Texas Instruments LP5862DBTR

Overview

LP5862DBTR from Texas Instruments is a 2 × 18 LED matrix driver IC with integrated 18 constant-current sinks and two high-side PMOS scan switches, supporting up to 36 individually addressable LED dots or 12 RGB pixels. It delivers 50 mA per sink at VCC ≥ 3.3 V, ±5% device-to-device and channel-to-channel current accuracy, and supports both 8-bit analog dimming and 8-/16-bit PWM dimming with >20 kHz audible-noise-free frequency - enabling precise, flicker-free lighting control in compact consumer audio and gaming peripherals.

For engineers reviewing the LP5862DBTR datasheet, LP5862DBTR pinout, LP5862DBTR application, or LP5862DBTR equivalent, key selection considerations include its TSSOP-38 package with dual scan-line topology, I²C (1 MHz) and SPI (12 MHz) interface flexibility, full SRAM-based frame buffering, open/short LED detection, and deghosting circuitry for reliable matrix operation under dynamic brightness transitions.

Technical Context

The LP5862DBTR implements time-multiplexed scanning using two configurable high-side PMOS switches (SW0/SW1) and 18 current sinks (CS0–CS17), enabling 36-dot matrix drive via sequential line activation. Its internal 32 MHz oscillator feeds programmable PWM generators with selectable 62.5 kHz or 125 kHz base frequencies and per-dot phase shifting to balance transient power.

It integrates dedicated deghosting circuitry - including upside discharge and downside pre-charge - plus three-group low-brightness compensation for uniform color rendering across CS0–CS17. All dimming parameters (global MC, per-group CC, per-dot DC, and per-dot PWM) are stored in full-addressable SRAM, allowing partial updates to minimize bus traffic during animation sequences.

Key Specifications

Pinout & Package

TSSOP-38 package (9.70 mm × 4.40 mm) with exposed thermal pad; pin-compatible with LP5862 family but distinct from VQFN-32 variant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LED matrix driver applications.

Compared with LP5862RSMR, LP5862DBTR trades thermal efficiency for through-hole-compatible assembly and higher power handling per package; versus LP5864DBTR, it offers lower cost and simpler firmware for sub-72-dot applications without sacrificing interface flexibility or diagnostic features.

Availability

LP5862DBTR is available at Aetrix Electronics and suitable for keyboard backlighting, smart speaker status rings, and audio mixer channel meters requiring stable component supply, long-term industrial availability, and guaranteed traceable sourcing.

Supply support for LP5862DBTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and high-reliability power management solutions for industrial, automotive, and consumer markets.

The LP586x product line was designed specifically for high-fidelity, low-noise LED matrix control in human-interface devices - emphasizing precision current matching, flicker-free PWM, and integrated diagnostics to reduce system-level design complexity.

FAQ

What is the maximum LED current supported by the LP5862DBTR?

The LP5862DBTR supports up to 50 mA per constant-current sink when VCC ≥ 3.3 V. This rating is confirmed in the Electrical Characteristics table under ICS parameter, with typical operation at 50 mA and ±5% channel-to-channel matching. At lower VCC (2.7 V ≤ VCC < 3.3 V), the maximum sink current is reduced to 40 mA. The LP5862DBTR maintains this current accuracy across its full operating temperature range of –40°C to +85°C.

Does the LP5862DBTR support both I²C and SPI interfaces simultaneously?

No, the LP5862DBTR does not support simultaneous I²C and SPI operation. Interface selection is controlled by the IFS pin: logic low configures I²C (SCL_SCLK, SDA_MOSI, ADDR0_MISO, ADDR1_SS), while logic high enables SPI (SCL_SCLK as SCLK, SDA_MOSI as MOSI, ADDR0_MISO as MISO, ADDR1_SS as SS). The LP5862DBTR's shared pin architecture requires hardware-level configuration at power-up; switching mid-operation is not supported.

How does the LP5862DBTR implement deghosting in matrix LED applications?

The LP5862DBTR implements dual-path deghosting: upside deghosting discharges inactive scan lines using SW0/SW1 clamping, while downside deghosting pre-charges inactive current sinks (CS0–CS17) before activation. Both functions are programmable via Up_Deghost and Down_Deghost bits in Dev_config3 register. This eliminates unintended LED turn-on during multiplexed scanning - a common issue in 2×18 topologies - without requiring external capacitors or timing controllers.

Can the LP5862DBTR drive RGB LEDs, and how is color balancing achieved?

Yes, the LP5862DBTR can drive 12 RGB LEDs (36 channels) using its 18 current sinks and 2 scan switches in time-multiplexed mode. Color balancing is achieved through three independent 7-bit Color Current (CC) registers - one per primary color group - and per-dot 8-bit Dot Current (DC) correction. Combined with ±5% channel-to-channel current matching and group-based low-brightness compensation, this enables accurate white-point tuning and uniform chromaticity across all 36 outputs.

What thermal management considerations apply to the LP5862DBTR in TSSOP-38 package?

The LP5862DBTR in TSSOP-38 has a junction-to-ambient thermal resistance (RθJA) of 67.0°C/W, significantly higher than the VQFN-32 variant (32.9°C/W). To maintain safe operation at full 50 mA per sink, PCB layout must include generous copper pour connected to the exposed thermal pad (GND), minimum 4 thermal vias (0.3 mm diameter), and avoidance of nearby heat sources. Thermal shutdown activates at 150°C with 15°C hysteresis, and derating is recommended above 60°C ambient.