NXP Semiconductors LPC1111FHN33/201,5
- Part No.:
- LPC1111FHN33/201,5
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-VQFN Exposed Pad
- Datasheet:
-
LPC1111FHN33/201,5.pdf
- Description:
- IC MCU 32BIT 8KB FLASH 32HVQFN
- Quantity:
- Payment:

- Shipping:

Inventory:1,001
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Product details
Overview
LPC1111FHN33/201 from NXP Semiconductors is an ARM Cortex-M0-based 32-bit microcontroller in a 33-terminal HVQFN package, featuring 8 kB flash, 4 kB SRAM, one UART with RS-485 support, one Fast-mode Plus I²C interface, one SPI, four general-purpose timers, and an 8-channel 10-bit ADC-designed for low-power industrial sensor nodes and embedded control systems.
For engineers reviewing the LPC1111FHN33/201 datasheet, LPC1111FHN33/201 pinout, LPC1111FHN33/201 application, or LPC1111FHN33/201 equivalent, key selection criteria include its 50 MHz CPU clock, 3.3 V single-supply operation (1.8–3.6 V), Deep-sleep mode wake-up via up to 13 GPIO pins, programmable power profiles, and compatibility with ISP/IAP firmware updates.
Technical Context
The LPC1111FHN33/201 implements the ARM Cortex-M0 core with NVIC and SysTick timer, executing instructions at up to 50 MHz using either the internal 12 MHz ±1% RC oscillator or an external crystal (1–25 MHz). Its clock system includes a PLL, programmable watchdog oscillator (7.8 kHz–1.8 MHz), and clock output divider supporting CPU, IRC, system oscillator, or WDT clock reflection.
Power management is handled by an integrated PMU enabling Sleep, Deep-sleep, and Deep power-down modes; the LPC1111FHN33/201 belongs to the LPC1100 series and therefore lacks page-erase In-Application Programming (IAP) and dual-SPI capability-features reserved for LPC1100XL variants-while retaining full UART, I²C, and timer peripheral functionality.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M0, 32-bit RISC, up to 50 MHz operation |
| Flash Memory | 8 kB on-chip flash for program storage, supports ISP/IAP |
| SRAM | 4 kB on-chip SRAM for data and stack operations |
| ADC | 10-bit successive approximation ADC with multiplexing across 8 input channels |
| Timers | Four general-purpose timers: two 32-bit and two 16-bit, each with match/capture capability |
| I/O Pins | 28 GPIO pins with configurable pull-up/pull-down, edge/level interrupt sources, and high-current drive on select pins |
| Supply Voltage | Single 3.3 V supply (operating range: 1.8 V to 3.6 V) |
| Operating Temp | −40 °C to +85 °C (industrial grade) |
Pinout & Package
HVQFN33 package: plastic thermal enhanced very thin quad flat package, no leads, 33 terminals, body size 7 × 7 × 0.85 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Power supply | Main 3.3 V supply input for core and I/O domains |
| VSS | Ground | Digital ground reference for all circuitry |
| RESET | Reset input | Active-low asynchronous reset; can be used as GPIO if external reset not required |
| XTALIN / XTALOUT | Clock input/output | Crystal oscillator connection points for 1–25 MHz external crystal |
| PIO0_0 – PIO0_10 | General-purpose I/O | Configurable digital I/O with interrupt capability; some support UART/I²C/SPI functions |
| PIO1_0 – PIO1_10 | General-purpose I/O | Additional GPIO bank; includes dedicated ISP_UART pins (PIO1_6/7) |
| CLKOUT | Clock output | Programmable output of system oscillator, IRC, CPU, or WDT clock via divider |
Key Features
| Feature | Design Value |
|---|---|
| ARM Cortex-M0 Core | Energy-efficient 32-bit processor with NVIC and SysTick, enabling deterministic real-time response |
| Fast-mode Plus I²C | 1 Mbit/s bus speed with multi-address recognition and monitor mode for robust sensor interfacing |
| RS-485 UART | Fractional baud rate generation and internal FIFO support long-distance industrial serial communication |
| Deep-sleep Wake-up | Dedicated start logic enables wake-up from Deep-sleep mode using any of up to 13 functional GPIO pins |
| Internal RC Oscillator | 12 MHz ±1% trimmed oscillator eliminates need for external crystal in cost-sensitive applications |
| Power Management Unit | Hardware-controlled Sleep, Deep-sleep, and Deep power-down modes reduce active current to µA-range |
Applications
| Industrial Sensor Node | Smart Lighting Controller |
|---|---|
Use Scenario: Battery-powered temperature/humidity node transmitting data over RS-485 to a central gateway. IC Role / Device Role / Timing Role: Main system controller executing sensor acquisition, data formatting, and UART transmission with precise timing via 32-bit timers. Use Value: 4 kB SRAM enables local buffering; Deep-sleep mode extends battery life beyond 5 years with periodic wake-up intervals. | Use Scenario: DALI-compliant LED driver managing dimming profiles and fault reporting in commercial lighting fixtures. IC Role / Device Role / Timing Role: Interface controller handling DALI protocol framing, PWM generation, and analog feedback sampling via 10-bit ADC. Use Value: Fast-mode Plus I²C allows direct connection to ambient light and occupancy sensors; 28 GPIO support multi-channel PWM and status LEDs. |
| POS Terminal Peripheral | Home Appliance UI Module |
Use Scenario: Compact add-on module for receipt printer or barcode scanner interfacing with main POS host via UART. IC Role / Device Role / Timing Role: Protocol bridge translating host commands into printer/scanner control signals with precise timing alignment. Use Value: 8 kB flash stores vendor-specific command parser; 50 MHz CPU ensures sub-millisecond response to host interrupts. | Use Scenario: Control board for microwave oven managing keypad scan, display backlight, and safety interlock monitoring. IC Role / Device Role / Timing Role: Real-time safety supervisor using GPIO interrupts and ADC to verify door latch position and cavity temperature. Use Value: Brownout detection with four thresholds prevents erratic behavior during line sags; 3.3 V single supply simplifies power design. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC1111FHN33/202 | Same 8 kB flash / 4 kB SRAM, but belongs to LPC1100L series with power profiles enabled | Supports optimized Active/Sleep power profiles; suitable where dynamic power scaling is required | Select when application requires runtime power mode switching without firmware overhead |
| LPC1111FHN33/203 | Same memory, but LPC1100XL series adds second SPI and page-erase IAP capability | Enables field firmware updates with minimal flash wear; supports dual SPI peripherals | Select when bootloader flexibility or additional serial interface is needed |
Compared with LPC1111FHN33/201, the /202 variant adds power profile support for adaptive energy management, while the /203 variant introduces page-erase IAP and dual-SPI-neither offers pin-to-pin replacement without firmware or layout review due to functional differences in power control and peripheral enablement.
Availability
LPC1111FHN33/201 is available at Aetrix Electronics and suitable for industrial sensor nodes, smart lighting controllers, and POS terminal peripherals requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.
Supply support for LPC1111FHN33/201 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The LPC111x family-including LPC1111FHN33/201-is designed for cost-sensitive, low-power 32-bit embedded control applications where 8/16-bit MCU limitations in code density, performance, and peripheral integration must be overcome.
FAQ
What is the maximum operating frequency of the LPC1111FHN33/201?
The LPC1111FHN33/201 operates at a maximum CPU frequency of 50 MHz, achievable using either the internal 12 MHz ±1% RC oscillator with PLL multiplication or an external crystal (1–25 MHz) directly driving the system clock. This frequency is fully supported across its −40 °C to +85 °C operating range and enables efficient execution of real-time control algorithms in compact embedded designs.
Does the LPC1111FHN33/201 support In-System Programming (ISP)?
Yes, the LPC1111FHN33/201 supports In-System Programming (ISP) via its built-in ROM bootloader, accessible through UART (using PIO1_6/7 as ISP_RXD/ISP_TXD), I²C, or USB (when paired with external PHY). The bootloader occupies fixed flash space and enables firmware updates without external programming hardware-critical for field-deployed devices where physical access is limited.
How many ADC channels does the LPC1111FHN33/201 provide, and what is their resolution?
The LPC1111FHN33/201 integrates a 10-bit successive approximation ADC with input multiplexing across 8 dedicated analog input pins (AD0–AD7). It supports single-ended conversion only, with programmable sample rates up to 400 kS/s, and is commonly used for sensor signal conditioning, battery voltage monitoring, and user interface feedback in resource-constrained applications.
Is the LPC1111FHN33/201 pin-compatible with other LPC111x HVQFN33 variants?
The LPC1111FHN33/201 shares identical pinout and package dimensions (HVQFN33, 7 × 7 × 0.85 mm) with all other LPC111x HVQFN33 variants-including /202, /203, /101, and /102-enabling mechanical interchangeability. However, functional differences (e.g., power profile enablement, SPI count, IAP features) require firmware validation before substitution in existing designs.
What debug interface does the LPC1111FHN33/201 support?
The LPC1111FHN33/201 supports Serial Wire Debug (SWD) as its primary debug interface, using SWCLK and SWDIO pins for full JTAG-like functionality-including breakpoints, watchpoints, and real-time register/memory access-without requiring additional pins beyond the standard two-wire connection. SWD is compatible with standard ARM debug probes (e.g., SEGGER J-Link, CMSIS-DAP adapters) and integrated development environments like Keil MDK and Arm GCC toolchains.
LPC1111FHN33/201,5 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-VQFN Exposed Pad
- Series:
- LPC1100
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- I2C, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, WDT
- Number of I/O:
- 28
- Program Memory Size:
- 8KB (8K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC1111FHN33/201,5 FAQ
1.How can I place an order for LPC1111FHN33/201,5 through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC1111FHN33/201,5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC1111FHN33/201,5 reliable?
The price and inventory of LPC1111FHN33/201,5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC1111FHN33/201,5 is usually 5 days.
3.What payment methods are accepted for LPC1111FHN33/201,5?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC1111FHN33/201,5 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LPC1111FHN33/201,5?
LPC1111FHN33/201,5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC1111FHN33/201,5 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC1111FHN33/201,5?
For technical support, including LPC1111FHN33/201,5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC1111FHN33/201,5 requirements.
6.How does Aetrix verify that LPC1111FHN33/201,5 is sourced from the original manufacturer or authorized distributors?
All LPC1111FHN33/201,5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC1111FHN33/201,5 meets industry standards.
7.What is the process for return or replacement of LPC1111FHN33/201,5?
All LPC1111FHN33/201,5 units undergo pre-shipment inspection (PSI). If there is an issue with LPC1111FHN33/201,5, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC1111FHN33/201,5 part is unused and in its original packaging.
Return procedure for LPC1111FHN33/201,5:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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