Texas Instruments LP5907UVX19/NOPB

Overview

LP5907UVX19/NOPB from Texas Instruments is a 250mA, low-noise, low-I_Q LDO voltage regulator with fixed 1.9V output, designed for RF and analog power rails in portable electronics. It operates from 2.2V to 5.5V input, delivers ±2% output voltage accuracy, achieves 120mV typical dropout at 250mA (DSBGA), and maintains <6.5µV_RMS output noise without a bypass capacitor - enabling clean power for PLLs, ADCs, and RF transceivers in smartphones and digital cameras.

For engineers reviewing the LP5907UVX19/NOPB datasheet, LP5907UVX19/NOPB pinout, LP5907UVX19/NOPB application, or LP5907UVX19/NOPB equivalent, this page provides verified package mapping (YKE DSBGA-4), confirmed thermal performance (R_θJA = 206.1°C/W), real-world transient response data (±40mV load step), PSRR (82dB @ 1kHz), and validated alternative options for low-noise LDO replacement in space-constrained designs.

Technical Context

The LP5907UVX19/NOPB uses an NMOS pass transistor architecture with internal bandgap reference filtering and a first-order RC noise-reduction network (–3dB at ~0.1Hz), enabling ultra-low noise without external bypass capacitors. Its enable logic includes a 1MΩ internal pulldown resistor and defined VIH/VIL thresholds (1.2V/0.4V) for reliable sequencing in multi-rail systems.

It supports remote output capacitor placement up to 10cm from the device while maintaining stability with only 1µF ceramic input and output capacitance - a key advantage over conventional LDOs requiring tighter layout constraints or larger bulk capacitance. Thermal shutdown activates at 160°C with 15°C hysteresis to protect against sustained overload.

Key Specifications

Pinout & Package

LP5907UVX19/NOPB is packaged in YKE - a 4-pin, 0.685mm × 0.685mm DSBGA (Die Size Ball Grid Array) with bottom-side solder balls. This ultra-compact wafer-level chip-scale package minimizes PCB footprint and thermal resistance (R_θJB = 37.0°C/W), ideal for thin mobile devices.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar low-noise LDO applications.

Compared with LP5907UVX19/NOPB, TPL720F19-DBVR trades current capability and package size for legacy SOT-23 compatibility, while TPS7A2019PDBVR improves IQ and output current in a marginally larger but pin-compatible X2SON package - making it a forward-compatible upgrade path for new designs.

Availability

LP5907UVX19/NOPB is available at Aetrix Electronics and suitable for smartphone RF modules, digital camera sensor biasing, factory automation sensor nodes, wearable health monitors, and industrial imaging systems requiring stable component supply with guaranteed long-term availability.

Supply support for LP5907UVX19/NOPB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of experience in high-reliability power solutions.

The LP5907UVX19/NOPB belongs to TI's LP5907 family of ultra-low-noise LDOs engineered specifically for RF and high-precision analog applications where power supply noise directly impacts system-level signal integrity.

FAQ

What is the maximum output current supported by the LP5907UVX19/NOPB?

The LP5907UVX19/NOPB supports a continuous output current of up to 250mA. This rating applies across the full operating temperature range (–40°C to +125°C junction) and is validated for the YKE DSBGA-4 package. At 250mA, the typical dropout voltage is 120mV, and thermal performance remains within safe limits when PCB layout follows TI's recommended copper pour guidelines for the thermal pad.

Does the LP5907UVX19/NOPB require an external noise bypass capacitor?

No, the LP5907UVX19/NOPB does not require an external noise bypass capacitor. Its internal design incorporates a first-order RC filter on the bandgap reference, achieving <6.5µV_RMS output noise (10Hz–100kHz) without any additional capacitor. This eliminates BOM cost, saves PCB area, and removes a potential source of layout-induced instability present in traditional LDOs.

What package type is used for the LP5907UVX19/NOPB?

The LP5907UVX19/NOPB is supplied in the YKE package - a 4-ball, 0.685mm × 0.685mm DSBGA (Die Size Ball Grid Array). This wafer-level chip-scale package features bottom-side solder balls, minimal footprint, and optimized thermal performance (R_θJB = 37.0°C/W), making it ideal for ultra-thin portable electronics where space and thermal efficiency are critical.

Can the output capacitor be placed remotely from the LP5907UVX19/NOPB?

Yes, the LP5907UVX19/NOPB supports remote placement of its 1µF ceramic output capacitor up to 10cm from the device. This capability is enabled by its robust internal compensation and stability architecture, allowing physical separation of the capacitor from the LDO to reduce noise coupling in RF-sensitive layouts - a feature confirmed in TI's official datasheet Section 6.3.4.

What is the enable logic behavior of the LP5907UVX19/NOPB?

The LP5907UVX19/NOPB features active-high enable logic with an internal 1MΩ pulldown resistor on the EN pin (B1), ensuring the device remains off by default. It turns on when EN voltage exceeds 1.2V (VIH) and shuts down when EN falls below 0.4V (VIL). During shutdown, an internal 230Ω pulldown resistor actively discharges the output capacitor to GND, preventing floating voltage conditions on downstream circuitry.