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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Voltage Regulators - DC DC Switching Regulators

Texas Instruments LP875484YFQR

Name: LP875484YFQR
Brand: Texas Instruments
SKU: LP875484YFQR
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: LP875484YFQR

Manufacturer:: Texas Instruments

Category:: Voltage Regulators - DC DC Switching Regulators

Package:: 49-WFBGA, DSBGA

Datasheet:: LP875484YFQR.pdf

Description:: IC REG BUCK PROG 10A HEX 49DSBGA

Quantity:: RFQ Add To RFQ list

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Product details

Overview

LP875484YFQR from Texas Instruments is a six-phase, high-efficiency step-down DC/DC converter IC designed for processor core power delivery in mobile applications. It integrates six synchronous buck cores bundled into a single 6-phase architecture, supports up to 10 A total output current, delivers programmable output voltage from 0.6 V to 1.67 V in 10-mV steps, and operates with switching frequency of 2.7–3.4 MHz. It is used in smartphone application processors requiring dynamic voltage scaling (DVS) and precise remote differential sensing.

For engineers reviewing the LP875484YFQR datasheet, LP875484YFQR pinout, LP875484YFQR application, or LP875484YFQR equivalent, this page provides verified technical context on its multi-phase buck operation, I²C-controlled phase adding/shedding, load current reporting capability, remote sensing implementation, and thermal warning/overcurrent protection behavior - all critical for power integrity validation in compact portable designs.

Technical Context

The LP875484YFQR implements a fully synchronized 6-phase interleaved buck topology where six independent buck cores are time-shifted by 60° to reduce input/output ripple and improve transient response. Each core features integrated high-side and low-side MOSFETs with typical R_DS(on) of 60 mΩ (PFET) and 50 mΩ (NFET), enabling high efficiency across wide load ranges via automatic PWM/PFM mode transitions and dynamic phase shedding (down to one active phase) below 30 mA.

It supports dual I²C interfaces - System Bus (SDASYS/SCLSYS) and DVS Bus (SDASR/SCLSR) - each configurable with four selectable addresses (60h–63h), enabling concurrent control of power sequencing and real-time voltage scaling. Remote differential feedback (FBB0+/B0 and FBB0−/B1) compensates for PCB IR drop at the point-of-load, maintaining ±2.5% output accuracy in PWM mode under 10 A load.

Key Specifications

Parameter	Value and Actual Design Meaning
Output Voltage Range	0.6 V to 1.67 V, programmable in 10-mV steps - enables precise core voltage tuning for ARM Cortex-A series and similar SoCs.
Total Output Current	Up to 10 A combined - achieved via interleaved 6-phase operation with per-phase current limit of 2.6 A (typical).
Switching Frequency	2.7–3.4 MHz - allows use of small 0.25–1 µH inductors and reduces EMI through spread-spectrum and phase control.
Feedback Accuracy	±2.5% in PWM mode (VOUT = 0.6–1.67 V, IOUT ≤10 A) - maintained via remote differential sensing to reject PCB trace resistance error.
I²C Interface Speed	Supports Standard (100 kHz), Fast (400 kHz), and High-Speed (3.4 MHz) modes - enables fast DVS updates during CPU frequency transitions.
Thermal Protection	Two-stage thermal monitoring: first warning at 85°C (interrupt only), second at 120°C (flag + interrupt), shutdown at 150°C - critical for sustained high-current operation in thermally constrained handsets.
Load Transient Response	±20 mV deviation for 0.6 A →2 A →0.6 A step (400 ns); ±60 mV for 1 A →8 A →1 A step - ensures stable core supply during burst-mode CPU activity.

Pinout & Package

LP875484YFQR is packaged in a 49-ball DSBGA (YFQ) with 0.4-mm pitch and maximum body size of 3.022 mm × 2.882 mm. The package supports fine-pitch routing and high-density integration in mobile PCBs.

Pin/Terminal	Circuit Role	Design Meaning
VINB0/B1, VINB2, VINB3/B4, VINB5	Input power supply pins per buck core group	Must be externally connected together and locally bypassed - separate VIN pins prevent internal coupling and enable optimized layout for each phase group.
SWB0–SWB5	Buck switch node outputs	Connect to respective external inductors; each SW pin drives one phase - interleaving reduces peak input current and output ripple.
FBB0+/B0 & FBB0−/B1	Remote differential feedback inputs	Connect directly to processor VDD/VSS sense points - eliminates voltage error caused by PCB trace resistance between regulator and SoC.
SDASYS / SCLSYS	System I²C interface	Configurable address (60h–63h) via ADDR pin - used for configuration, status readback (including per-core load current), and fault monitoring.
SDASR / SCLSR	DVS I²C interface	Independent bus for real-time voltage scaling commands - allows host processor to adjust VOUT without disrupting system bus traffic.
INT	Open-drain interrupt output	Active-low signal indicating thermal warning, overcurrent, or power-good fault - enables immediate firmware response to critical events.
NSLP	Low-power mode control	Active-low input that forces entry into Low-Power PFM mode - used for ultra-low quiescent current (130 µA) during deep sleep states.

Key Features

Feature	Design Value
6-phase interleaved buck architecture	Reduces input RMS current by ~70% vs. single-phase design, lowering capacitor stress and EMI emissions.
Programmable phase adding/shedding thresholds	Phase count dynamically scales from 1 to 6 based on load (e.g., ADD_PH_B0 = 1000 mA, SHED_PH_B0 = 700 mA) - maximizes light-load efficiency.
Integrated current sensing without sense resistors	Reports total load current and per-core current via I²C read-back - eliminates board space and power loss from external shunts.
Spread-spectrum and phase-offset EMI reduction	Combines 60° phase shift between channels and frequency dithering - meets stringent radiated emission limits in handheld RF environments.
Auto PWM/PFM and forced-PWM modes	Seamlessly transitions between high-efficiency PFM (≤375 mA) and low-noise PWM (>375 mA) - maintains regulation across full operating range.

Applications

Smartphone Application Processor Core Supply	eBook/Tablet SoC Power Delivery
Use Scenario: Delivering tightly regulated, dynamically scaled voltage to ARM-based application processors (e.g., Snapdragon, Exynos) during variable workload states including idle, burst, and video decode. IC Role / Device Role / Timing Role: Primary multi-phase core regulator providing VDD_CPU with remote sensing, DVS command execution, and real-time load current telemetry. Use Value: Enables >90% efficiency at 1–8 A loads while maintaining <±20 mV transient deviation - directly extending battery life and preventing thermal throttling.	Use Scenario: Powering application SoCs in 7–10 inch tablets and eReaders where thermal headroom is limited and standby current must be minimized. IC Role / Device Role / Timing Role: Six-phase buck controller managing VDD_MAIN rail with automatic phase shedding to sustain 130 µA quiescent current in deep sleep. Use Value: Achieves 3× longer standby time vs. discrete solutions by eliminating external current-sense resistors and enabling sub-30 mA Low-Power PFM operation.
GSM/LTE Handset Baseband Power	Gaming Handheld SoC Regulation
Use Scenario: Supplying clean, low-noise power to baseband processors in cellular handsets operating across GSM, WCDMA, LTE, and CDMA bands. IC Role / Device Role / Timing Role: Core voltage regulator with spread-spectrum clocking and phase control to suppress switching noise near sensitive RF receivers. Use Value: Reduces conducted EMI by >10 dB in 100–500 MHz band - avoids desensitization of cellular front-end modules during simultaneous transmit/receive.	Use Scenario: Supporting high-performance gaming SoCs (e.g., NVIDIA Tegra, Qualcomm Adreno GPU cores) requiring rapid voltage scaling during frame-rate transitions. IC Role / Device Role / Timing Role: Dual-bus I²C-controlled regulator executing DVS commands within <25 µs of NRST assertion - enabling sub-100 µs voltage ramp-up for GPU boost states. Use Value: Delivers 10 A peak current with <±60 mV overshoot during 1→8 A load steps - prevents GPU pipeline stalls and frame drops during intensive rendering.

Smartphone Application Processor Core Supply

eBook/Tablet SoC Power Delivery

Use Scenario: Delivering tightly regulated, dynamically scaled voltage to ARM-based application processors (e.g., Snapdragon, Exynos) during variable workload states including idle, burst, and video decode.

IC Role / Device Role / Timing Role: Primary multi-phase core regulator providing VDD_CPU with remote sensing, DVS command execution, and real-time load current telemetry.

Use Value: Enables >90% efficiency at 1–8 A loads while maintaining <±20 mV transient deviation - directly extending battery life and preventing thermal throttling.

Use Scenario: Powering application SoCs in 7–10 inch tablets and eReaders where thermal headroom is limited and standby current must be minimized.

IC Role / Device Role / Timing Role: Six-phase buck controller managing VDD_MAIN rail with automatic phase shedding to sustain 130 µA quiescent current in deep sleep.

Use Value: Achieves 3× longer standby time vs. discrete solutions by eliminating external current-sense resistors and enabling sub-30 mA Low-Power PFM operation.

GSM/LTE Handset Baseband Power

Gaming Handheld SoC Regulation

Use Scenario: Supplying clean, low-noise power to baseband processors in cellular handsets operating across GSM, WCDMA, LTE, and CDMA bands.

IC Role / Device Role / Timing Role: Core voltage regulator with spread-spectrum clocking and phase control to suppress switching noise near sensitive RF receivers.

Use Value: Reduces conducted EMI by >10 dB in 100–500 MHz band - avoids desensitization of cellular front-end modules during simultaneous transmit/receive.

Use Scenario: Supporting high-performance gaming SoCs (e.g., NVIDIA Tegra, Qualcomm Adreno GPU cores) requiring rapid voltage scaling during frame-rate transitions.

IC Role / Device Role / Timing Role: Dual-bus I²C-controlled regulator executing DVS commands within <25 µs of NRST assertion - enabling sub-100 µs voltage ramp-up for GPU boost states.

Use Value: Delivers 10 A peak current with <±60 mV overshoot during 1→8 A load steps - prevents GPU pipeline stalls and frame drops during intensive rendering.

Equivalent & Alternatives

The following parts are listed as comparable options for similar multi-phase buck converter applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
TPS659122YFFR	Single-chip PMIC with 4 buck + 5 LDOs; 6-A max buck output; no remote sensing; fixed 1-MHz switching.	Targeted at lower-complexity handsets with integrated analog functions; lacks per-core current reporting and phase-shedding granularity.	Choose when system requires mixed power rails (LDOs + bucks) and thermal budget permits lower switching frequency.
RTQ2136A-QT	Automotive-grade 6-phase buck; 12-A max; supports 0.3–1.5 V output; includes ASIL-B functional safety features.	Designed for automotive infotainment SoCs; requires ISO 26262 compliance support and higher junction temperature rating (150°C).	Choose for automotive applications needing AEC-Q100 Grade 2 qualification and safety mechanisms - not suitable for consumer mobile due to larger footprint and cost.

Compared with TPS659122YFFR and RTQ2136A-QT, the LP875484YFQR uniquely balances mobile-optimized features - including dual I²C buses for concurrent DVS/system control, remote differential sensing, and granular phase management - making it the preferred choice for high-end smartphone and tablet SoC core regulation where efficiency, size, and dynamic response are critical.

Availability

LP875484YFQR is available at Aetrix Electronics and suitable for smartphone application processor core supplies, tablet SoC power delivery, and LTE/GSM handset baseband power systems requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for LP875484YFQR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of expertise in power management ICs for portable and wireless applications.

The LP875484YFQR belongs to TI's LP87xx family of highly integrated power management ICs designed specifically for advanced mobile processors - emphasizing multi-phase efficiency, dynamic voltage scaling, and system-level power intelligence in space-constrained form factors.

FAQ

What is the maximum continuous output current supported by the LP875484YFQR?

The LP875484YFQR supports up to 10 A total continuous output current when all six phases operate in parallel under proper thermal conditions. This assumes adequate PCB copper area, thermal vias, and ambient temperature ≤85°C. At 125°C junction temperature, sustained current is thermally limited - thermal design must ensure TJ remains below 125°C per datasheet Section 6.4. The LP875484YFQR achieves this via phase shedding and thermal warning flags to enable firmware-driven current derating.

Does the LP875484YFQR support remote differential voltage sensing, and how is it implemented?

Yes, the LP875484YFQR supports true remote differential voltage sensing using dedicated pins FBB0+/B0 (positive) and FBB0−/B1 (negative). These pins connect directly to the processor's VDD and VSS sense points at the SoC package, compensating for IR drop across PCB power traces. This ensures output voltage accuracy remains within ±2.5% in PWM mode regardless of trace resistance - a key requirement for modern low-voltage, high-current mobile processors. The LP875484YFQR does not require external op-amps or resistive dividers for this function.

How does the LP875484YFQR manage efficiency across varying load conditions?

The LP875484YFQR uses three complementary techniques: automatic PWM/PFM mode switching, dynamic phase adding/shedding, and low-power PFM mode. Below ~375 mA, it enters PFM mode for >90% efficiency at light loads; above that, it transitions to PWM. Phase count scales from 1 to 6 based on load (e.g., shed at 700 mA, add at 1000 mA), minimizing switching losses. The LP875484YFQR also supports forced-PWM for noise-sensitive applications. All modes are configurable via I²C registers.

What I²C interfaces does the LP875484YFQR provide, and how are they used?

The LP875484YFQR provides two independent I²C interfaces: System Bus (SDASYS/SCLSYS) and DVS Bus (SDASR/SCLSR). The System Bus handles configuration, status monitoring (including per-core load current), and fault reporting. The DVS Bus accepts real-time voltage scaling commands from the host processor - enabling sub-100 µs VOUT adjustments during CPU frequency changes. Both buses support Standard (100 kHz), Fast (400 kHz), and High-Speed (3.4 MHz) modes and share the same four selectable addresses (60h–63h) set by the ADDR pin.

What thermal protection features are built into the LP875484YFQR?

The LP875484YFQR includes three-tier thermal protection: a first thermal warning flag at 85°C (generates INT pulse only), a second thermal warning at 120°C (sets flag and asserts INT), and thermal shutdown at 150°C. Hysteresis is 10°C for warnings and 25°C for shutdown. These thresholds are monitored continuously and reported via I²C status registers. When the second warning triggers, the host must reduce load current immediately to avoid shutdown - a critical safeguard for sustained high-current operation in thermally dense mobile PCBs. The LP875484YFQR relies on accurate PCB thermal design to maintain safe junction temperatures.

LP875484YFQR Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: -

Package/Case:: 49-WFBGA, DSBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Function:: Step-Down

Output Configuration:: Positive

Topology:: Buck

Output Type:: Programmable

Number of Outputs:: 6

Voltage - Input (Min):: 2.5V

Voltage - Input (Max):: 5V

Voltage - Output (Min/Fixed):: 0.6V

Voltage - Output (Max):: 1.67V

Current - Output:: 10A

Frequency - Switching:: 3MHz

Synchronous Rectifier:: Yes

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 49-DSBGA

LP875484YFQR FAQ

1.How can I place an order for LP875484YFQR through Aetrix?

Please submit a Request for Quotation (RFQ) for LP875484YFQR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LP875484YFQR reliable?

The price and inventory of LP875484YFQR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LP875484YFQR is usually 5 days.

3.What payment methods are accepted for LP875484YFQR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LP875484YFQR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LP875484YFQR?

LP875484YFQR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LP875484YFQR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LP875484YFQR?

For technical support, including LP875484YFQR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LP875484YFQR requirements.

6.How does Aetrix verify that LP875484YFQR is sourced from the original manufacturer or authorized distributors?

All LP875484YFQR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LP875484YFQR meets industry standards.

7.What is the process for return or replacement of LP875484YFQR?

All LP875484YFQR units undergo pre-shipment inspection (PSI). If there is an issue with LP875484YFQR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LP875484YFQR part is unused and in its original packaging.

Return procedure for LP875484YFQR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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