My Inquiry
My Account
Texas Instruments LP5812BYBHR
- Part No.:
- LP5812BYBHR
- Manufacturer:
- Texas Instruments
- Category:
- LED Drivers
- Package:
- 9-BGA, DSBGA
- Datasheet:
-
LP5812BYBHR.pdf
- Description:
- 4 X 3 MATRIX RGB LED DRIVER WITH
- Quantity:
- Payment:
- Shipping:
Inventory:2,385
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LP5812BYBHR from Texas Instruments is a 4 × 3 matrix RGB LED driver with autonomous animation engine control, implementing time-cross-multiplexing (TCM) topology to drive up to 12 LEDs or 4 RGB LEDs using only 4 output pins. It delivers 0.1–51 mA per constant-current sink with ±5% device-to-device and channel-to-channel accuracy, ultra-low headroom (110 mV typ. at 25.5 mA), and operates from 2.7 V to 5.5 V - enabling compact, low-power lighting in space-constrained portable electronics.
For engineers reviewing the LP5812BYBHR datasheet, LP5812BYBHR pinout, LP5812BYBHR application, or LP5812BYBHR equivalent, this page provides verified technical context on TCM drive modes, autonomous animation register configuration, I²C timing compliance (up to 1 MHz), integrated open/short detection, and de-ghosting implementation - all critical for real-time lighting system design without MCU intervention.
Technical Context
The LP5812BYBHR integrates four high-side PMOS scan switches and four precision constant-current sinks in a single DSBGA-9 package. Each OUTx pin functions simultaneously as scan switch and current sink, enabling configurable TCM drive (¼ to 1 multiplexing ratio), direct-drive, or mix-drive modes via Dev_Config_1 register settings.
Its autonomous animation engine executes preloaded LED sequences using internal 8-bit dot current (DC) and PWM registers, synchronized across multiple devices via 6 MHz internal oscillator and SYNC pin. Integrated de-ghosting clamps outputs to Vmid during blank time, eliminating both up-side and down-side ghosting without external components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2.7 V to 5.5 V - supports direct connection to Li-ion battery or 3.3 V/5 V rails without LDO. |
| LED Drive Capacity | Up to 12 LEDs (4×3 matrix) or 4 RGB LEDs - achieved via time-cross-multiplexing with 4 outputs. |
| Current Sink Range | 0.1 mA to 51 mA per channel - selectable via 1-bit MC (25.5/51 mA) and 8-bit DC (256 steps). |
| Accuracy | ±5% device-to-device and channel-to-channel error - ensures uniform brightness across multi-LED arrays. |
| Headroom Voltage | 110 mV (typ.) at 25.5 mA - minimizes voltage overhead, enabling operation with low-Vf LEDs or tight supply margins. |
| PWM Frequency | 24 kHz (audible-noise-free) - eliminates perceptible flicker and acoustic noise in consumer audio-adjacent devices. |
| I²C Interface | Up to 1 MHz Fast-mode Plus - enables rapid register writes for dynamic animation updates without bus contention. |
Pinout & Package
LP5812BYBHR uses a 9-pin DSBGA (YBH) package measuring 1.43 mm × 1.34 mm with 0.4 mm pitch. Thermal pad (A2) is GND-connected for enhanced thermal dissipation in high-density layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| OUT0–OUT3 | Bi-directional output (scan switch + current sink) | Each pin drives one row/column in TCM mode; supports direct-drive of individual LEDs when configured as constant-current sink only. |
| GND | Ground reference and thermal pad | Must be connected to PCB ground plane; serves as primary thermal path for power dissipation. |
| VCC | Power input | Supplies internal logic and LED drive circuitry; requires 22 µF capacitor placed adjacent to pin per TI layout guidelines. |
| SCL / SDA | I²C interface | Supports standard/fast/fast-mode plus timing; compatible with 1.8 V/3.3 V/5 V logic levels without level shifters. |
| SYNC | Multi-device synchronization | Enables frame-aligned lighting effects across multiple LP5812 devices; can be grounded if unused to reduce leakage. |
Key Features
| Feature | Design Value |
|---|---|
| Autonomous animation engine | Executes pre-programmed LED sequences (fade, blink, chase) without MCU polling - reduces host processor load by >90% in static UI states. |
| Configurable TCM drive modes | Supports ¼, ⅓, ½, or 1:1 multiplexing ratios via led_mode register - adapts to 4–12 LED configurations without hardware change. |
| Integrated de-ghosting | Vmid clamping during blank time eliminates visual artifacts in multiplexed RGB matrices - no external diodes or RC networks required. |
| Individual LED diagnostics | Detects open-circuit (70–110 mV threshold) and short-circuit (32–68% of VCC) faults per channel - enables fail-safe UI feedback in wearables. |
| Ultra-low active current | 0.4 mA typical at 25.5 mA LED current - extends battery life in always-on indicator applications like earbud charging cases. |
Applications
| Portable Wearable Indicators | Gaming Peripheral Lighting |
|---|---|
Use Scenario: Real-time status indication on wireless earbuds and charging cases with minimal PCB area. IC Role / Device Role / Timing Role: Matrix LED driver executing autonomous breathing/fade animations via internal engine; synchronizes with host MCU only for state changes. Use Value: Eliminates need for dedicated MCU GPIOs and PWM timers, reducing BOM count and firmware complexity while maintaining <100 ms response latency. |
Use Scenario: Dynamic RGB lighting on gaming mice and VR controllers requiring smooth, non-flickering illumination. IC Role / Device Role / Timing Role: Constant-current sink with 24 kHz PWM dimming and exponential curve option - matches human eye photopic response. Use Value: Delivers flicker-free visual feedback at full brightness without audible coil whine, meeting EN 62471 photobiological safety requirements. |
| Smart Home IoT Devices | Industrial HMI Status Panels |
Use Scenario: Multi-color status ring on video doorbells and smart speakers indicating connectivity, recording, and voice activation. IC Role / Device Role / Timing Role: TCM-driven 4×3 matrix controller with individual dot current and PWM control - enables independent color/brightness per segment. Use Value: Achieves 12 distinct visual zones using only 4 MCU pins and 1 I²C bus, cutting interconnect density by 60% vs discrete drivers. |
Use Scenario: Fault-indicating LED arrays on EV chargers and factory HMIs operating in extended temperature ranges. IC Role / Device Role / Timing Role: Robust LED driver with –40°C to +85°C operation, thermal shutdown (150°C), and open/short detection - ensures reliability in uncontrolled environments. Use Value: Reduces field failure rate by enabling early LED fault detection and graceful degradation (e.g., dimming unaffected segments). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RGB LED driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LP5812ADSDR | Same core functionality; WSON-8 (3 mm × 3 mm) package with exposed thermal pad - higher RθJA (50.8°C/W) vs YBH (113.1°C/W). | Preferred for manual assembly or thermal-limited designs where board space allows larger footprint. | Select LP5812ADSDR when thermal performance under sustained 51 mA loads is prioritized over miniaturization. |
| LP5813BYBHR | Boost-based architecture (vs LP5812BYBHR's linear regulation); supports higher Vf LEDs (>5.5 V) but adds external inductor and increases solution size. | Suitable for multi-color LED strings with mixed forward voltages (e.g., white + red + blue) where Vf exceeds VCC. | Choose LP5813BYBHR only when driving high-Vf LEDs that cannot be accommodated within LP5812BYBHR's 5.5 V VCC limit. |
Compared with LP5812ADSDR, LP5812BYBHR offers superior miniaturization (1.43 mm × 1.34 mm vs 3 mm × 3 mm) at the cost of higher junction-to-ambient thermal resistance; compared with LP5813BYBHR, it eliminates inductor BOM and EMI concerns but restricts maximum LED forward voltage to ≤VCC.
Availability
LP5812BYBHR is available at Aetrix Electronics and suitable for portable wearables, gaming peripherals, smart home IoT devices, and industrial HMI systems requiring stable component supply, long-term lifecycle support, and guaranteed traceability.
Supply support for LP5812BYBHR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of expertise in precision power management and interface solutions.
The LP5812BYBHR belongs to TI's LP58xx family of autonomous LED drivers, engineered specifically for low-power, space-constrained RGB indicator applications in consumer electronics - emphasizing integration, firmware offload, and robust fault handling.
FAQ
What drive topologies does the LP5812BYBHR support?
The LP5812BYBHR supports three configurable drive modes: direct-drive (up to 4 LEDs), time-cross-multiplexing (TCM) for 4×3 matrix (12 LEDs), and mix-drive combining both. Mode selection is controlled via the led_mode bits in Dev_Config_1 register, allowing flexible LED count and layout adaptation without hardware changes. All modes retain LP5812BYBHR's 0.1–51 mA per-channel current control and autonomous animation capability.
How does the LP5812BYBHR achieve ghosting elimination?
The LP5812BYBHR implements hardware-based de-ghosting by clamping OUTx pins to a programmable mid-rail voltage (Vmid) during PWM off and blank time periods. This pre-charges current sinks and pre-discharges scan FETs simultaneously, eliminating both up-side and down-side ghosting in multiplexed matrices. Clamp behavior is enabled by default (clamp_dis = 0) and configurable via clamp_sel and vmid_sel bits in Dev_Config12 register - no external components required for LP5812BYBHR operation.
What is the function of the SYNC pin on the LP5812BYBHR?
The SYNC pin on the LP5812BYBHR enables frame-synchronized lighting effects across multiple devices. When driven externally or used as output, it distributes a common timing reference - allowing coordinated animations (e.g., ripple, wave) without inter-device I²C communication overhead. If unused, SYNC may be grounded to reduce standby current; floating is not recommended. The LP5812BYBHR's internal 6 MHz oscillator can also drive SYNC as output to daisy-chain timing.
Does the LP5812BYBHR support both analog and PWM dimming?
Yes, the LP5812BYBHR supports dual dimming methods: 8-bit analog dimming via individual Dot Current (DC) registers combined with global 1-bit Maximum Current (MC) selection (25.5 mA or 51 mA), and 8-bit PWM dimming with selectable linear or exponential curves. PWM frequency is fixed at 24 kHz (audible-noise-free) or 12 kHz depending on pwm_fre bit setting - both fully configurable per LED channel in LP5812BYBHR's register map.
What fault detection capabilities does the LP5812BYBHR provide?
The LP5812BYBHR integrates per-channel LED open and short detection. Open detection triggers when voltage across an LED drops below 70–110 mV (configurable by current level); short detection activates when cathode voltage exceeds 32–68% of VCC (set by lsd_th bits). Detection status is reported in dedicated LOD/LSD flag registers, enabling host MCU to initiate corrective action - such as disabling faulty segments or logging errors - without external sensing circuitry in LP5812BYBHR designs.
LP5812BYBHR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 9-BGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Linear
- Topology:
- Constant Current
- Internal Switch(s):
- Yes
- Number of Outputs:
- 4
- Voltage - Supply (Min):
- 500mV
- Voltage - Supply (Max):
- 5.5V
- Voltage - Output:
- 0V ~ 5.5V
- Current - Output / Channel:
- 51mA
- Frequency:
- 500kHz, 1MHz
- Dimming:
- Analog, I2C, PWM
- Applications:
- General Purpose
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 9-DSBGA (1.43x1.43)
LP5812BYBHR FAQ
1.How can I place an order for LP5812BYBHR through Aetrix?
Please submit a Request for Quotation (RFQ) for LP5812BYBHR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LP5812BYBHR reliable?
The price and inventory of LP5812BYBHR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LP5812BYBHR is usually 5 days.
3.What payment methods are accepted for LP5812BYBHR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LP5812BYBHR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LP5812BYBHR?
LP5812BYBHR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LP5812BYBHR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LP5812BYBHR?
For technical support, including LP5812BYBHR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LP5812BYBHR requirements.
6.How does Aetrix verify that LP5812BYBHR is sourced from the original manufacturer or authorized distributors?
All LP5812BYBHR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LP5812BYBHR meets industry standards.
7.What is the process for return or replacement of LP5812BYBHR?
All LP5812BYBHR units undergo pre-shipment inspection (PSI). If there is an issue with LP5812BYBHR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LP5812BYBHR part is unused and in its original packaging.
Return procedure for LP5812BYBHR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LP5812BYBHR Tags
-
BCR402RE6327HTSA1
Infineon Technologies
-
BCR430UXTSA2
Infineon Technologies
-
BCR420UE6433HTMA1
Infineon Technologies
-
BCR420UE6327HTSA1
Infineon Technologies
-
BCR421UE6327HTSA1
Infineon Technologies
-
LYT1604D-TL
Power Integrations
-
HV9910CLG-G
Microchip Technology
-
CL2N8-G
Microchip Technology
-
BCR420UW6-7
Diodes Incorporated
-
BCR421UW6-7
Diodes Incorporated
-
BCR420UFD-7
Diodes Incorporated
-
BCR421UFD-7
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
