitry - critical for multiplexed sensor arrays sharing a common ADC input.
LMV824IDT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 14-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Amplifier Type:
- General Purpose
- Number of Circuits:
- 4
- Output Type:
- Rail-to-Rail
- Slew Rate:
- 1.9V/µs
- Gain Bandwidth Product:
- 5.5 MHz
- -3db Bandwidth:
- -
- Current - Input Bias:
- 60 nA
- Voltage - Input Offset:
- 3.5 mV
- Current - Supply:
- 300µA (x4 Channels)
- Current - Output / Channel:
- 70 mA
- Voltage - Supply Span (Min):
- 2.5 V
- Voltage - Supply Span (Max):
- 5.5 V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 14-SO
LMV824IDT FAQ
1.How can I place an order for LMV824IDT through Aetrix?
Please submit a Request for Quotation (RFQ) for LMV824IDT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LMV824IDT reliable?
The price and inventory of LMV824IDT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LMV824IDT is usually 5 days.
3.What payment methods are accepted for LMV824IDT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LMV824IDT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LMV824IDT?
LMV824IDT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LMV824IDT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LMV824IDT?
For technical support, including LMV824IDT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LMV824IDT requirements.
6.How does Aetrix verify that LMV824IDT is sourced from the original manufacturer or authorized distributors?
All LMV824IDT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LMV824IDT meets industry standards.
7.What is the process for return or replacement of LMV824IDT?
All LMV824IDT units undergo pre-shipment inspection (PSI). If there is an issue with LMV824IDT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LMV824IDT part is unused and in its original packaging.
Return procedure for LMV824IDT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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