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Texas Instruments LP8755KMX/NOPB
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- Part No.:
- LP8755KMX/NOPB
- Manufacturer:
- Texas Instruments
- Package:
- 49-WFBGA, DSBGA
- Datasheet:
-
LP8755KMX/NOPB.pdf
- Description:
- IC REG BUCK PROG 15A HEX 49DSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,850
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Product details
Overview
LP8755KMX/NOPB from Texas Instruments is a six-phase, multi-core step-down DC-DC converter IC designed for high-efficiency power delivery to application processors in mobile devices. It delivers up to 15 A total output current across six bundled buck cores, supports 0.6 V to 1.67 V programmable output voltage, operates at up to 4.5 MHz switching frequency, and features remote differential voltage sensing for point-of-load accuracy - deployed in smartphones and LTE handsets.
For engineers reviewing the LP8755KMX/NOPB datasheet, LP8755KMX/NOPB pinout, LP8755KMX/NOPB application, or LP8755KMX/NOPB equivalent, key selection considerations include phase-add/shed thresholds (300–1000 mA), load-current reporting capability, SmartReflex™/I²C interface support (up to 3.4 MHz), automatic PWM/PFM mode transition, and DSBGA-49 package thermal performance (RθJA = 49.2°C/W).
Technical Context
The LP8755KMX/NOPB integrates six synchronous buck converter cores into a single 6-phase interleaved architecture with shared control logic, enabling dynamic phase adding/shedding based on real-time load current (programmable thresholds from 300 mA to 1000 mA). It uses a dedicated analog feedback loop with remote differential sensing (FBB0+/B0 and FBB0−/B1 pins) to compensate for PCB IR drop and maintain ±2.5% output voltage accuracy under load.
Control is implemented via dual I²C interfaces: one for system-level access (SCLSYS/SDASYS), another for Dynamic Voltage Scaling (SCLSR/SDASR), supporting standard (100 kHz), fast (400 kHz), and high-speed (3.4 MHz) modes. Protection includes per-core overcurrent detection (ILIMITP = 2.7–3.7 A), input OVP, UVLO, OTP (125°C shutdown), and thermal warning flags.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Current | 15 A total (six phases combined); enables single-rail CPU core supply without external parallel converters |
| Output Voltage Range | 0.6 V to 1.67 V in 10-mV steps; supports modern low-voltage SoC core domains (e.g., ARM Cortex-A series) |
| Switching Frequency | 2.7–4.5 MHz (configurable); allows use of sub-500 nH inductors and compact 3.022 mm × 2.882 mm DSBGA layout |
| Efficiency Peak | ≥90% at 1–5 A load (VIN = 3.8 V); achieved via adaptive phase shedding and low-RDS(on) integrated FETs (60 mΩ NFET, 120 mΩ PFET) |
| Feedback Accuracy | ±2.5% over –40°C to 85°C with remote sensing; eliminates >15 mV IR-drop error at 3 A through 50 mΩ PCB trace |
| I²C Interface Speed | Up to 3.4 MHz (High-Speed mode); permits rapid DVS voltage updates during CPU frequency scaling events |
| Thermal Resistance | RθJA = 49.2°C/W (JEDEC High-K board); requires ≥4 thermal vias under exposed die pad for 15 A continuous operation |
Pinout & Package
LP8755KMX/NOPB is housed in a 3.022 mm × 2.882 mm, 49-ball DSBGA (YFQ) package with 0.4-mm pitch and an exposed thermal pad. The package supports high-density mobile PCB layouts and requires solder paste stencil design per TI AN-1112.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VINB0/B1, VINB2, VINB3/B4, VINB5 | Input power rails per buck core group | Must be externally shorted and locally bypassed; independent routing prevents cross-talk between phase groups |
| SWB0–SWB5 | Switch node outputs | Connect directly to inductor; each drives one buck phase; requires tight loop area to minimize EMI |
| FBB0+/B0, FBB0−/B1 | Remote differential feedback inputs | Attach to processor VDD/VSS sense pads; enables <1% load regulation error despite PCB resistance |
| SCLSYS / SDASYS | Primary I²C interface | System host control path; supports four address options (60h–63h) for multi-device bus sharing |
| NRST | Reset input | Active-HIGH start-up trigger; initiates soft-start ramp and register initialization sequence |
Key Features
| Feature | Design Value |
|---|---|
| Automatic phase adding/shedding | Configurable thresholds (300–1000 mA) reduce light-load losses by deactivating unused phases while maintaining transient response |
| Load current reporting | I²C-readable total and per-core current values eliminate need for external current-sense resistors or amplifiers |
| Programmable output voltage ramp rate | 8-step KRAMP control (0.23–30 mV/µs) limits inrush current and prevents overshoot during CPU wake-up |
| Spread spectrum & phase offset control | Reduces peak EMI amplitude by >10 dB; configurable phase shifts enable optimal interleaving for 6-phase ripple cancellation |
| SmartReflex™-compatible DVS interface | Dedicated SCLSR/SDASR pins allow direct connection to processor DVS controller for autonomous voltage scaling |
Applications
| Smartphone Application Processor Supply | eBook SoC Core Rail |
|---|---|
Use Scenario: Powering ARM-based application processors (e.g., Qualcomm Snapdragon, MediaTek MT series) requiring dynamic voltage scaling and sub-1V core voltages. IC Role / Device Role / Timing Role: Primary 6-phase buck regulator delivering 15 A at 0.85 V with <10 µs transient response to CPU frequency changes. Use Value: Enables 30% higher sustained CPU performance vs. single-phase solutions by distributing thermal load across six cores and reducing output ripple by 6×. |
Use Scenario: Supplying low-power application SoCs in e-readers with extended battery life requirements and minimal thermal dissipation. IC Role / Device Role / Timing Role: Efficient multi-phase converter operating in auto PFM mode below 30 mA load, achieving >85% efficiency at 100 µA. Use Value: Extends battery runtime by 22% compared to fixed-frequency buck regulators due to ultra-low quiescent current (2 µA shutdown) and adaptive light-load operation. |
| LTE Handset Baseband Power | Gaming Tablet GPU Core Supply |
Use Scenario: Delivering stable 1.1 V to LTE baseband processors (e.g., Intel XMM, Qualcomm MDM) with stringent noise and transient specifications. IC Role / Device Role / Timing Role: Six-phase regulator with remote sensing and spread-spectrum modulation to meet 3GPP RF emission limits and <±15 mV line transient response. Use Value: Eliminates need for post-regulator LDOs by achieving ±0.5% output regulation under GSM burst load profiles (2 A step @ 217 Hz). |
Use Scenario: Powering discrete GPU cores in Android gaming tablets requiring high peak current (12 A) and fast voltage transitions. IC Role / Device Role / Timing Role: Multi-phase buck with programmable ramp rate (15 mV/µs) and 400-ns load-step response to support GPU clock scaling from 200 MHz to 800 MHz. Use Value: Reduces GPU voltage droop to <20 mV during 1-A/ns transients, preventing frame stutter and enabling consistent 60 FPS rendering. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-phase buck converter applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS659122YFFR | 4-phase, 8-A max; lower integration (no integrated LDO for VIO); 2.5-MHz max fSW | Targeted at lower-power application processors; lacks remote sensing and per-core current readback | Choose when board space is constrained and full 15-A capability is unnecessary; requires external VIO regulation |
| RTQ2131B-QA | 6-phase, 12-A max; automotive AEC-Q200 qualified; no SmartReflex™ interface; only I²C (400 kHz) | Designed for infotainment systems; includes ASIL-B functional safety features not present in LP8755KMX/NOPB | Prefer for automotive designs needing safety certification; avoid for consumer mobile where DVS speed and light-load efficiency dominate |
Compared with TPS659122YFFR and RTQ2131B-QA, the LP8755KMX/NOPB uniquely combines 15-A capacity, SmartReflex™ compatibility, remote sensing, and per-core telemetry - making it the only option for high-end smartphone SoC power where dynamic voltage accuracy and thermal management are co-critical.
Availability
LP8755KMX/NOPB is available at Aetrix Electronics and suitable for smartphone, LTE handset, and gaming tablet designs requiring stable component supply, long-term production continuity, and qualified mobile-grade power management ICs.
Supply support for LP8755KMX/NOPB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and power management technologies with over 50 years of innovation in high-reliability IC design.
The LP8755KMX/NOPB belongs to TI's Power Management Integrated Circuits (PMIC) portfolio, engineered specifically for advanced mobile SoC power delivery - emphasizing efficiency across wide load ranges, minimal PCB footprint, and seamless integration with processor DVS subsystems.
FAQ
What is the maximum continuous output current supported by the LP8755KMX/NOPB?
The LP8755KMX/NOPB supports up to 15 A of continuous output current when all six buck phases operate in parallel under proper thermal conditions (junction temperature ≤125°C). This rating assumes adequate PCB copper area, ≥4 thermal vias under the exposed pad, and input voltage ≥2.5 V. At 5 V input and 1.1 V output, sustained 15 A requires careful thermal design per TI's layout guidelines in SNVSA20A.
Does the LP8755KMX/NOPB support remote voltage sensing, and how is it implemented?
Yes, the LP8755KMX/NOPB supports true remote differential voltage sensing using dedicated pins FBB0+/B0 (positive) and FBB0−/B1 (negative). These must be routed directly to the processor's VDD and VSS sense points to compensate for IR drop across PCB traces. When enabled, this feature maintains output voltage accuracy within ±2.5% across load and temperature - critical for sub-1V SoC core rails where even 10 mΩ trace resistance causes significant error.
How does the LP8755KMX/NOPB handle phase adding and shedding, and can thresholds be customized?
The LP8755KMX/NOPB performs automatic phase adding/shedding based on real-time load current, with programmable thresholds set via I²C registers ADD_PH_B0[2:0] and SHED_PH_B0[2:0]. Thresholds range from 300 mA to 1000 mA in 100-mA increments. This dynamic control minimizes light-load losses while preserving transient response - for example, shedding phases below 400 mA reduces quiescent current by 60% versus forced 6-phase operation.
What I²C interface speeds does the LP8755KMX/NOPB support, and are separate buses required for system and DVS control?
The LP8755KMX/NOPB supports three I²C speeds: standard (100 kHz), fast (400 kHz), and high-speed (3.4 MHz) modes on both its system (SCLSYS/SDASYS) and DVS (SCLSR/SDASR) interfaces. Separate physical buses are not required - either interface can be used for full configuration, but DVS mode is optimized for low-latency voltage updates during CPU frequency scaling. Address selection (60h–63h) allows coexistence of multiple LP8755KMX/NOPB devices on one bus.
Is the LP8755KMX/NOPB pin-compatible with other members of the LP875x family, such as LP8752 or LP8754?
No, the LP8755KMX/NOPB is not pin-compatible with LP8752 or LP8754. It uses a unique 49-ball DSBGA (YFQ) package with distinct pin mapping - including six SWx pins, grouped VIN and GND balls, and dual I²C interfaces - whereas LP8752 (25-ball) and LP8754 (36-ball) use smaller packages with fewer phases and different signal allocations. Board redesign is required for substitution; refer to TI's SNVSA20A pin configuration diagrams for verification.
LP8755KMX/NOPB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 49-WFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Function:
- Step-Down
- Output Configuration:
- Positive
- Topology:
- Buck
- Output Type:
- Programmable
- Number of Outputs:
- 6
- Voltage - Input (Min):
- 2.5V
- Voltage - Input (Max):
- 5V
- Voltage - Output (Min/Fixed):
- 0.6V
- Voltage - Output (Max):
- 1.67V
- Current - Output:
- 15A
- Frequency - Switching:
- 4MHz
- Synchronous Rectifier:
- Yes
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 49-DSBGA
LP8755KMX/NOPB FAQ
1.How can I place an order for LP8755KMX/NOPB through Aetrix?
Please submit a Request for Quotation (RFQ) for LP8755KMX/NOPB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LP8755KMX/NOPB reliable?
The price and inventory of LP8755KMX/NOPB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LP8755KMX/NOPB is usually 5 days.
3.What payment methods are accepted for LP8755KMX/NOPB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LP8755KMX/NOPB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LP8755KMX/NOPB?
LP8755KMX/NOPB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LP8755KMX/NOPB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LP8755KMX/NOPB?
For technical support, including LP8755KMX/NOPB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LP8755KMX/NOPB requirements.
6.How does Aetrix verify that LP8755KMX/NOPB is sourced from the original manufacturer or authorized distributors?
All LP8755KMX/NOPB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LP8755KMX/NOPB meets industry standards.
7.What is the process for return or replacement of LP8755KMX/NOPB?
All LP8755KMX/NOPB units undergo pre-shipment inspection (PSI). If there is an issue with LP8755KMX/NOPB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LP8755KMX/NOPB part is unused and in its original packaging.
Return procedure for LP8755KMX/NOPB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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