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NXP Semiconductors LPC1112FHI33/102,5

Part No.:
LPC1112FHI33/102,5
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
32-VFQFN Exposed Pad
Datasheet:
AetrixLPC1112FHI33/102,5.pdf
Description:
LPC1112 - Scalable 32-bit Microc
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:6,664

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Product details

Overview

LPC1112FHI33/102 from NXP Semiconductors is a 32-bit ARM Cortex-M0 microcontroller in a 5×5 mm HVQFN33 package, featuring 16 kB flash, 2 kB SRAM, one UART with RS-485 support, one I²C-bus interface, four general-purpose timers, and a 10-bit ADC with eight input channels - deployed in lighting control and alarm systems requiring compact, low-power embedded control.

For engineers reviewing the LPC1112FHI33/102 datasheet, LPC1112FHI33/102 pinout, LPC1112FHI33/102 application, or LPC1112FHI33/102 equivalent, this page delivers verified specifications, validated pin functions, real-world use cases, and confirmed alternative parts for rapid design-in and supply assurance.

Technical Context

The LPC1112FHI33/102 implements an ARM Cortex-M0 core running at up to 50 MHz with NVIC and Serial Wire Debug, paired with a programmable windowed watchdog timer and integrated PMU supporting Sleep, Deep-sleep, and Deep power-down modes. It uses a 12 MHz internal RC oscillator trimmed to ±1 % accuracy as system clock source.

Peripheral integration includes Fast-mode Plus I²C (1 Mbit/s), UART with fractional baud rate generation and internal FIFO, two SPI controllers (one active in HVQFN33), and GPIO with configurable pull-up/pull-down and open-drain mode - all operating across 1.8 V to 3.6 V supply range.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreARM Cortex-M0, 32-bit RISC architecture optimized for deterministic real-time response and Thumb-2 instruction efficiency.
Max Clock Frequency50 MHz - enables sub-20 ns instruction cycle time for time-critical control loops in lighting or sensor interfaces.
Flash Memory16 kB - sufficient for bootloader + application firmware with room for field updates in metering or white goods.
SRAM2 kB - supports stack, heap, and peripheral buffers for UART/I²C communication stacks without external memory.
ADC10-bit resolution, 8-channel multiplexed input - allows simultaneous monitoring of multiple analog sensors (e.g., temperature, light intensity) in alarm panels.
I/O Pins28 GPIO - includes dedicated UART, I²C, SPI, and timer capture/match pins mapped to physical terminals in HVQFN33 package.
Operating Voltage1.8 V to 3.6 V - compatible with Li-ion battery-backed systems and industrial 3.3 V rails without level-shifting.

Pinout & Package

HVQFN33 package: plastic thermal-enhanced very thin quad flat no-lead package, 5 mm × 5 mm × 0.85 mm body, 33 terminals, exposed thermal pad, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
RESET/PIO0_0Reset input / General-purpose I/OActive-low hardware reset; configurable as GPIO with interrupt capability for wake-up from Deep-sleep mode.
XTALIN / XTALOUTClock oscillator inputsSupports 1–25 MHz crystal; enables precise timing for UART baud rates and ADC sampling synchronization.
RXDTXD / RTS / CTSUART serial interfaceFull RS-485 transceiver interface with flow control - eliminates need for external line drivers in industrial bus nodes.
SDA / SCLI²C-bus interfaceFast-mode Plus (1 Mbit/s) operation enables high-speed sensor data acquisition from multiple slave devices on same bus.
SWDIO / SWCLKSerial Wire Debug interfaceTwo-pin debug port for programming and real-time debugging without halting CPU execution.
VDD / VSSPower supply terminalsDual VDD pins and single VSS provide stable power distribution; exposed thermal pad improves thermal dissipation in compact PCB layouts.

Key Features

FeatureDesign Value
Power profiles in boot ROMOne function call selects pre-optimized performance/power trade-offs - reduces firmware development effort for battery-powered lighting controls.
Windowed watchdog timerPrevents runaway code while tolerating valid software timing windows - critical for fail-safe operation in alarm systems.
Configurable open-drain modeEnables direct connection to I²C bus or wired-AND logic without external pull-ups - simplifies board layout and BOM.
High-current GPIO (20 mA)Drives LEDs or small relays directly - eliminates discrete driver components in white goods UI modules.
10-bit ADC with 8-channel muxSimultaneous sampling of multiple analog inputs (e.g., ambient light + temperature) enables closed-loop dimming algorithms.

Applications

Lighting ControlAlarm Systems

Use Scenario: Digital LED driver with ambient light sensing and thermal monitoring in smart luminaires.

IC Role / Device Role / Timing Role: Main controller executing PWM dimming, ADC-based sensor fusion, and UART-based DALI or KNX gateway protocol.

Use Value: 16 kB flash stores lighting profile tables and communication stack; 28 GPIO route PWM, I²C sensors, and status LEDs without expansion.

Use Scenario: Intrusion detection panel with door/window contact inputs, siren output, and remote reporting via RS-485 bus.

IC Role / Device Role / Timing Role: Central security processor managing zone polling, tamper detection, and UART-to-modem interface with watchdog supervision.

Use Value: Windowed WDT ensures reliable recovery from transient faults; 10-bit ADC reads analog smoke/CO sensor outputs with 8-channel flexibility.

eMeteringWhite Goods

Use Scenario: Single-phase electricity meter with current/voltage sensing, pulse output, and optical IR communication.

IC Role / Device Role / Timing Role: Energy measurement controller performing RMS calculations, tariff switching, and I²C EEPROM data logging.

Use Value: 50 MHz Cortex-M0 executes metrology algorithms in real time; 1.8–3.6 V operation supports wide-input auxiliary power supplies.

Use Scenario: Washing machine mainboard monitoring motor current, water temperature, and door lock status.

IC Role / Device Role / Timing Role: Appliance system-on-chip handling motor control timing, ADC-based thermistor readings, and user interface button scanning.

Use Value: Four 32/16-bit timers manage precise motor commutation intervals; open-drain GPIO safely interface with 5 V logic-level sensors.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
LPC1112FHN33/102Same 16 kB flash, 2 kB SRAM, and HVQFN33 package but uses 7×7 mm body instead of 5×5 mm; lacks extended temperature rating.Suitable for commercial-grade designs where board space is less constrained and ambient temperature stays below +85 °C.Select when footprint tolerance allows larger package and thermal requirements are standard.
LPC1112FHI33/202Identical 5×5 mm HVQFN33 package and temperature grade, but with 4 kB SRAM instead of 2 kB - no flash difference.Better suited for applications needing larger buffer space for communication stacks or real-time FFT processing in audio-enabled appliances.Choose when additional RAM is required for complex protocol handling without increasing PCB area.

Compared with LPC1112FHN33/102, the LPC1112FHI33/102 saves 4 mm² board area and supports higher ambient temperatures; versus LPC1112FHI33/202, it trades 2 kB RAM for lower cost and power in simpler control tasks.

Availability

LPC1112FHI33/102 is available at Aetrix Electronics and suitable for lighting control, alarm systems, and eMetering requiring stable component supply across industrial production cycles and long-life product roadmaps.

Supply support for LPC1112FHI33/102 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader delivering secure, scalable solutions for automotive, industrial, IoT, and mobile applications.

The LPC111x series targets cost-sensitive 32-bit embedded control, bridging 8/16-bit MCU limitations with ARM Cortex-M0 efficiency, low-power operation, and integrated peripherals for rapid system integration.

FAQ

What is the maximum operating frequency of the LPC1112FHI33/102?

The LPC1112FHI33/102 operates at a maximum CPU frequency of 50 MHz, enabled by its ARM Cortex-M0 core and internal PLL. This frequency is achievable using either the 12 MHz internal RC oscillator (trimmed to ±1 %) or an external crystal up to 25 MHz, supporting deterministic real-time execution in lighting and alarm applications.

Does the LPC1112FHI33/102 support I²C Fast-mode Plus?

Yes, the LPC1112FHI33/102 includes an I²C-bus interface compliant with Fast-mode Plus specification, supporting data rates up to 1 Mbit/s. This capability is confirmed for the LPC1100L series (to which LPC1112FHI33/102 belongs) and enables high-speed communication with multiple sensors or EEPROMs without bus contention.

How many ADC input channels does the LPC1112FHI33/102 support?

The LPC1112FHI33/102 supports eight ADC input channels, as specified for HVQFN33-packaged variants in the LPC1100L series. Its 10-bit successive-approximation ADC allows simultaneous multiplexed sampling of analog signals such as temperature, light, or voltage levels in white goods and metering systems.

What debug interface does the LPC1112FHI33/102 provide?

The LPC1112FHI33/102 provides Serial Wire Debug (SWD) with two dedicated pins: SWDIO and SWCLK. This two-wire interface supports full programming, breakpoint setting, and real-time variable inspection without halting the CPU - essential for iterative firmware development in alarm and lighting control projects.

Is the LPC1112FHI33/102 pin-compatible with other HVQFN33 variants in the LPC111x family?

Yes, the LPC1112FHI33/102 shares identical pinout and electrical characteristics with other HVQFN33-packaged LPC111x parts (e.g., LPC1112FHN33/102, LPC1112FHI33/202), differing only in SRAM size or temperature grade. Pin mapping is consistent across the series, enabling drop-in replacement where memory or thermal requirements align.

LPC1112FHI33/102,5 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
32-VFQFN Exposed Pad
Series:
LPC11xx
Packaging:
Bulk
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit
Speed:
50MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, WDT
Number of I/O:
28
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
2K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LPC1112FHI33/102,5 FAQ

1.How can I place an order for LPC1112FHI33/102,5 through Aetrix?

Please submit a Request for Quotation (RFQ) for LPC1112FHI33/102,5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LPC1112FHI33/102,5 reliable?

The price and inventory of LPC1112FHI33/102,5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC1112FHI33/102,5 is usually 5 days.

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LPC1112FHI33/102,5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LPC1112FHI33/102,5 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LPC1112FHI33/102,5?

For technical support, including LPC1112FHI33/102,5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC1112FHI33/102,5 requirements.

6.How does Aetrix verify that LPC1112FHI33/102,5 is sourced from the original manufacturer or authorized distributors?

All LPC1112FHI33/102,5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC1112FHI33/102,5 meets industry standards.

7.What is the process for return or replacement of LPC1112FHI33/102,5?

All LPC1112FHI33/102,5 units undergo pre-shipment inspection (PSI). If there is an issue with LPC1112FHI33/102,5, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LPC1112FHI33/102,5 part is unused and in its original packaging.

Return procedure for LPC1112FHI33/102,5:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

LPC1112FHI33/102,5 Tags

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