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Texas Instruments LP2996MR

Part No.:
LP2996MR
Manufacturer:
Texas Instruments
Category:
Voltage Regulators - DC DC Switching Regulators
Package:
8-PowerSOIC (0.154", 3.90mm Width)
Datasheet:
AetrixLP2996MR.pdf
Description:
IC DDR TERMINATION REG 8SOPWRPAD
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,202

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Product details

Overview

LP2996MR from Texas Instruments is a linear DDR termination regulator designed for VTT bus regulation in DDR1–DDR3L memory systems. It delivers ±1.5 A continuous and ±3 A peak sink/source current, regulates VTT to precisely VDDQ/2 (e.g., 0.75 V at VDDQ = 1.5 V), and features integrated VREF buffer and VSENSE remote sensing for SSTL-2/3 and HSTL termination in server and industrial memory modules.

For engineers reviewing the LP2996MR datasheet, LP2996MR pinout, LP2996MR application, or LP2996MR equivalent, this device is selected for high-accuracy, low-offset DDR termination where stable VREF buffering, thermal shutdown protection, and Suspend-to-RAM (STR) functionality via active-low SD pin are required in space-constrained SOIC-8 layouts.

Technical Context

The LP2996MR implements a dual-rail linear topology with separate AVIN (analog control) and PVIN (power output) supplies, enabling optimized thermal performance and reduced internal dissipation. Its high-speed error amplifier and shoot-through–protected output stage ensure fast transient response to DDR bus load steps up to ±3 A.

VDDQ feeds an internal 50 kΩ–50 kΩ resistor divider to generate VREF = VDDQ/2, which is buffered and delivered on VREF pin while simultaneously regulating VTT to match. VSENSE enables remote-sense feedback for improved load regulation across distributed termination buses.

Key Specifications

Parameter Value and Actual Design Meaning
VTT Output Voltage Matches VDDQ/2 (e.g., 0.75 V at VDDQ = 1.5 V); ±30 mV offset ensures JEDEC-compliant SSTL-2/3 termination accuracy
Continuous Current ±1.5 A sink/source; supports full DDR3L bus termination without external current boosting
Peak Transient Current ±3 A; handles DDR memory burst-mode current spikes without regulation loss
VREF Output Buffered VDDQ/2 reference (e.g., 0.75 V); supplies chipset and DIMM reference inputs with ≤2.5 kΩ output impedance
Shutdown Quiescent Current 115–150 µA; enables low-power Suspend-to-RAM mode while maintaining active VREF
Thermal Shutdown Threshold 165°C with 10°C hysteresis; protects against sustained overload or poor PCB thermal design
Input Voltage Range (AVIN) 2.2 V to 5.5 V; allows flexible biasing independent of PVIN and VDDQ rails

Pinout & Package

LP2996MR is packaged in an 8-pin SOIC (D package) with exposed thermal pad (PowerPAD™), measuring 4.90 mm × 3.90 mm. The package supports standard reflow and provides enhanced thermal performance over non-PowerPAD variants.

Pin/Terminal Circuit Role Design Meaning
GND Ground reference Common return for analog control, power stage, and sense circuitry; must connect to low-impedance system ground plane
VTT Regulated output Delivers precise VDDQ/2 termination voltage; capable of sourcing/sinking ±1.5 A continuously
SD Active-low shutdown input Pulls low to tri-state VTT (high-Z) while keeping VREF active; internal pullup allows open-circuit enable
PVIN Power input for output stage Supplies pass transistor rail; max 3.3 V recommended to limit thermal stress under load
VSENSE Remote feedback input Connects to midpoint of VTT distribution plane to correct IR drop; improves bus-wide regulation accuracy
AVIN Analog supply input Powers internal op-amp, reference, and control logic; independent of PVIN for split-rail optimization
VREF Buffered reference output Provides stable VDDQ/2 for chipset/DIMM reference; remains active during SD assertion
VDDQ Reference input Feeds internal 50 kΩ–50 kΩ divider; must be ≤6 V and < 2×(AVIN – 1) V per datasheet limits

Key Features

Feature Design Value
No external resistors for VTT setpoint VTT automatically tracks VDDQ/2 via precision internal 50 kΩ–50 kΩ divider - eliminates calibration and layout drift
Suspend-to-RAM (STR) support Active-low SD pin tri-states VTT while preserving VREF output and 100 kΩ VDDQ input impedance - enables low-power memory retention
Stable with ceramic capacitors Operates reliably with low-ESR ceramic bypass caps (e.g., 0.01 µF–47 µF), reducing BOM count and board area vs. tantalum solutions
Superior load regulation VSENSE pin enables remote sensing at bus midpoint - corrects trace IR drop to maintain ±1% VTT accuracy across entire DDR bus
Thermal protection Integrated 165°C shutdown with 10°C hysteresis prevents damage during sustained overload or inadequate heatsinking

Applications

DDR3L Memory Subsystem SSTL-3 Termination

Use Scenario: Termination of 1.35 V DDR3L memory channels in industrial servers and telecom baseband cards.

IC Role / Device Role / Timing Role: Provides regulated VTT = 0.675 V and buffered VREF = 0.675 V to DDR3L DIMMs and memory controller.

Use Value: Enables JEDEC-compliant SSTL-3 I/O interface with ±30 mV VTT offset tolerance and ±3 A transient handling for burst-mode operation.

Use Scenario: Termination of high-speed FPGA I/O banks configured for SSTL-3 signaling standards.

IC Role / Device Role / Timing Role: Supplies matched VTT and VREF references to multiple FPGA banks sharing a common termination plane.

Use Value: Eliminates need for discrete resistor networks and external op-amps - reduces component count and improves signal integrity at >400 MHz data rates.

HSTL Class I Termination DDR2 Server Memory Module

Use Scenario: Termination of ASIC-based HSTL Class I interfaces in medical imaging processors and test equipment.

IC Role / Device Role / Timing Role: Delivers precise VTT = VDDQ/2 (e.g., 0.9 V at VDDQ = 1.8 V) with remote sensing via VSENSE for long trace runs.

Use Value: Maintains sub-1% load regulation across 150 mm VTT planes - critical for deterministic timing closure in HSTL clock domains.

Use Scenario: VTT regulation for dual-rank DDR2 UDIMMs in embedded industrial PCs with extended temperature requirements.

IC Role / Device Role / Timing Role: Generates VTT = 0.9 V and VREF = 0.9 V from 1.8 V VDDQ rail; supports STR via SD pin during CPU sleep states.

Use Value: Reduces quiescent current to 115–150 µA in shutdown - extends system standby time without losing memory state.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR termination regulator applications.

Alternative Part Technical Difference Application Difference Selection Advice
LP2996MRE Same SOIC-8 package and electrical specs; differs only in tape-and-reel packaging (LP2996MR = tube, LP2996MRE = reel) Identical functional behavior; selected for automated SMT assembly vs. manual/hand-solder prototyping Choose LP2996MRE for volume production; LP2996MR for evaluation or low-volume builds
TPS51100DGQ Switching architecture (not linear); higher efficiency but requires external inductor, MOSFETs, and compensation components Used where thermal budget is constrained and >85% efficiency is mandatory; not suitable for noise-sensitive DDR3L applications Select TPS51100DGQ only when PVIN > 3.3 V or ambient temperature exceeds 85°C - otherwise LP2996MR offers lower noise and simpler layout

Compared with LP2996MRE, LP2996MR offers identical performance in tube packaging for flexibility in small-batch validation; versus TPS51100DGQ, LP2996MR avoids switching noise and external magnetics, making it preferred for DDR3L signal integrity-critical designs despite lower efficiency.

Availability

LP2996MR is available at Aetrix Electronics and suitable for DDR3L memory subsystems, SSTL-3 FPGA interfaces, HSTL ASIC interconnects, and DDR2 server memory modules requiring stable component supply across extended product lifecycles.

Supply support for LP2996MR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and communications markets.

LP2996MR belongs to TI's DDR termination regulator product line, engineered specifically for JEDEC-compliant VTT/VREF generation in DDR1–DDR3L memory systems with emphasis on accuracy, thermal robustness, and STR support.

FAQ

What is the minimum VDDQ voltage supported by the LP2996MR?

The LP2996MR supports VDDQ down to 1.35 V - matching DDR3L specifications. At this input, it delivers VTT = VREF = 0.675 V with ±30 mV offset. This minimum is confirmed in the Electrical Characteristics table for DDR III operation and distinguishes LP2996MR from the LP2996-N variant (min 1.8 V).

Does the LP2996MR require external resistors to set VTT voltage?

No. The LP2996MR uses an internal matched 50 kΩ–50 kΩ resistor divider referenced to VDDQ, so VTT and VREF are inherently set to VDDQ/2 without any external components. This eliminates calibration drift and reduces BOM count - a key design advantage confirmed in the Features and Description sections.

How does the VSENSE pin improve regulation accuracy in the LP2996MR?

The VSENSE pin enables remote-sense feedback by connecting to the midpoint of the VTT distribution plane. This compensates for IR drop along long PCB traces, ensuring VTT regulation accuracy is maintained across the entire bus - critical for multi-DIMM DDR systems. The datasheet specifies VSENSE input current as only 13 nA, minimizing loading error.

What happens to VREF during LP2996MR shutdown mode?

During shutdown (SD pin pulled low), the LP2996MR tri-states VTT but keeps VREF fully active and regulated at VDDQ/2. This behavior supports Suspend-to-RAM functionality, allowing the memory controller to retain reference voltage while terminating the bus in high-impedance state - a feature explicitly documented in the Device Functional Modes section.

Can the LP2996MR be used for DDR4 termination?

No. The LP2996MR is specified only for DDR1, DDR2, DDR3, and DDR3L termination per its official Applications section and Electrical Characteristics tables. DDR4 requires VDDQ = 1.2 V and VTT = 0.6 V with tighter tolerances and different transient profiles - unsupported by LP2996MR's design scope and parameter limits.

LP2996MR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
8-PowerSOIC (0.154", 3.90mm Width)
Packaging:
Tube
Product Status:
Obsolete
Function:
-
Output Configuration:
-
Topology:
-
Output Type:
-
Number of Outputs:
-
Voltage - Input (Min):
-
Voltage - Input (Max):
-
Voltage - Output (Min/Fixed):
-
Voltage - Output (Max):
-
Current - Output:
-
Frequency - Switching:
-
Synchronous Rectifier:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SO PowerPad

LP2996MR FAQ

1.How can I place an order for LP2996MR through Aetrix?

Please submit a Request for Quotation (RFQ) for LP2996MR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LP2996MR reliable?

The price and inventory of LP2996MR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LP2996MR is usually 5 days.

3.What payment methods are accepted for LP2996MR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LP2996MR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LP2996MR?

LP2996MR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LP2996MR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LP2996MR?

For technical support, including LP2996MR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LP2996MR requirements.

6.How does Aetrix verify that LP2996MR is sourced from the original manufacturer or authorized distributors?

All LP2996MR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LP2996MR meets industry standards.

7.What is the process for return or replacement of LP2996MR?

All LP2996MR units undergo pre-shipment inspection (PSI). If there is an issue with LP2996MR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LP2996MR part is unused and in its original packaging.

Return procedure for LP2996MR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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