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Texas Instruments LP8755KME/NOPB
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- Part No.:
- LP8755KME/NOPB
- Manufacturer:
- Texas Instruments
- Package:
- 49-WFBGA, DSBGA
- Datasheet:
-
LP8755KME/NOPB.pdf
- Description:
- IC REG BUCK PROG 15A HEX 49DSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,205
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Product details
Overview
LP8755KME/NOPB from Texas Instruments is a six-phase, multi-core step-down DC-DC converter IC designed for high-efficiency power delivery to application processors in mobile devices. It delivers up to 15 A total output current across six bundled buck cores, supports 0.6 V to 1.67 V programmable output voltage, operates at up to 4 MHz switching frequency, and integrates remote differential voltage sensing for precise point-of-load regulation in smartphones and tablets.
For engineers reviewing the LP8755KME/NOPB datasheet, LP8755KME/NOPB pinout, LP8755KME/NOPB application, or LP8755KME/NOPB equivalent, key selection considerations include phase-add/shed thresholds (300–1000 mA), load-current reporting capability, I²C-compatible interface with four address options, and thermal warning flag support for system-level power management.
Technical Context
The LP8755KME/NOPB implements a fully synchronous, current-mode controlled 6-phase buck architecture with automatic phase adding/shedding and dual-mode operation (PWM/PFM). Each core features integrated high-side and low-side MOSFETs with typical RDS(ON) of 60 mΩ (PFET) and 50 mΩ (NFET), enabling high efficiency across 0.5 mA to 15 A load range.
It uses SmartReflex™-compatible DVS control via dedicated SR interface or standard I²C (100/400 kHz/3.4 MHz), supports programmable overcurrent protection per core (2.7–3.7 A high-side limit), and includes remote feedback pins (FBB0+/B0 and FBB0−/B1) for IR-drop compensation - critical for sub-1V processor core rails.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Current | 15 A total (six phases combined); enables single-rail high-current CPU/GPU core supply without external parallel controllers. |
| Output Voltage Range | 0.6 V to 1.67 V in 10-mV steps; supports dynamic voltage scaling for ARM Cortex-A series and similar application processors. |
| Switching Frequency | Up to 4.5 MHz (typ. 4 MHz at VOUT ≥ 0.8 V); allows use of ultra-small 0.25–1 µH inductors and compact 30–50 µF ceramic output capacitance. |
| Efficiency Peak | ≥90% at 1–5 A load (VIN = 3.8 V); achieved via adaptive phase shedding and auto PWM/PFM mode transition. |
| Remote Sensing | Differential feedback (FBB0+/B0 & FBB0−/B1); compensates PCB trace IR drop to maintain ±0.5% output accuracy at point-of-load. |
| I²C Interface | Supports Standard (100 kHz), Fast (400 kHz), and High-Speed (3.4 MHz) modes; four selectable addresses (60h–63h) enable multi-device bus sharing. |
| Thermal Protection | Two-stage OTP warning (first at 105°C, second at 120°C); triggers interrupt and enables host-controlled throttling before 125°C junction limit. |
Pinout & Package
LP8755KME/NOPB is housed in a 49-pin DSBGA (YFQ) package measuring 3.022 mm × 2.882 mm with 0.4-mm pitch. The package features an exposed thermal pad on the bottom for enhanced PCB heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VINB0/B1, VINB2, VINB3/B4, VINB5 | Input power supply for respective buck cores | Separate VIN pins per core group must be externally tied together and locally bypassed; enables flexible layout and reduced input ripple coupling. |
| SWB0–SWB5 | Switch node outputs | Direct connection points to external inductors; each SW pin drives one buck phase; requires low-inductance routing to minimize EMI. |
| FBB0+/B0 & FBB0−/B1 | Remote differential feedback inputs | Connect to processor VDD/VSS sense pads; enables accurate regulation despite PCB voltage drop between IC and SoC. |
| SDASYS / SCLSYS | I²C system interface | Standard bidirectional data/clock lines; require external 10-kΩ pullups to VIOSYS; support full register read/write including per-core current monitoring. |
| NRST | Reset input | Active-HIGH start-up trigger; initiates soft-start sequence and output voltage ramp; internal POR ensures reliable initialization. |
| INT | Open-drain interrupt output | Signals fault conditions (OCP, OTP, UVLO) or status events (phase add/shed, thermal warning); programmable mask register disables non-critical alerts. |
Key Features
| Feature | Design Value |
|---|---|
| Automatic phase adding/shedding | Configurable thresholds (300–1000 mA add, 300–900 mA shed) dynamically optimize efficiency across 0.5 mA–15 A load range. |
| Load current reporting | I²C-readable total load current and per-core current values - eliminates need for external current-sense resistors or amplifiers. |
| Programmable output ramp rate | 8-step adjustable slew rate (0.23–30 mV/µs) prevents overshoot during startup and enables controlled power sequencing. |
| Spread spectrum & phase control | Reduces peak EMI by dithering switching frequency and offsetting phase timing - simplifies compliance with FCC/CE radiated emission limits. |
| SmartReflex™-compatible DVS interface | Dedicated SDASR/SCLSR pins allow independent voltage scaling control from baseband processor, decoupling power management from main I²C bus. |
Applications
| Smartphone Application Processor Supply | eBook/Tablet SoC Core Rail |
|---|---|
|
Use Scenario: Powering ARM-based application processors (e.g., Qualcomm Snapdragon, MediaTek MT series) requiring dynamic voltage scaling and tight transient response. IC Role / Device Role / Timing Role: Primary 6-phase buck regulator delivering core voltage (VDD_CPU) with remote sensing and real-time load-current telemetry. Use Value: Maintains ±15 mV transient deviation under 400-ns 0.6 A → 2 A load steps while enabling software-controlled DVFS via I²C or DVS interface. |
Use Scenario: Supplying multi-core SoCs in 7–10 inch tablets where board space is constrained but thermal headroom is limited. IC Role / Device Role / Timing Role: Single-chip, high-density 15-A power solution replacing discrete multi-phase controllers and reducing BOM count by >40%. Use Value: 4-MHz operation allows use of 0.47-µH inductors and 33-µF MLCCs, shrinking total solution size by ~35% versus 2-MHz alternatives. |
| Gaming Handheld System-on-Chip | LTE/5G Mobile Baseband Power |
|
Use Scenario: Supporting burst-mode workloads in portable gaming devices with rapid CPU/GPU clock scaling and thermal throttling requirements. IC Role / Device Role / Timing Role: Adaptive 6-phase regulator with dual OTP warning flags and interrupt-driven thermal management for runtime power budgeting. Use Value: Phase shedding below 300 mA and forced-PWM above 1 A ensure >85% efficiency across 100 µA–10 A, extending battery life during mixed-use scenarios. |
Use Scenario: Delivering stable, low-noise power to LTE/5G baseband processors (e.g., Intel XMM, Qualcomm MDM) with stringent ripple and EMI requirements. IC Role / Device Role / Timing Role: Low-ripple, spread-spectrum-enabled buck controller meeting 3GPP RF coexistence specifications for cellular front-end modules. Use Value: <7 mVPP PWM ripple (200 mA load) and programmable phase offsets suppress narrowband EMI peaks, easing RF module integration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-phase buck converter applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS659122YFFR | 4-phase, 12-A max; lacks remote sensing; fixed 0.7–1.52 V output range; no per-core current reporting. | Targeted at lower-power application processors; suitable when thermal margin exceeds 20°C and point-of-load accuracy < ±1% is acceptable. | Select if system uses simpler I²C-only control and does not require SmartReflex™ DVS interface or differential feedback. |
| RTQ2134BGQW | 6-phase, 16-A max; supports 0.3–1.8 V output; includes PMBus interface; higher RDS(ON) (85 mΩ PFET); no built-in thermal warning flags. | Designed for industrial embedded systems with longer qualification cycles; requires external temperature monitoring for safe high-current operation. | Prefer when PMBus compatibility, wider VOUT range, or extended temperature rating (–40°C to +125°C) outweighs loss of integrated thermal alerting. |
Compared with TPS659122YFFR and RTQ2134BGQW, the LP8755KME/NOPB uniquely combines remote differential sensing, per-core current telemetry, and dual-stage thermal warning in a 3-mm DSBGA - making it the only option among the three qualified for high-accuracy, thermally constrained smartphone SoC core rail designs.
Availability
LP8755KME/NOPB is available at Aetrix Electronics and suitable for smartphone power management, tablet SoC core supply, and LTE/5G baseband applications requiring stable component supply, long-term lifecycle support, and automotive-grade reliability screening.
Supply support for LP8755KME/NOPB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with over 50 years of innovation in high-efficiency DC-DC conversion.
The LP8755KME/NOPB belongs to TI's LP87xx family of SmartReflex™-enabled multi-phase power management ICs, engineered specifically for dynamic voltage scaling and thermal-aware power delivery in advanced mobile application processors.
FAQ
What is the maximum continuous output current supported by the LP8755KME/NOPB?
The LP8755KME/NOPB supports up to 15 A total output current when all six phases operate in parallel under proper thermal conditions. This rating assumes adequate PCB copper area, thermal vias to inner layers, and ambient temperature ≤85°C. At 125°C junction limit, sustained current may be thermally limited below 15 A depending on layout and airflow.
Does the LP8755KME/NOPB require external current-sense resistors for load monitoring?
No, the LP8755KME/NOPB does not require external current-sense resistors. It integrates MOSFET RDS(ON)-based current sensing per buck core and provides real-time total load current and individual core current values via its I²C interface - enabling precise telemetry without added BOM cost or board space.
Can the LP8755KME/NOPB be used with a 2.8-V input supply?
Yes, the LP8755KME/NOPB supports input voltages from 2.5 V to 5 V per its recommended operating conditions. At 2.8 V input, the device maintains full functionality including 0.6–1.67 V output programmability, phase add/shed, and I²C communication - though maximum achievable output current decreases due to reduced headroom.
How does the LP8755KME/NOPB handle thermal overload conditions?
The LP8755KME/NOPB implements two-stage thermal protection: a first warning flag triggers at 105°C junction temperature, and a second critical flag activates at 120°C. Both generate interrupts on the INT pin. If the second flag occurs, the host system must reduce load current immediately to prevent shutdown at 125°C - ensuring graceful thermal management without abrupt failure.
Is remote differential voltage sensing mandatory for LP8755KME/NOPB operation?
No, remote differential sensing is optional. The LP8755KME/NOPB can operate in local feedback mode using internal reference, but doing so sacrifices point-of-load accuracy due to PCB trace IR drop. For sub-1V core rails where ±10 mV tolerance is required, connecting FBB0+/B0 and FBB0−/B1 to the processor's sense pads is strongly recommended.
LP8755KME/NOPB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 49-WFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Function:
- Step-Down
- Output Configuration:
- Positive
- Topology:
- Buck
- Output Type:
- Programmable
- Number of Outputs:
- 6
- Voltage - Input (Min):
- 2.5V
- Voltage - Input (Max):
- 5V
- Voltage - Output (Min/Fixed):
- 0.6V
- Voltage - Output (Max):
- 1.67V
- Current - Output:
- 15A
- Frequency - Switching:
- 4MHz
- Synchronous Rectifier:
- Yes
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 49-DSBGA
LP8755KME/NOPB FAQ
1.How can I place an order for LP8755KME/NOPB through Aetrix?
Please submit a Request for Quotation (RFQ) for LP8755KME/NOPB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LP8755KME/NOPB reliable?
The price and inventory of LP8755KME/NOPB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LP8755KME/NOPB is usually 5 days.
3.What payment methods are accepted for LP8755KME/NOPB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LP8755KME/NOPB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LP8755KME/NOPB?
LP8755KME/NOPB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LP8755KME/NOPB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LP8755KME/NOPB?
For technical support, including LP8755KME/NOPB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LP8755KME/NOPB requirements.
6.How does Aetrix verify that LP8755KME/NOPB is sourced from the original manufacturer or authorized distributors?
All LP8755KME/NOPB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LP8755KME/NOPB meets industry standards.
7.What is the process for return or replacement of LP8755KME/NOPB?
All LP8755KME/NOPB units undergo pre-shipment inspection (PSI). If there is an issue with LP8755KME/NOPB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LP8755KME/NOPB part is unused and in its original packaging.
Return procedure for LP8755KME/NOPB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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