Texas Instruments LP2998QMR/NOPB
- Part No.:
- LP2998QMR/NOPB
- Manufacturer:
- Texas Instruments
- Category:
- Special Purpose Regulators
- Package:
- 8-PowerSOIC (0.154", 3.90mm Width)
- Datasheet:
-
LP2998QMR/NOPB.pdf
- Description:
- IC REG CONV DDR 1OUT 8SOPWRPAD
- Quantity:
- Payment:

- Shipping:

Inventory:2,735
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Product details
Overview
LP2998QMR/NOPB from Texas Instruments is a linear DDR bus termination regulator designed for SSTL-2, SSTL-18, DDR3, and DDR3L memory systems. It delivers ±1.5 A continuous and ±3 A peak sink/source current to VTT while regulating VTT = VDDQ/2 with ≤30 mV output offset, 0.75 V VREF output, and thermal shutdown at 165°C - used in motherboard DIMM termination networks.
For engineers reviewing the LP2998QMR/NOPB datasheet, LP2998QMR/NOPB pinout, LP2998QMR/NOPB application, or LP2998QMR/NOPB equivalent, key selection considerations include VDDQ tracking accuracy, VSENSE remote sensing capability, active-low SD for Suspend-to-RAM mode, SO PowerPAD-8 thermal performance (RθJA = 43°C/W), and dual-rail AVIN/PVIN input architecture.
Technical Context
The LP2998QMR/NOPB integrates a high-speed op-amp feedback loop with internal 50 kΩ resistor divider to generate VREF = VDDQ/2 and regulate VTT precisely to that reference. Its output stage prevents shoot-through during bidirectional current transitions required by DDR bus signaling.
It uses separate AVIN (analog control supply) and PVIN (power output rail) inputs to minimize thermal dissipation and enable flexible system-level power partitioning - critical for maintaining stable VTT under fast load transients up to 3 A while supporting DDR1–DDR3L standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VTT Output Voltage | Matches VDDQ/2 with ±30 mV offset - ensures JEDEC-compliant termination voltage tracking across temperature and load. |
| Continuous Current | ±1.5 A sink/source - supports full DDR2/DDR3 bus termination without external boost circuitry. |
| Peak Transient Current | ±3 A - handles DDR data strobe and command/address switching transients without droop. |
| VREF Output | Buffered VDDQ/2 (e.g., 0.75 V at VDDQ = 1.5 V) - supplies stable reference to chipset and DIMMs during SD shutdown. |
| Thermal Shutdown | 165°C with 10°C hysteresis - protects against thermal runaway during sustained high-current operation. |
| Quiescent Current | 320–500 µA at AVIN - enables low-power standby in Suspend-to-RAM mode when SD = low. |
| Shutdown Leakage | 2–5 µA at SD = 0 V - minimizes system-level standby power loss. |
Pinout & Package
LP2998QMR/NOPB uses an 8-pin SO PowerPAD™ package (4.89 mm × 3.90 mm) with exposed thermal pad (EP) connected to GND for enhanced heat dissipation (RθJA = 43°C/W).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND (Pin 1) | Ground reference | Common return for analog control, power stage, and thermal pad - must be low-impedance plane connection. |
| SD (Pin 2) | Active-low shutdown | Pulls VTT to high-impedance state while keeping VREF active - enables Suspend-to-RAM with <5 µA leakage. |
| VSENSE (Pin 3) | Remote feedback sense | Connects to midpoint of VTT bus to compensate for IR drop - improves load regulation across long PCB traces. |
| VREF (Pin 4) | Buffered reference output | Provides VDDQ/2 (e.g., 0.75 V) to chipset/DIMMs - remains active during shutdown for memory retention. |
| VDDQ (Pin 5) | Reference input | Direct connection to DDR memory rail - sets VREF and VTT target; enables precise tracking of VDDQ variations. |
| AVIN (Pin 6) | Analog supply input | Powers internal op-amp, reference, and control logic - independent of PVIN to reduce noise coupling. |
| PVIN (Pin 7) | Power output rail | Supplies output stage - higher PVIN increases max continuous current but raises thermal load; limited to ≤AVIN. |
| VTT (Pin 8) | Termination output | Regulated bidirectional output tied to DDR bus termination resistors - sinks and sources current simultaneously. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-rail input architecture | Separate AVIN and PVIN pins decouple analog control from power stage - reduces noise sensitivity and enables optimized thermal management. |
| VSENSE remote sensing | Compensates for PCB trace IR drop by closing feedback loop at bus midpoint - maintains ±30 mV VTT regulation across entire DDR bus. |
| Suspend-to-RAM (STR) mode | Active-low SD pin tri-states VTT while preserving VREF - reduces system quiescent current to <150 µA without losing memory reference. |
| No external resistors required | Internal 50 kΩ resistor divider sets VREF = VDDQ/2 - eliminates calibration components and layout sensitivity. |
| Thermal shutdown with hysteresis | 165°C trip point + 10°C hysteresis - prevents thermal cycling and ensures safe recovery after overload conditions. |
Applications
| DDR Memory Termination | Automotive Infotainment Systems |
|---|---|
Use Scenario: Termination of DDR2/DDR3 memory buses on server and desktop motherboards with multi-DIMM configurations. IC Role / Device Role / Timing Role: Provides regulated, bidirectional VTT = VDDQ/2 to parallel termination resistors - maintains signal integrity during high-speed data bursts. Use Value: Enables compliance with JEDEC SSTL-2/SSTL-18 specs using single IC with ±3 A transient response and no external resistors. | Use Scenario: DDR3L memory termination in automotive head units requiring AEC-Q100 qualification and extended temperature operation. IC Role / Device Role / Timing Role: Delivers stable 0.75 V VTT for DDR3L (1.35 V VDDQ) while maintaining VREF during stop-mode - supports ASIL-B functional safety requirements. Use Value: Meets AEC-Q100 H1C ESD rating and –40°C to 125°C junction range - eliminates need for discrete termination networks in harsh environments. |
| FPGA Memory Interfaces | Industrial PC Memory Subsystems |
Use Scenario: Termination of high-speed DDR interfaces between Xilinx/Intel FPGAs and external memory modules. IC Role / Device Role / Timing Role: Regulates VTT with fast transient response to FPGA I/O switching noise - prevents data corruption during burst reads/writes. Use Value: Supports ±3 A peak current and VSENSE remote sensing - maintains <30 mV VTT error across 6-inch PCB traces. | Use Scenario: DDR3 termination in medical imaging and industrial control PCs where thermal reliability and long-term supply continuity are critical. IC Role / Device Role / Timing Role: Supplies VTT and buffered VREF to memory controller and DIMMs - operates continuously at 125°C junction temperature with SO PowerPAD thermal pad. Use Value: RθJA = 43°C/W enables >1.5 A continuous operation without forced airflow - reduces BOM count and cooling complexity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR termination regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS51200DRCR | Switching architecture; 3-A continuous; requires external compensation; no integrated VREF buffer. | Higher efficiency in high-PVIN applications; lacks VREF output for chipset reference. | Choose TPS51200DRCR only if system prioritizes efficiency over reference stability and board space. |
| LM1085IT-ADJ | Adjustable linear regulator; no VSENSE/VREF pins; no sink capability; max 3-A with external circuitry. | Not qualified for DDR termination; requires external op-amp and resistors to emulate VDDQ/2 tracking. | LM1085IT-ADJ is not a functional alternative - use only for non-JEDEC generic bias applications. |
Compared with TPS51200DRCR, LP2998QMR/NOPB provides integrated VREF buffering and VSENSE remote sensing essential for DDR compliance, while LM1085IT-ADJ lacks all DDR-specific features and cannot replace LP2998QMR/NOPB in termination roles without major redesign.
Availability
LP2998QMR/NOPB is available at Aetrix Electronics and suitable for DDR memory termination, automotive infotainment systems, and FPGA-based embedded designs requiring stable component supply, long-lifecycle support, and AEC-Q100-aligned reliability.
Supply support for LP2998QMR/NOPB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in power management, signal chain, and interface solutions.
The LP2998QMR/NOPB belongs to TI's DDR termination regulator product line, engineered specifically for JEDEC-compliant memory bus termination in computing, automotive, and industrial platforms - emphasizing precision VDDQ/2 tracking, bidirectional current handling, and thermal robustness.
FAQ
What is the function of the VSENSE pin on the LP2998QMR/NOPB?
The VSENSE pin on the LP2998QMR/NOPB provides remote feedback for improved load regulation. It connects to the midpoint of the VTT bus to compensate for IR voltage drop along PCB traces, ensuring VTT remains within ±30 mV of target across the entire DDR bus - a requirement for JEDEC SSTL compliance. If unused, VSENSE must be tied directly to VTT.
Does the LP2998QMR/NOPB support DDR3L memory systems?
Yes, the LP2998QMR/NOPB supports DDR3L termination with VDDQ as low as 1.35 V, delivering VTT = 0.675 V (nominal) with ±30 mV offset. Its electrical characteristics table explicitly specifies VTT and VREF performance at 1.35 V, 1.5 V, and 1.6 V VDDQ levels - meeting JEDEC DDR3L SSTL-15 specifications.
How does the SD pin affect VREF and VTT operation in the LP2998QMR/NOPB?
When SD is pulled low on the LP2998QMR/NOPB, VTT enters high-impedance (tri-state) mode while VREF remains fully active and regulated - enabling Suspend-to-RAM functionality. Quiescent current drops to 115–150 µA, and VREF continues supplying the chipset and DIMMs, preserving memory data integrity without external reference circuitry.
What is the maximum continuous output current for the LP2998QMR/NOPB at 125°C junction temperature?
The LP2998QMR/NOPB delivers ±1.5 A continuous current at 125°C junction temperature when mounted on a SO PowerPAD-8 board with proper thermal vias and copper area. Its maximum continuous current is thermally limited - at 125°C ambient and RθJA = 43°C/W, power dissipation must stay below ~1.16 W to avoid triggering 165°C thermal shutdown.
Can the LP2998QMR/NOPB be used with separate AVIN and PVIN supplies?
Yes, the LP2998QMR/NOPB supports independent AVIN and PVIN supplies: AVIN powers internal analog circuitry (recommended 2.2–5.5 V), while PVIN supplies the output stage (0–AVIN). This separation reduces thermal load and improves noise immunity - for example, AVIN = 2.5 V and PVIN = 3.3 V increases max continuous current but requires thermal derating per RθJA = 43°C/W.
LP2998QMR/NOPB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 8-PowerSOIC (0.154", 3.90mm Width)
- Packaging:
- Tube
- Product Status:
- Active
- Applications:
- Converter, DDR
- Voltage - Input:
- 2.2V ~ 5.5V
- Number of Outputs:
- 1
- Voltage - Output:
- -
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SO PowerPad
LP2998QMR/NOPB FAQ
1.How can I place an order for LP2998QMR/NOPB through Aetrix?
Please submit a Request for Quotation (RFQ) for LP2998QMR/NOPB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LP2998QMR/NOPB reliable?
The price and inventory of LP2998QMR/NOPB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LP2998QMR/NOPB is usually 5 days.
3.What payment methods are accepted for LP2998QMR/NOPB?
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4.How is shipping managed for LP2998QMR/NOPB?
LP2998QMR/NOPB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LP2998QMR/NOPB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LP2998QMR/NOPB?
For technical support, including LP2998QMR/NOPB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LP2998QMR/NOPB requirements.
6.How does Aetrix verify that LP2998QMR/NOPB is sourced from the original manufacturer or authorized distributors?
All LP2998QMR/NOPB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LP2998QMR/NOPB meets industry standards.
7.What is the process for return or replacement of LP2998QMR/NOPB?
All LP2998QMR/NOPB units undergo pre-shipment inspection (PSI). If there is an issue with LP2998QMR/NOPB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LP2998QMR/NOPB part is unused and in its original packaging.
Return procedure for LP2998QMR/NOPB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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