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Texas Instruments LP3929TMEX-AACQ/NOPB
- Part No.:
- LP3929TMEX-AACQ/NOPB
- Manufacturer:
- Texas Instruments
- Category:
- Translators, Level Shifters
- Package:
- Datasheet:
-
LP3929TMEX-AACQ/NOPB.pdf
- Description:
- IC TRANSLTR BIDIRECTIONAL 24USMD
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
LP3929TMEX-AACQ/NOPB from Texas Instruments is a highly integrated bi-directional level shifter and ultra-low-dropout LDO voltage regulator optimized for miniSD/SD 4-bit card interfaces. It provides six-channel level translation (five bi-directional, one uni-directional) between 1.8 V host (A-side) and 2.85 V card (B-side) logic, delivers 200 mA at 2.85 V from a 3.05–5.5 V input, and integrates ASIP-based EMI filtering and ±15 kV IEC ESD protection on B-side pins - enabling compact, robust mobile memory interface designs.
For engineers reviewing the LP3929TMEX-AACQ/NOPB datasheet, LP3929TMEX-AACQ/NOPB pinout, LP3929TMEX-AACQ/NOPB application, or LP3929TMEX-AACQ/NOPB equivalent, key selection considerations include its 3 ns typical propagation delay, 110 mV max dropout at 200 mA, 24-bump DSBGA package with verified bump mapping, thermal shutdown at 160°C, and support for ceramic output capacitors as small as 1.0 µF.
Technical Context
The LP3929TMEX-AACQ/NOPB implements independent direction control per signal group (DIR_0, DIR_1-3, CMD_DIR) to dynamically configure A→B or B→A data flow per channel, synchronized with host CLK_A and feeding back fCLK_A to compensate for bus delay. Its level-shifting core uses push-pull outputs on both sides with high-impedance inputs and integrated pull-up/pull-down resistors on B-side I/Os (e.g., 70 kΩ pull-up on D0_B).
The integrated LDO employs a fast-turn-on reference circuit achieving 30 µs typical enable time, operates stably with 1.0 µF ±30% ceramic or high-quality tantalum output capacitors, and features built-in thermal shutdown that forces all A/B I/Os into tri-state mode - ensuring safe operation during overtemperature events in battery-powered systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Level Shifter Channels | 6 total: 5 bi-directional (D0–D3, CMD), 1 uni-directional (fCLK_A); enables full miniSD 4-bit bus translation |
| Propagation Delay | 3 ns typical (A↔B), <1 ns max channel-to-channel skew - meets high-speed SD timing requirements up to ~37 MHz |
| LDO Output | 2.85 V at 200 mA load; 110 mV max dropout ensures regulation down to 2.96 V input under full load |
| Input Voltage Range | 3.05 V to 5.5 V (VBAT); supports single-cell Li-ion (3.0–4.2 V) and dual-cell alkaline/nickel chemistries |
| ESD Protection | ±15 kV air-gap, ±8 kV contact per IEC 61000-4-2 Level 4 - applied to VDDB, D0_B–D3_B, CMD_B, CLK_B, WP, CD |
| Package | 24-bump DSBGA (YFR0024AAA); 0.6 mm pitch, 2.1 mm × 2.1 mm footprint - optimized for space-constrained mobile PCBs |
| Operating Temp | −30°C to +85°C ambient - qualified for consumer and industrial portable equipment environments |
Pinout & Package
LP3929TMEX-AACQ/NOPB uses a 24-bump DSBGA package (TI package code YFR0024AAA) with 0.6 mm pitch and 2.1 mm × 2.1 mm body size. Bump layout follows standard top-view orientation with Pin 1 marking at corner A1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D0_A – D3_A, CMD_A | Host-side bi-directional I/O | 1.8 V LVCMOS push-pull channels; require external termination if unused per datasheet guidance |
| CLK_A | Host clock input | 1.8 V high-impedance input driving internal level shifter; synchronizes data transfer timing |
| fCLK_A | Feedback clock output | 1.8 V push-pull output providing delayed host clock to compensate for level shifter propagation latency |
| DIR_0, DIR_1-3, CMD_DIR | Direction control inputs | 1.8 V high-Z inputs setting per-group data flow direction (A→B or B→A) via VDDA/VSS logic levels |
| D0_B – D3_B, CMD_B | Card-side bi-directional I/O | 2.85 V LVCMOS push-pull with integrated pull-ups (15–70 kΩ) or pull-down (470 kΩ) - reduces external component count |
| CLK_B | Card clock output | 2.85 V push-pull output driven by translated CLK_A; directly interfaces SD card clock input |
| VDDB | LDO regulated output | 2.85 V @ 200 mA; powers B-side I/Os and SD card; stable with 1.0 µF ceramic capacitor (5–500 mΩ ESR) |
| VBAT | Main power input | 3.05–5.5 V supply for LDO; requires 1 µF input capacitor placed ≤1 cm from pin with clean analog ground return |
| VDDA | Host logic supply | 1.71–1.92 V (1.8 V typical); powers A-side I/Os and control logic; must be externally supplied |
| EN | Enable input | High-impedance input with internal 200 kΩ pull-down; VDDA = active, VSS = shutdown (0.2 µA VDDA quiescent) |
| WP / CD | Card detection / write protect | Host/card dual-purpose inputs with 100 kΩ pull-up to VDDA; interface SD card mechanical switches |
Key Features
| Feature | Design Value |
|---|---|
| Integrated ASIP filtering | On-die series resistors and capacitors on B-side I/Os provide EMC filtering without external components |
| Fast LDO turn-on | 30 µs typical enable time enables rapid power-up of SD card interface after host wake-up |
| No-load LDO stability | Maintains regulation with zero load - supports CMOS RAM keep-alive circuits without external dummy loads |
| Thermal shutdown coordination | 160°C trip temperature disables LDO and forces all I/Os to tri-state - prevents latch-up and system-level fault propagation |
| DSBGA light sensitivity mitigation | Specified immunity to fluorescent lighting; red/IR sources (e.g., halogen lamps, sunlight) require board-level shielding |
Applications
| miniSD/SD Card Interface | Mobile Phone Memory Expansion |
|---|---|
Use Scenario: Connecting 1.8 V application processor to 2.85 V miniSD card in slim smartphone design. IC Role / Device Role / Timing Role: Bi-directional level shifter for D0–D3/CMD/CLK signals plus dedicated 2.85 V LDO for card power and ESD-protected I/O buffer. Use Value: Eliminates need for discrete level shifters, external LDO, and ESD diodes - reducing BOM count by ≥8 components and PCB area by >15 mm². |
Use Scenario: Enabling hot-plug SD card insertion in battery-powered handheld devices with strict power budget. IC Role / Device Role / Timing Role: Provides controlled power sequencing (LDO enable before level shifter activation) and fast 30 µs turn-on to meet SD initialization timing. Use Value: Guarantees reliable card enumeration within 100 ms of insertion while maintaining <7 µA shutdown current (VBAT + VDDA). |
| Wireless Handheld GPS Logger | Industrial Data Acquisition Module |
Use Scenario: Logging GNSS position data to SD card in outdoor wearable device operating from single Li-ion cell. IC Role / Device Role / Timing Role: Translates host MCU's 1.8 V SPI-like SD interface while regulating stable 2.85 V rail across 3.05–4.2 V battery range. Use Value: Maintains 2.85 V output within ±3% tolerance over full load (1–200 mA) and input (3.05–5.5 V), ensuring SD card reliability across battery discharge cycle. |
Use Scenario: Adding removable SD storage to DIN-rail mounted sensor node with extended temperature requirement. IC Role / Device Role / Timing Role: Robust level shifting with ±15 kV IEC ESD protection on card-facing pins and −30°C to +85°C operation. Use Value: Survives harsh industrial ESD events without latch-up or parameter shift - validated per IEC61000-4-2 Level 4 on B-side pins only. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bi-directional level shifting and integrated LDO applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TUSB2036VFR | USB 2.0 transceiver with integrated 3.3 V LDO; no level shifting capability; 48-pin TQFP package | Designed for USB host controller interfacing, not SD/MMC protocols; lacks direction control logic and ASIP filtering | Select only if USB peripheral connectivity is primary requirement - not a functional substitute for SD interface translation |
| SN74AVC4T245PWR | Quad 4-bit AVC bus transceiver; no LDO, no ESD protection beyond HBM ±2 kV; 16-pin TSSOP package | Requires external 2.85 V regulator and discrete ESD protection; no integrated direction control per signal group | Use when discrete level shifting suffices and board space allows separate LDO + ESD solution - adds ≥5 passive components |
Compared with TUSB2036VFR and SN74AVC4T245PWR, LP3929TMEX-AACQ/NOPB uniquely combines miniSD-optimized level shifting, 200 mA LDO, and IEC-level ESD protection in a single 2.1 mm × 2.1 mm DSBGA - eliminating three ICs and associated passives required by alternatives.
Availability
LP3929TMEX-AACQ/NOPB is available at Aetrix Electronics and suitable for mobile phone memory expansion, wireless GPS loggers, industrial data acquisition modules, and portable medical devices requiring stable component supply with guaranteed long-term availability.
Supply support for LP3929TMEX-AACQ/NOPB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and digital signal processing technologies, with over 90 years of innovation in power management and interface solutions.
LP3929TMEX-AACQ/NOPB belongs to TI's portable power and interface product line, engineered specifically to reduce component count and PCB area in battery-powered memory interface applications - targeting miniSD/SD card integration in space- and power-constrained devices.
FAQ
What is the maximum supported data rate for LP3929TMEX-AACQ/NOPB in miniSD applications?
The LP3929TMEX-AACQ/NOPB supports miniSD timing up to approximately 37 MHz, validated by its 3 ns typical propagation delay and <1 ns channel-to-channel skew. Its AC switching characteristics - including tPLH/tPHL ≤7 ns (max) and tSKEW ≤1.0 ns - ensure reliable signal integrity for high-speed SD bus operation, provided external load capacitance remains ≤15 pF on the B-side as specified in the datasheet.
Does LP3929TMEX-AACQ/NOPB require external pull-up resistors on the B-side I/O lines?
No, LP3929TMEX-AACQ/NOPB integrates pull-up and pull-down resistors on all B-side I/Os: 15 kΩ on CMD_B, 70 kΩ on D0_B–D2_B, and 470 kΩ pull-down on D3_B. These on-die ASIP elements eliminate the need for external resistors, reducing bill-of-materials and PCB routing complexity while maintaining compliance with SD card electrical specifications.
Can LP3929TMEX-AACQ/NOPB operate with a 1.0 µF ceramic output capacitor on VDDB?
Yes, LP3929TMEX-AACQ/NOPB is explicitly designed to remain stable with a 1.0 µF ±30% ceramic output capacitor on VDDB, including Z5U, Y5V, and X7R dielectrics. The device specifies a stable ESR range of 5–500 mΩ, which aligns with typical 1.0 µF ceramic capacitors (20–40 mΩ), enabling minimal footprint and low-cost implementation without compromising transient response or noise performance.
How does the thermal shutdown feature affect I/O behavior in LP3929TMEX-AACQ/NOPB?
When LP3929TMEX-AACQ/NOPB reaches its 160°C thermal shutdown threshold, the LDO output (VDDB) is disabled and all A-side and B-side I/Os (D0_A–D3_A, CMD_A, D0_B–D3_B, CMD_B, CLK_B) are forced into high-impedance tri-state mode. This coordinated shutdown prevents bus contention and protects downstream SD card circuitry during sustained overtemperature conditions.
Is LP3929TMEX-AACQ/NOPB compatible with SDHC or SDXC cards?
LP3929TMEX-AACQ/NOPB is designed for miniSD/SD 4-bit physical layer interface compliance and supports the voltage and timing requirements of SD 1.0–2.0 specifications. While it does not implement SDHC/SDXC-specific command protocol logic (handled by host controller), its 2.85 V LDO output and level-shifting performance are fully compatible with SDHC and SDXC cards operating in legacy 4-bit mode at 2.7–3.6 V signaling range.
LP3929TMEX-AACQ/NOPB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Translator Type:
- Voltage Level
- Channel Type:
- Bidirectional
- Number of Circuits:
- 1
- Channels per Circuit:
- 4
- Voltage - VCCA:
- 1.71 V ~ 1.92 V
- Voltage - VCCB:
- 2.76 V ~ 2.93 V
- Input Signal:
- -
- Output Signal:
- -
- Output Type:
- Tri-State, Non-Inverted
- Data Rate:
- -
- Operating Temperature:
- -30°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Features:
- Thermal-Shutdown Protection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-WFBGA
LP3929TMEX-AACQ/NOPB FAQ
1.How can I place an order for LP3929TMEX-AACQ/NOPB through Aetrix?
Please submit a Request for Quotation (RFQ) for LP3929TMEX-AACQ/NOPB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LP3929TMEX-AACQ/NOPB reliable?
The price and inventory of LP3929TMEX-AACQ/NOPB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LP3929TMEX-AACQ/NOPB is usually 5 days.
3.What payment methods are accepted for LP3929TMEX-AACQ/NOPB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LP3929TMEX-AACQ/NOPB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LP3929TMEX-AACQ/NOPB?
LP3929TMEX-AACQ/NOPB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LP3929TMEX-AACQ/NOPB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LP3929TMEX-AACQ/NOPB?
For technical support, including LP3929TMEX-AACQ/NOPB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LP3929TMEX-AACQ/NOPB requirements.
6.How does Aetrix verify that LP3929TMEX-AACQ/NOPB is sourced from the original manufacturer or authorized distributors?
All LP3929TMEX-AACQ/NOPB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LP3929TMEX-AACQ/NOPB meets industry standards.
7.What is the process for return or replacement of LP3929TMEX-AACQ/NOPB?
All LP3929TMEX-AACQ/NOPB units undergo pre-shipment inspection (PSI). If there is an issue with LP3929TMEX-AACQ/NOPB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LP3929TMEX-AACQ/NOPB part is unused and in its original packaging.
Return procedure for LP3929TMEX-AACQ/NOPB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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