Texas Instruments LP3984IMF-3.1
- Part No.:
- LP3984IMF-3.1
- Manufacturer:
- Texas Instruments
- Package:
- SC-74A, SOT-753
- Datasheet:
-
LP3984IMF-3.1.pdf
- Description:
- IC REG LINEAR 3.1V 150MA SOT23-5
- Quantity:
- Payment:

- Shipping:

Inventory:3,768
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LP3984IMF-3.1 from Texas Instruments is a micropower 150 mA ultra-low-dropout CMOS voltage regulator in SOT-23-5 package, delivering fixed 3.1 V output with ≤75 mV dropout at 150 mA load, 60 dB PSRR at 1 kHz, and ≤1.2 µA shutdown current - optimized for battery-powered CDMA/GSM handsets requiring stable low-noise rail generation.
For engineers reviewing the LP3984IMF-3.1 datasheet, LP3984IMF-3.1 pinout, LP3984IMF-3.1 application, or LP3984IMF-3.1 equivalent, key selection considerations include input voltage range (2.5–6.0 V), fast 20 µs turn-on time, tantalum-capacitor compatibility, thermal shutdown protection, and −40°C to +125°C junction temperature operation.
Technical Context
The LP3984IMF-3.1 employs a CMOS pass transistor architecture enabling ultra-low quiescent current and minimal ground current increase in dropout, extending battery life in portable wireless systems. Its internal bandgap reference and error amplifier maintain ±1.2% output voltage tolerance over temperature and load.
It integrates logic-controlled enable (VEN), thermal shutdown (160°C trip), short-circuit current limiting (600 mA), and stability with 1 µF tantalum output capacitors (2–10 Ω ESR). The device operates without external compensation and remains stable under no-load conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 3.1 V ±1.2% - ensures precise biasing for RF front-end ICs and baseband processors in cellular handsets. |
| Max Output Current | 150 mA - supports power delivery to multiple low-power subsystems (e.g., audio codec, sensor interface) from single LDO. |
| Dropout Voltage | 75 mV typ. @ 150 mA - enables regulation down to VIN = 3.175 V, critical for Li-ion battery discharge tail-end operation. |
| PSRR | 60 dB @ 1 kHz, 40 dB @ 10 kHz - suppresses switching noise from DC/DC converters feeding adjacent rails in compact handset PCBs. |
| Quiescent Current | ≤1.2 µA in shutdown - minimizes standby leakage in always-on circuits like real-time clock or memory backup supplies. |
| Turn-On Time | 20 µs typ. - enables rapid power sequencing for wake-up events in sleep-mode cellular protocols. |
| Operating Temp | −40°C to +125°C junction - qualified for extended thermal environments in sealed mobile enclosures and automotive infotainment modules. |
Pinout & Package
SOT-23-5 package (DBV drawing), 2.9 mm × 1.6 mm × 1.15 mm body, RoHS-compliant green finish (CU SN), moisture sensitivity level 1 (260°C peak reflow).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN | Input voltage supply | Accepts 2.5–6.0 V DC; requires ≥1 µF input capacitor placed within 1 cm of pin for stability and transient response. |
| GND | Power ground reference | Common return path for input/output currents; must connect to clean analog ground plane to minimize noise coupling. |
| VOUT | Regulated output | Delivers fixed 3.1 V ±1.2%; stable with 1–22 µF tantalum capacitor (2–10 Ω ESR) directly at pin. |
| VEN | Logic-enable input | Active-high control: VIH ≥1.4 V, VIL ≤0.4 V; ties to VIN for always-on operation or microcontroller GPIO for dynamic power gating. |
| N.C. | No connection | Unused terminal; must remain unconnected per TI design - not tied to GND or any other node. |
Key Features
| Feature | Design Value |
|---|---|
| Micropower shutdown | ≤1.2 µA IQ enables >1-year battery shelf life in keep-alive applications like CMOS RAM backup. |
| Tantalum capacitor support | Stable with 1 µF tantalum output cap - eliminates need for larger, more expensive ceramic alternatives in space-constrained layouts. |
| Fast enable response | 20 µs turn-on time allows synchronous power-up with baseband processor clocks during LTE/WCDMA burst transmission. |
| Thermal & short-circuit protection | 160°C thermal shutdown with 20°C hysteresis and 600 mA short-circuit limit prevent damage during board-level fault conditions. |
| Low-noise regulation | 90 µVRMS output noise (10 Hz–100 kHz) avoids interference with sensitive RF receivers and ADC references. |
Applications
| CDMA Cellular Handsets | Wideband CDMA Cellular Handsets |
|---|---|
Use Scenario: Powering RF transceiver ICs and low-noise amplifiers in dual-band CDMA handsets operating on 800/1900 MHz bands. IC Role / Device Role / Timing Role: Primary 3.1 V LDO supplying bias to PA driver stages and mixer cores, synchronized to TX enable signals via VEN pin. Use Value: 75 mV dropout preserves headroom as Li-ion voltage drops below 3.3 V; 60 dB PSRR isolates RF section from noisy DC/DC converter ripple. | Use Scenario: Providing clean 3.1 V supply to WCDMA baseband processor I/O banks and analog front-end during high-data-rate HSPA+ sessions. IC Role / Device Role / Timing Role: Dedicated LDO for digital I/O rail, enabled only during active data transfer using processor-controlled VEN signal. Use Value: 20 µs turn-on ensures immediate voltage stabilization before first data byte transmission; 90 µVRMS noise prevents bit errors in high-speed serial interfaces. |
| GSM Cellular Handsets | Portable Information Appliances |
Use Scenario: Regulating 3.1 V for GSM power amplifier modules during TDMA burst transmission with 217 Hz envelope modulation. IC Role / Device Role / Timing Role: High-stability LDO decoupling PA supply from main system rail, with VEN synchronized to GSM transmit slot timing. Use Value: Fast transient response (Fig. 9–14) maintains output regulation during 2-A PA current spikes; thermal shutdown protects against antenna mismatch faults. | Use Scenario: Supplying 3.1 V to embedded microcontroller peripherals (USB PHY, touch controller, display driver) in handheld PDAs and e-readers. IC Role / Device Role / Timing Role: Always-on LDO for non-volatile memory and RTC, with VEN tied to VIN to guarantee continuous operation during sleep cycles. Use Value: ≤1.2 µA shutdown current extends battery runtime beyond 6 months in standby; no-load stability eliminates need for dummy loads. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LDO regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPL720F31 | 300 mA output, 250 mV dropout @ full load, 35 µA quiescent current in operation | Higher current capability but higher IQ - less suitable for ultra-low-power standby modes | Choose when system load exceeds 150 mA or requires tighter load regulation (0.002%/mA vs. LP3984IMF-3.1's 0.005%/mA) |
| MCP1700T-3102E/MB | SOT-23-3 package, no enable pin, 2.3 µA IQ in shutdown, 6 V max input | Lacks logic enable - requires external FET or resistor divider for controlled shutdown | Choose when board space is constrained and enable functionality is unnecessary; verify thermal derating for 150 mA in SOT-23-3 |
Compared with TPL720F31 and MCP1700T-3102E/MB, the LP3984IMF-3.1 uniquely balances micropower shutdown (≤1.2 µA), fast enable (20 µs), and proven tantalum-capacitor stability - making it optimal for space- and battery-life-sensitive cellular handset designs where all three traits are simultaneously required.
Availability
LP3984IMF-3.1 is available at Aetrix Electronics and suitable for CDMA/GSM handset manufacturing, portable information appliance production, and industrial telemetry modules requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for LP3984IMF-3.1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in power management IC design for portable electronics.
The LP3984IMF-3.1 belongs to TI's micropower LDO family engineered specifically for battery-powered wireless communication devices - emphasizing ultra-low IQ, fast transient response, and robustness in thermally demanding handheld form factors.
FAQ
What is the maximum input voltage rating for the LP3984IMF-3.1?
The LP3984IMF-3.1 has an absolute maximum input voltage (VIN) rating of 6.5 V, with recommended operating range from 2.5 V to 6.0 V. Exceeding 6.5 V risks permanent damage. For reliable operation across temperature, VIN should remain ≤6.0 V per datasheet specifications, especially when paired with 3.1 V output to maintain sufficient dropout margin.
Does the LP3984IMF-3.1 require an external bypass capacitor?
The LP3984IMF-3.1 does not require an external bypass capacitor for basic operation, as its internal bandgap reference is stabilized without one. However, adding a small capacitor (e.g., 1–10 nF) between VOUT and GND can further reduce output noise - particularly beneficial in RF-sensitive applications. The device remains stable with only the mandatory 1 µF tantalum output capacitor.
Can the LP3984IMF-3.1 be used with ceramic output capacitors?
The LP3984IMF-3.1 is explicitly characterized and guaranteed stable with tantalum output capacitors (1–22 µF, 2–10 Ω ESR). While some ceramic capacitors may work empirically, TI does not specify stability margins or phase margin for ceramic types due to their near-zero ESR - risking oscillation. Use only tantalum or film capacitors per datasheet guidance to ensure guaranteed performance.
What is the thermal shutdown behavior of the LP3984IMF-3.1?
The LP3984IMF-3.1 activates thermal shutdown at 160°C junction temperature and includes 20°C hysteresis, meaning it resumes regulation only after cooling to ~140°C. During shutdown, output is disabled and quiescent current remains ≤1.2 µA. This protects against sustained overload or poor PCB thermal design while allowing automatic recovery once temperature normalizes - critical for unattended portable devices.
Is the LP3984IMF-3.1 pin-compatible with other variants in the LP3984 family?
Yes - all LP3984 variants in SOT-23-5 package (e.g., LP3984IMF-1.5/NOPB, LP3984IMF-1.8/NOPB) share identical pinout (VIN, GND, VOUT, VEN, N.C.) and footprint. The LP3984IMF-3.1 can replace other 5-pin versions on the same PCB without layout changes, provided the 3.1 V output matches system requirements and thermal limits are verified for the specific load condition.
LP3984IMF-3.1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- SC-74A, SOT-753
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 6V
- Voltage - Output (Min/Fixed):
- 3.1V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.12V @ 150mA
- Current - Output:
- 150mA
- Current - Quiescent (Iq):
- 125 µA
- Current - Supply (Max):
- 150 µA
- PSRR:
- 60dB ~ 40dB (1kHz ~ 10kHz)
- Control Features:
- Enable
- Protection Features:
- Over Temperature, Short Circuit
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOT-23-5
LP3984IMF-3.1 FAQ
1.How can I place an order for LP3984IMF-3.1 through Aetrix?
Please submit a Request for Quotation (RFQ) for LP3984IMF-3.1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LP3984IMF-3.1 reliable?
The price and inventory of LP3984IMF-3.1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LP3984IMF-3.1 is usually 5 days.
3.What payment methods are accepted for LP3984IMF-3.1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LP3984IMF-3.1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LP3984IMF-3.1?
LP3984IMF-3.1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LP3984IMF-3.1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LP3984IMF-3.1?
For technical support, including LP3984IMF-3.1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LP3984IMF-3.1 requirements.
6.How does Aetrix verify that LP3984IMF-3.1 is sourced from the original manufacturer or authorized distributors?
All LP3984IMF-3.1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LP3984IMF-3.1 meets industry standards.
7.What is the process for return or replacement of LP3984IMF-3.1?
All LP3984IMF-3.1 units undergo pre-shipment inspection (PSI). If there is an issue with LP3984IMF-3.1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LP3984IMF-3.1 part is unused and in its original packaging.
Return procedure for LP3984IMF-3.1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LP3984IMF-3.1 Tags

-
MIC5504-1.8YM5-TR
Microchip Technology

-
MIC5504-3.3YM5-TR
Microchip Technology

-
MIC5365-3.0YC5-TR
Microchip Technology

-
MIC5365-1.8YC5-TR
Microchip Technology

-
MIC5365-2.5YC5-TR
Microchip Technology

-
MIC5365-3.3YC5-TR
Microchip Technology

-
MIC5365-3.3YD5-TR
Microchip Technology

-
MIC5317-3.3YM5-TR
Microchip Technology

-
TLV1117LV33DCYR
Texas Instruments

-
MIC5317-3.3YMT-TZ
Microchip Technology

-
MIC5528-3.3YMT-TR
Microchip Technology

-
TLV75801PDRVR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

