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NXP Semiconductors LPC1112FDH28/102:5

Part No.:
LPC1112FDH28/102:5
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
28-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixLPC1112FDH28/102:5.pdf
Description:
LPC1112 - Scalable 32-bit Microc
Quantity:
Payment:
Payment
Shipping:
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Inventory:8,647

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Product details

Overview

LPC1112FDH28/102 from NXP Semiconductors is a 32-bit ARM Cortex-M0 microcontroller in TSSOP28 package, delivering up to 50 MHz CPU operation, 16 kB flash, 4 kB SRAM, one UART with RS-485 support, one I²C-bus interface, and 22 GPIO pins - deployed in lighting control and alarm systems requiring compact, low-power embedded processing.

For engineers reviewing the LPC1112FDH28/102 datasheet, LPC1112FDH28/102 pinout, LPC1112FDH28/102 application, or LPC1112FDH28/102 equivalent, this page provides verified technical context, package-specific pin functions, power profile support, ADC channel count, and validated alternative options for cost-sensitive industrial MCU selection.

Technical Context

The LPC1112FDH28/102 implements an ARM Cortex-M0 core with Nested Vectored Interrupt Controller (NVIC) and Serial Wire Debug, operating at up to 50 MHz using internal RC oscillator (1 % trimmed) or external crystal (1–25 MHz). It integrates a programmable windowed watchdog timer and Power Management Unit supporting Sleep, Deep-sleep, and Deep power-down modes.

Peripheral integration includes a 10-bit ADC with 6 input channels, four general-purpose timers (two 32-bit, two 16-bit), high-current GPIO drivers (20 mA sink on I²C pins), and configurable open-drain mode - all enabled via boot ROM power profiles specific to the LPC1100L series.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreARM Cortex-M0, enabling Thumb-2 instruction set compatibility and deterministic interrupt latency for real-time control.
Max Clock Frequency50 MHz, achievable via PLL from internal 12 MHz RC oscillator or external crystal - no high-frequency crystal required.
Flash Memory16 kB on-chip flash with ISP/IAP support, sufficient for firmware updates without external programming hardware.
SRAM4 kB SRAM, allocated for stack, heap, and peripheral buffers in resource-constrained embedded applications.
GPIO Pins22 general-purpose I/O pins with configurable pull-up/pull-down and edge/level-sensitive interrupt capability.
ADC10-bit successive approximation ADC with 6 multiplexed input channels, suitable for sensor signal acquisition in white goods.
I²C InterfaceFull I²C-bus specification + Fast-mode Plus (1 Mbit/s), enabling high-speed communication with EEPROMs and sensors.
UARTRS-485/EIA-485 UART with fractional baud rate generation and internal FIFO, supporting robust multi-drop industrial bus networks.

Pinout & Package

TSSOP28 package: plastic thin shrink small outline package, 28 leads, body width 4.4 mm, 1.0 mm maximum height, lead pitch 0.65 mm - optimized for automated PCB assembly and thermal performance in space-constrained designs.

Pin/TerminalCircuit RoleDesign Meaning
1 (VDD)Power supplyPrimary 1.8–3.6 V supply rail; decoupling capacitor placement critical for stable core and analog operation.
2 (PIO0_0/RESET)Reset inputActive-low reset pin; also functions as GPIO0_0 after reset release - enables dual-role board-level reset signaling.
3 (PIO0_1/CLKOUT)Programmable clock outputOutputs system, IRC, CPU, or watchdog clock divided by configurable prescaler - used for timing validation or peripheral sync.
4 (PIO0_2/SSEL0)Slave select for SPI0Enables slave mode on SPI0; supports hardware-controlled chip select for daisy-chained peripherals.
5 (PIO0_3)General-purpose I/OConfigurable as digital input/output with interrupt capability - used for status LEDs or push-button inputs.
6 (PIO0_4/SCL)I²C clock lineOpen-drain output with internal pull-up option; supports Fast-mode Plus 1 Mbit/s data rates in master/slave roles.
7 (PIO0_5/SDA)I²C data lineOpen-drain bidirectional data line; shares same electrical characteristics and timing as SCL for synchronized bus operation.
8 (PIO0_6/SCK0)SPI0 clockMaster or slave clock source for SPI0; polarity and phase configurable per frame for legacy peripheral compatibility.
9 (PIO0_7/CTS)UART clear-to-sendHardware flow control input for UART; asserts when receiver buffer has space - prevents overrun in high-throughput serial links.
10 (PIO0_8/MISO0)SPI0 master-in-slave-outData output from SPI0 slave device; tri-stated when not selected - avoids bus contention in multi-peripheral configurations.
11 (PIO0_9/MOSI0)SPI0 master-out-slave-inData input to SPI0 slave; sampled on SCK edge - supports full-duplex communication with sensors and displays.
12 (PIO0_10/SWCLK)SWD clockJTAG/SWD debug clock input; enables non-intrusive firmware debugging and flash programming during development.
13 (PIO0_11/AD0)ADC input channel 0Analog input for 10-bit ADC; supports single-ended measurement with internal reference - used for temperature or voltage monitoring.
14 (VSS)GroundDigital ground reference; must be connected to PCB ground plane with low-inductance path to minimize noise coupling.
15 (XTALIN)Clock crystal inputConnects to external crystal or oscillator; requires load capacitors per crystal spec - enables precise timing for UART and ADC sampling.
16 (XTALOUT)Clock crystal outputDrives crystal resonator; not available on LPC1112FDH20/102 but present on TSSOP28 variant - confirms oscillator functionality.
17 (R/PIO1_0)ADC input / GPIOShared analog/digital pin; configured as AD1 input or PIO1_0 - allows flexible pin reuse in mixed-signal designs.
18 (R/PIO1_1)ADC input / GPIOShared analog/digital pin; configured as AD2 input or PIO1_1 - expands analog sensing capability without extra pins.
19 (R/PIO1_2)ADC input / GPIOShared analog/digital pin; configured as AD3 input or PIO1_2 - supports multi-channel sensor arrays in compact layouts.
20 (SWDIO/PIO1_3)SWD data I/OBidirectional debug data line; also functions as AD4 and CT32B1_MAT2 - enables debug access without dedicated debug header footprint.
21 (PIO1_4/AD5/WAKEUP)ADC input / wake-up sourceConfigurable as AD5 input or wake-up trigger from Deep-sleep - enables low-power sensor polling with fast wake latency.
22 (PIO1_5/RTS)UART request-to-sendHardware flow control output; signals transmitter readiness - essential for reliable RS-485 half-duplex bus arbitration.
23 (PIO1_6/RXD)UART receive dataAsynchronous serial input; supports RS-485 differential receiver interface - used for command reception in industrial controllers.
24 (PIO1_7/TXD)UART transmit dataAsynchronous serial output; drives RS-485 transceiver DE/RE pins via GPIO - enables full-duplex or half-duplex bus control.
25 (PIO1_8)Timer capture/compareCT16B1_CAP0 input or CT16B1_MAT0 output - supports PWM generation or pulse-width measurement for motor control.
26 (PIO1_9)Timer match outputCT16B1_MAT0 output; generates precise timing events - used for LED dimming or periodic sensor sampling triggers.
27 (PIO1_10/AD6)ADC input channel 610-bit analog input; extends ADC channel count to six - accommodates multi-sensor inputs in alarm system front-ends.
28 (VDD)Power supplySecondary 1.8–3.6 V supply rail; decoupled separately to reduce switching noise coupling into analog sections.

Key Features

FeatureDesign Value
Power profiles in boot ROMOne function call configures CPU/peripheral clocks, voltage scaling, and sleep modes - reduces firmware development time for low-power optimization.
Windowed watchdog timerPrevents runaway code execution while allowing valid long-duration operations - critical for fail-safe alarm and lighting control firmware.
Configurable open-drain modeEnables I²C-bus and 1-wire interface implementation without external pull-ups - saves BOM cost and PCB area in sensor nodes.
High-current GPIO sinks20 mA sink capability on I²C pins supports direct LED driving or relay coil control - eliminates need for external driver transistors.
In-Application Programming (IAP)Allows firmware updates over UART or I²C without halting application - enables field upgrades in deployed lighting and metering devices.
Serial Wire Debug (SWD)Two-pin debug interface replaces JTAG, freeing GPIO pins for application use - maximizes I/O availability in TSSOP28 footprint.

Applications

Lighting ControlAlarm System Front-End

Use Scenario: Dimmable LED driver with ambient light sensing and wireless command reception.

IC Role / Device Role / Timing Role: Main controller executing PWM dimming logic, reading ADC-based light sensor, and parsing UART commands from RF module.

Use Value: 22 GPIO enable direct LED string control and sensor interfacing; 6-channel ADC supports multi-zone ambient sensing; UART RS-485 mode ensures noise-immune command link.

Use Scenario: Door/window contact monitoring with tamper detection and local siren activation.

IC Role / Device Role / Timing Role: Sensor aggregator managing reed switch inputs, detecting enclosure opening via GPIO interrupts, and driving piezo siren via PWM.

Use Value: Edge-sensitive GPIO interrupts provide sub-10 µs response to intrusion; windowed WDT guarantees recovery from fault conditions; 16 kB flash stores encrypted event logs.

eMetering SubsystemWhite Goods UI Panel

Use Scenario: Pulse counting and tariff calculation unit in smart electricity meter with optical isolation interface.

IC Role / Device Role / Timing Role: Dedicated metering co-processor capturing kWh pulses via GPIO counter/timer, storing tariff tables in flash, and communicating via isolated UART.

Use Value: Four 32/16-bit timers support simultaneous pulse capture and real-time clock; 1.8–3.6 V operation matches isolated power supply rails; I²C interfaces with RTC and display driver.

Use Scenario: Keypad scan and display update engine for refrigerator control panel with touch feedback.

IC Role / Device Role / Timing Role: User interface processor scanning matrix keypad, driving segmented LCD via GPIO, and generating tactile feedback via PWM buzzer.

Use Value: 22 GPIO support 4×4 keypad + 8-segment display + status LEDs; 10-bit ADC reads potentiometer for temperature setting; low-power Deep-sleep mode extends battery life in backup operation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
LPC1111FDH20/0028 kB flash, 2 kB SRAM, 16 GPIO, TSSOP20 package - smaller memory and I/O count.Targeted at simpler sensor nodes with minimal firmware and fewer peripherals.Select when design fits within 8 kB code size and requires only 16 GPIO - reduces PCB area and BOM cost.
LPC1114FDH28/10232 kB flash, 4 kB SRAM, same TSSOP28 package and peripheral set - double flash capacity.Suitable for applications needing larger bootloader, OTA update partition, or complex protocol stacks.Choose when future firmware expansion or dual-bank OTA updates are required - maintains identical pinout and layout.

Compared with LPC1111FDH20/002, the LPC1112FDH28/102 provides 100 % more flash and 6 additional GPIO for enhanced feature integration; compared with LPC1114FDH28/102, it offers identical I/O and peripherals at lower memory cost - optimizing BOM for mid-complexity industrial controls.

Availability

LPC1112FDH28/102 is available at Aetrix Electronics and suitable for lighting control, alarm systems, and eMetering applications requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.

Supply support for LPC1112FDH28/102 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The LPC111x series targets cost-sensitive 8/16-bit replacement applications, emphasizing low power, simple toolchain adoption, and rapid time-to-market for industrial control and consumer electronics.

FAQ

What is the maximum operating frequency of the LPC1112FDH28/102?

The LPC1112FDH28/102 operates at up to 50 MHz using its integrated PLL, which can be clocked from either the internal 12 MHz RC oscillator (trimmed to ±1 %) or an external crystal (1–25 MHz range). This eliminates the need for high-frequency crystals while maintaining timing precision for UART and ADC operations in the LPC1112FDH28/102.

Does the LPC1112FDH28/102 support In-Application Programming (IAP)?

Yes, the LPC1112FDH28/102 supports In-Application Programming via its on-chip bootloader, enabling firmware updates without halting the running application. This capability is implemented in ROM and accessible through UART or I²C interfaces, making it ideal for remote updates in deployed lighting and alarm systems using the LPC1112FDH28/102.

How many ADC input channels does the LPC1112FDH28/102 provide?

The LPC1112FDH28/102 provides six ADC input channels (AD0–AD6), mapped to specific GPIO pins in the TSSOP28 package. This 10-bit successive approximation ADC supports single-ended measurements with internal reference, enabling simultaneous monitoring of multiple sensors in white goods and eMetering applications using the LPC1112FDH28/102.

Is the LPC1112FDH28/102 compatible with the LPC1114FDH28/102 in terms of pinout and software?

Yes, the LPC1112FDH28/102 and LPC1114FDH28/102 share identical TSSOP28 pinouts, peripheral register maps, and boot ROM features, including power profiles and windowed watchdog timer. Firmware developed for the LPC1112FDH28/102 runs unchanged on the LPC1114FDH28/102, enabling seamless migration to higher flash capacity without PCB redesign.

What power-saving modes are supported by the LPC1112FDH28/102?

The LPC1112FDH28/102 supports three reduced-power modes: Sleep, Deep-sleep, and Deep power-down. Wake-up from Deep-sleep is possible via up to 13 functional GPIO pins, and power profiles in boot ROM allow one function call to configure optimal clocking and voltage settings - critical for battery-backed alarm and metering applications using the LPC1112FDH28/102.

LPC1112FDH28/102:5 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
28-TSSOP (0.173", 4.40mm Width)
Series:
LPC11xx
Packaging:
Bulk
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit
Speed:
50MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, WDT
Number of I/O:
22
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
4K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 6x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LPC1112FDH28/102:5 FAQ

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For technical support, including LPC1112FDH28/102:5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC1112FDH28/102:5 requirements.

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All LPC1112FDH28/102:5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC1112FDH28/102:5 meets industry standards.

7.What is the process for return or replacement of LPC1112FDH28/102:5?

All LPC1112FDH28/102:5 units undergo pre-shipment inspection (PSI). If there is an issue with LPC1112FDH28/102:5, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LPC1112FDH28/102:5 part is unused and in its original packaging.

Return procedure for LPC1112FDH28/102:5:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

LPC1112FDH28/102:5 Tags

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