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Texas Instruments LP5812BDSDR
- Part No.:
- LP5812BDSDR
- Manufacturer:
- Texas Instruments
- Category:
- LED Drivers
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
LP5812BDSDR.pdf
- Description:
- 4 X 3 MATRIX RGB LED DRIVER WITH
- Quantity:
- Payment:
- Shipping:
Inventory:2,630
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Product details
Overview
LP5812BDSDR from Texas Instruments is a 4 × 3 matrix RGB LED driver IC with autonomous animation engine, time-cross-multiplexing (TCM) topology, and integrated de-ghosting. It delivers up to 51 mA per channel with ±5% device-to-device and channel-to-channel current accuracy, ultra-low 110 mV headroom at 25.5 mA, and supports 24 kHz audible-noise-free PWM dimming. It drives 12 discrete LEDs or 4 RGB LEDs in portable wearables and smart peripherals.
For engineers reviewing the LP5812BDSDR datasheet, LP5812BDSDR pinout, LP5812BDSDR application, or LP5812BDSDR equivalent, this page provides verified technical context, real-world drive modes (direct/TCM/mix), autonomous animation register control, I²C timing compliance (up to 1 MHz), and validated WSON-8 package implementation details - all confirmed against TI's SNVSCC9C production datasheet (Feb 2025 revision).
Technical Context
The LP5812BDSDR implements a time-cross-multiplexing (TCM) architecture using four bidirectional output pins (OUT0–OUT3), each integrating a high-side PMOS scan switch and low-side constant-current sink. This enables 4×3 matrix control with configurable scan counts (1–4) and multiplexing ratios (¼ to 1), supporting direct, TCM, and mixed drive modes via Dev_Config_1 register settings.
It features an autonomous animation engine with per-LED 8-bit dot current (DC) and 8-bit PWM registers, programmable linear/exponential dimming curves, and synchronized multi-device operation via 6 MHz internal oscillator and SYNC pin. Integrated open/short detection (LOD/LSD) and clamped de-ghosting (with vmid_sel and clamp_sel configuration) eliminate visual artifacts without external components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2.7 V to 5.5 V - powers logic and analog blocks; compatible with 1.8 V/3.3 V/5 V MCU I/O without level shifters. |
| Max LED Count | 12 LEDs or 4 RGB LEDs - achieved via TCM topology using only 4 pins, minimizing PCB routing and footprint. |
| Current Sink Range | 0.1 mA to 51 mA per channel - set globally via 1-bit MC (25.5/51 mA) and individually via 8-bit DC (256 steps). |
| Headroom Voltage | 110 mV (typ.) at 25.5 mA - enables reliable LED drive even with low forward-voltage red/green/blue diodes near VCC rail. |
| PWM Frequency | Up to 24 kHz - eliminates audible noise in consumer audio-adjacent devices like earbuds and smart speakers. |
| I²C Interface | 1 MHz max - supports fast register writes for real-time animation updates and multi-device synchronization. |
| Operating Temp | –40°C to +85°C - qualified for industrial HMI, EV chargers, and outdoor IoT endpoints without derating. |
Pinout & Package
LP5812BDSDR uses the WSON-8 (DSD) package: 3 mm × 3 mm body, 0.65 mm pitch, thermal pad on underside. Pinout is validated per TI SNVSCC9C Figure 5-2 and Table 5-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC | Power input | Supplies internal regulator and output stage; requires 22 μF bulk capacitor close to pin per datasheet recommendation. |
| GND | Ground reference | Thermal pad must be soldered to PCB ground plane for RθJB = 22.9°C/W thermal performance. |
| OUT0–OUT3 | Bidirectional driver terminals | Each integrates high-side scan FET + low-side current sink; unused pins must float (not tied high/low). |
| SCL / SDA | I²C interface | Supports Standard/Fast/Fast-Plus modes; VIH = 1.4 V min ensures robustness with 1.8 V controllers. |
| SYNC | Multi-device sync I/O | Accepts external clock or outputs 6 MHz internal oscillator signal; grounded when unused to reduce leakage. |
Key Features
| Feature | Design Value |
|---|---|
| Autonomous animation engine | Offloads MCU by executing preloaded LED sequences (dot current, PWM, phase shift) without host intervention. |
| Configurable de-ghosting | Vmid clamping during blank time eliminates both up/down ghosting in TCM mode using selectable mid-rail voltage. |
| Individual LED diagnostics | Detects open-circuit (70–110 mV threshold) and short-circuit (32–68% of VCC) per channel with no external sensing. |
| Mixed-drive mode support | Simultaneously drives some LEDs in direct mode (full current) and others in TCM mode (matrix) via led_mode = 5h–7h. |
| Ultra-low active current | 0.4 mA typical at 25.5 mA LED current - extends battery life in wearables and Bluetooth peripherals. |
Applications
| Earbud Charging Case Indication | Smart Speaker RGB Status Ring |
|---|---|
Use Scenario: Real-time battery level and pairing status indication on compact, space-constrained earbud charging cases. IC Role / Device Role / Timing Role: LP5812BDSDR acts as autonomous RGB matrix controller, driving 12 discrete LEDs in 4×3 layout using TCM mode with 24 kHz PWM. Use Value: Eliminates MCU GPIO overhead and firmware animation logic; 110 mV headroom ensures full brightness with low-Vf red LEDs at 3.3 V supply. |
Use Scenario: Dynamic ambient lighting and voice assistant feedback on cylindrical smart speaker enclosures. IC Role / Device Role / Timing Role: LP5812BDSDR serves as synchronized multi-zone LED driver, using SYNC pin to align animation timing across stacked LP5812BDSDR units. Use Value: 6 MHz internal oscillator enables frame-accurate lighting effects; mix-drive mode allows dedicated status LEDs + ring animation in single IC. |
| VR Headset Power/Mode Indicator | IoT Video Doorbell Status Panel |
Use Scenario: Low-power, high-reliability status signaling on battery-operated VR headset headbands and controllers. IC Role / Device Role / Timing Role: LP5812BDSDR operates in direct-drive mode (4 LEDs) with autonomous animation, reducing host processor wake-ups. Use Value: 26 μA standby current preserves battery; integrated LOD/LSD detects LED failure before user notice-critical for safety-critical UI. |
Use Scenario: Outdoor-facing status panel showing doorbell press, motion detection, and Wi-Fi connectivity on IP65-rated video doorbells. IC Role / Device Role / Timing Role: LP5812BDSDR functions as ruggedized LED driver in industrial temperature range (–40°C to +85°C), handling wide VCC variation. Use Value: ±5% current matching ensures consistent color balance across RGB LEDs despite ambient temperature swings; ESD rated to ±4 kV HBM. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RGB LED driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LP5812ADSDR | I²C address bit 4 = 0, bit 3 = 0 (vs. LP5812BDSDR: bit 4 = 0, bit 3 = 1); identical electrical specs and package. | No functional difference; used to daisy-chain up to 4 LP5812x devices on same I²C bus without address conflict. | Select LP5812ADSDR only when building multi-driver systems requiring distinct I²C addresses; otherwise LP5812BDSDR is drop-in compatible. |
| LP5813BDSDR | Boost-based power stage (vs. LP5812BDSDR's linear regulation); higher VOUT capability; DSBGA-12 package (1.6 mm × 1.6 mm). | Better suited for driving high-Vf white/amber LEDs (>3.5 V) from 3.3 V rails; not pin-compatible due to different pin count and layout. | Choose LP5813BDSDR only when LED forward voltage exceeds VCC minus 110 mV headroom; otherwise LP5812BDSDR offers lower BOM cost and smaller footprint. |
Compared with LP5812ADSDR, LP5812BDSDR enables seamless I²C address allocation in multi-device designs; compared with LP5813BDSDR, it delivers superior efficiency and thermal performance for low-Vf RGB LEDs in space-constrained consumer housings - making it optimal for earbuds, VR controllers, and compact IoT panels.
Availability
LP5812BDSDR is available at Aetrix Electronics and suitable for portable wearables, smart audio peripherals, VR/AR controllers, and industrial HMI requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.
Supply support for LP5812BDSDR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of expertise in precision LED drivers and low-power interface solutions.
The LP5812BDSDR belongs to TI's LP58xx family of autonomous RGB LED drivers, designed specifically for battery-powered consumer electronics requiring minimal MCU intervention, ultra-low quiescent current, and robust matrix LED control in sub-3 mm² packages.
FAQ
What drive modes does the LP5812BDSDR support, and how are they configured?
The LP5812BDSDR supports direct-drive, time-cross-multiplexing (TCM), and mixed-drive modes. Configuration is done via the led_mode bits in the Dev_Config_1 register: 0h for direct (4 LEDs), 1h–4h for TCM (1–4 scans), and 5h–7h for mixed mode. Each mode determines whether OUT0–OUT3 act solely as current sinks, scan switches, or a combination - enabling flexible LED layout without hardware changes. LP5812BDSDR's register map defines LED naming accordingly (LED_x for direct, LED_xy for TCM).
How does the LP5812BDSDR achieve ghosting elimination in TCM mode?
The LP5812BDSDR eliminates ghosting using integrated clamping circuitry that holds OUT0–OUT3 at a mid-rail voltage (Vmid) during PWM off and blank periods. Vmid is selectable via vmid_sel bits and sits between VCC and VCC − Vf (LED forward voltage), enabling simultaneous pre-charge of current sinks and pre-discharge of scan FETs. This prevents both up-side and down-side ghosting without reverse-biasing LEDs. Clamp enable/disable is controlled by clamp_dis in Dev_Config12; default is enabled.
What is the function of the SYNC pin on the LP5812BDSDR, and how is it used?
The SYNC pin on the LP5812BDSDR serves dual roles: it accepts an external clock for synchronization or outputs the internal 6 MHz oscillator signal to coordinate lighting effects across multiple LP5812BDSDR devices. When used as output, it ensures frame-aligned animations in multi-driver systems (e.g., smart speaker rings). If unused, SYNC must be grounded to minimize leakage current - it is not left floating. The pin operates as open-drain I/O with VOH = VCC − 0.2 V.
Does the LP5812BDSDR require external current-setting resistors?
No, the LP5812BDSDR does not require external current-setting resistors. LED current is digitally programmed via two hierarchical controls: a global 1-bit Maximum Current (MC) bit selecting either 25.5 mA or 51 mA full-scale range, and individual 8-bit Dot Current (DC) values setting precise current levels within that range. This eliminates resistor tolerance errors, board space, and calibration effort - all current regulation is handled internally with ±5% accuracy.
How does the LP5812BDSDR handle LED fault detection, and what thresholds apply?
The LP5812BDSDR performs per-channel LED open and short detection autonomously. Open detection triggers when voltage at OUTx drops below 70–110 mV (configurable based on LED current setting); short detection activates when voltage exceeds 32–68% of VCC (set via lsd_th bits). Results are reported in dedicated status registers (LOD_STS, LSD_STS), enabling firmware to log failures or trigger UI alerts. No external circuitry is needed - detection is fully integrated and calibrated.
LP5812BDSDR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Linear
- Topology:
- Constant Current
- Internal Switch(s):
- Yes
- Number of Outputs:
- 4
- Voltage - Supply (Min):
- 500mV
- Voltage - Supply (Max):
- 5.5V
- Voltage - Output:
- 0V ~ 5.5V
- Current - Output / Channel:
- 51mA
- Frequency:
- 500kHz, 1MHz
- Dimming:
- Analog, I2C, PWM
- Applications:
- General Purpose
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (3x3)
LP5812BDSDR FAQ
1.How can I place an order for LP5812BDSDR through Aetrix?
Please submit a Request for Quotation (RFQ) for LP5812BDSDR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LP5812BDSDR reliable?
The price and inventory of LP5812BDSDR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LP5812BDSDR is usually 5 days.
3.What payment methods are accepted for LP5812BDSDR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LP5812BDSDR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LP5812BDSDR?
LP5812BDSDR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LP5812BDSDR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LP5812BDSDR?
For technical support, including LP5812BDSDR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LP5812BDSDR requirements.
6.How does Aetrix verify that LP5812BDSDR is sourced from the original manufacturer or authorized distributors?
All LP5812BDSDR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LP5812BDSDR meets industry standards.
7.What is the process for return or replacement of LP5812BDSDR?
All LP5812BDSDR units undergo pre-shipment inspection (PSI). If there is an issue with LP5812BDSDR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LP5812BDSDR part is unused and in its original packaging.
Return procedure for LP5812BDSDR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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