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NXP Semiconductors LPC1112FHI33/203,5
- Part No.:
- LPC1112FHI33/203,5
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-VFQFN Exposed Pad
- Datasheet:
-
LPC1112FHI33/203,5.pdf
- Description:
- IC MCU 32BIT 16KB FLASH 32HVQFN
- Quantity:
- Payment:
- Shipping:
Inventory:215
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Product details
Overview
LPC1112FHI33/203 from NXP Semiconductors is a 32-bit ARM Cortex-M0 microcontroller in a 5 × 5 mm HVQFN33 package, featuring 16 kB flash, 4 kB SRAM, 28 GPIO pins, one UART with RS-485 support, one I²C-bus interface (Fast-mode Plus), and a 10-bit ADC with 8 input channels - deployed in smart lighting control systems requiring compact footprint and low-power operation.
For engineers reviewing the LPC1112FHI33/203 datasheet, LPC1112FHI33/203 pinout, LPC1112FHI33/203 application, or LPC1112FHI33/203 equivalent, this page delivers verified technical context, validated pin functions, real-world use cases, and confirmed alternative options for industrial embedded design and BOM optimization.
Technical Context
The LPC1112FHI33/203 belongs to the LPC1100XL series and integrates an ARM Cortex-M0 core running at up to 50 MHz, with a windowed watchdog timer (WWDT), programmable power profiles in boot ROM, and a 12 MHz internal RC oscillator trimmed to ±1 % accuracy. It supports Sleep, Deep-sleep, and Deep power-down modes via its integrated PMU.
Its peripheral set includes four general-purpose timers (two 32-bit, two 16-bit), one UART with fractional baud rate generation and RS-485/EIA-485 support, one Fast-mode Plus I²C-bus interface (1 Mbit/s), two SPI controllers (one active in HVQFN33), and a 10-bit ADC with multiplexed inputs across eight pins - all accessible on the 33-terminal HVQFN package.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M0, 32-bit RISC, up to 50 MHz - enables efficient execution of real-time control tasks with Thumb-2 instruction set and NVIC interrupt handling. |
| Flash Memory | 16 kB on-chip flash - sufficient for firmware with basic communication stacks and sensor processing in cost-sensitive IoT endpoints. |
| SRAM | 4 kB SRAM - supports moderate data buffering, stack depth, and real-time variable storage without external memory. |
| GPIO | 28 configurable GPIO pins - provides ample I/O for LED drivers, button interfaces, and digital sensors in compact lighting or alarm systems. |
| ADC | 10-bit SAR ADC with 8-channel multiplexer - enables analog sensing of temperature, light intensity, or supply voltage with single-ended input support. |
| I²C Interface | Fast-mode Plus I²C (1 Mbit/s) - allows high-speed communication with EEPROMs, digital sensors, or display controllers while maintaining compatibility with standard I²C devices. |
| UART | RS-485/EIA-485 UART with internal FIFO - supports robust long-distance serial communication in noisy industrial environments without external transceiver logic. |
| Package | HVQFN33, 5 × 5 × 0.85 mm - offers thermal efficiency and board space savings over larger LQFP48 or TSSOP packages in space-constrained designs. |
Pinout & Package
HVQFN33 (plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5 × 5 × 0.85 mm).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD (pins 1, 17, 25, 33) | Power supply | Single 1.8 V to 3.6 V supply rail; multiple VDD pins ensure stable core and I/O domain operation under dynamic load. |
| VSS (pin 33) | Ground | Common reference for analog and digital sections; dedicated ground terminal improves noise immunity for ADC and clock circuits. |
| RESET/PIO0_0 | Reset input / GPIO | Active-low reset with internal pull-up; dual-function pin allows flexible system initialization or general-purpose I/O when not used for reset. |
| XTALIN / XTALOUT | Clock input/output | Supports external crystal (1–25 MHz) for precise timing; optional bypass to internal 12 MHz RC oscillator for reduced BOM cost. |
| SWDIO / SWCLK | Debug interface | Two-pin Serial Wire Debug (SWD) enables programming and real-time debugging without JTAG overhead or additional pins. |
| PIO0_4/SCL, PIO0_5/SDA | I²C bus signals | Dedicated open-drain I²C pins supporting Fast-mode Plus (1 Mbit/s); internal pull-ups configurable via IOCON register. |
| PIO1_6/RXD, PIO1_7/TXD | UART data lines | Full-duplex UART interface with hardware flow control (CTS/RTS available on other pins); supports RS-485 half-duplex mode via software control. |
| PIO1_3/AD4, PIO1_4/AD5, ..., PIO1_11/AD7 | ADC input channels | Eight 10-bit ADC inputs mapped across PIO1 and PIO2 pins; selectable sample rates and trigger sources enable synchronized sensor acquisition. |
Key Features
| Feature | Design Value |
|---|---|
| Windowed Watchdog Timer (WWDT) | Prevents runaway code execution with time-windowed refresh requirement - critical for fail-safe operation in alarm and metering applications. |
| Configurable Power Profiles | Boot ROM-resident power management routines allow one function call to switch between performance, low-power, or ultra-low-power modes - simplifies energy optimization in battery-powered devices. |
| High-Current GPIO Drivers | One 20 mA source-capable pin and two 20 mA sink-capable I²C pins eliminate need for external buffer transistors in LED or relay drive circuits. |
| Programmable IOCON Registers | Per-pin configuration of pull-up/pull-down, open-drain mode, slew rate, and filter - enables robust signal conditioning for noisy industrial environments. |
| Serial Wire Debug (SWD) | Two-pin debug interface with full flash programming, breakpoint, and trace capability - reduces debug footprint and PCB routing complexity versus JTAG. |
| In-Application Programming (IAP) | Allows firmware updates in-field via UART or I²C without external programmer - essential for remote device maintenance in lighting or white goods deployments. |
Applications
| Smart Lighting Control | Industrial Alarm Panel |
|---|---|
Use Scenario: Dimmable LED driver with ambient light and occupancy sensing in commercial fixtures. IC Role / Device Role / Timing Role: Main controller executing PWM dimming logic, reading ADC inputs, and communicating via I²C to sensor ICs and UART to central gateway. Use Value: 28 GPIO and 8 ADC channels support direct connection of photodiode, PIR, and RGB LED drivers; 16 kB flash accommodates lighting profile storage and DALI-compatible protocol stack. | Use Scenario: Local zone monitoring unit with door contact, smoke detector, and siren output in fire alarm systems. IC Role / Device Role / Timing Role: Real-time event processor sampling inputs, managing WWDT timeouts, and driving audible/visual alerts via GPIO and UART-based panel reporting. Use Value: Windowed WDT ensures deterministic fault recovery; 4 kB SRAM buffers alarm logs; RS-485 UART enables daisy-chained communication across multiple zones without repeaters. |
| Energy Metering Interface | White Goods Sensor Hub |
Use Scenario: Sub-metering module interfacing with shunt-based current sensors and LCD display in residential energy monitors. IC Role / Device Role / Timing Role: Signal conditioner and communication bridge converting analog current readings to digital values and transmitting via UART to host MCU. Use Value: 10-bit ADC with 8-channel mux supports simultaneous voltage/current sampling; 16 kB flash stores calibration coefficients and communication protocol handlers. | Use Scenario: Appliance subsystem aggregating temperature, door switch, and motor status signals in washing machines or refrigerators. IC Role / Device Role / Timing Role: Peripheral manager coordinating sensor polling, motor control timing, and fault detection using GPIO interrupts and timer match outputs. Use Value: Four independent timers support precise spin-cycle timing and debounce intervals; configurable open-drain GPIO safely interfaces with legacy appliance switches and optocouplers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC1112FHN33/203 | HVQFN33 package with 7 × 7 mm body; identical flash/SRAM/peripherals but different thermal and mechanical footprint. | Suitable for designs where board layout allows larger pad area and higher thermal mass; same pinout but incompatible land pattern. | Select when thermal dissipation requirements exceed 5 × 5 mm limits or when existing PCB uses 7 × 7 mm variant. |
| LPC1114FHI33/303 | 56 kB flash, 8 kB SRAM, second SPI interface enabled, same 5 × 5 HVQFN33 package and pinout. | Required for applications needing larger firmware (e.g., BLE stack integration) or dual SPI peripherals (e.g., display + SD card). | Choose when firmware growth or peripheral expansion is anticipated; drop-in compatible at package and pin level. |
Compared with LPC1112FHI33/203, LPC1112FHN33/203 offers identical functionality in a larger HVQFN variant for improved thermal performance, while LPC1114FHI33/303 extends flash and RAM capacity within the same 5 × 5 mm footprint - enabling scalable firmware development without PCB redesign.
Availability
LPC1112FHI33/203 is available at Aetrix Electronics and suitable for smart lighting control, industrial alarm panels, and energy metering interfaces requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for LPC1112FHI33/203 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The LPC1100XL series - including LPC1112FHI33/203 - was designed for cost-sensitive, low-power embedded applications demanding ARM Cortex-M0 performance in minimal form factors, with emphasis on rapid time-to-market and simplified power management.
FAQ
What is the maximum operating frequency of the LPC1112FHI33/203?
The LPC1112FHI33/203 operates at a maximum CPU frequency of 50 MHz. This is achieved using either the internal 12 MHz RC oscillator (with PLL multiplication) or an external crystal oscillator (1–25 MHz). The PLL allows full-speed operation without requiring a high-frequency crystal, reducing BOM cost and layout complexity in the LPC1112FHI33/203 design.
Does the LPC1112FHI33/203 support in-system programming (ISP)?
Yes, the LPC1112FHI33/203 supports In-System Programming (ISP) via its built-in bootloader, accessible through UART or USB (with external bridge). This enables field firmware updates without removing the chip from the board. ISP functionality is fully implemented in the LPC1112FHI33/203 and requires no external programming hardware beyond a standard UART interface.
How many ADC channels does the LPC1112FHI33/203 provide, and what is the resolution?
The LPC1112FHI33/203 features a 10-bit successive approximation register (SAR) ADC with multiplexed inputs across eight pins (AD0–AD7). All eight channels are accessible on the HVQFN33 package. The ADC supports programmable sample rates, burst mode, and hardware/software triggers - making it suitable for sensor interfacing in the LPC1112FHI33/203's target applications.
Is the LPC1112FHI33/203 pin-compatible with other LPC111x HVQFN33 variants?
Yes, the LPC1112FHI33/203 shares identical pinout and package dimensions (5 × 5 mm HVQFN33) with other LPC111x parts in the same family, including LPC1114FHI33/303 and LPC1112FHI33/102. Pin functions are consistent across these variants, enabling hardware reuse and firmware scalability - a key design advantage of the LPC1112FHI33/203 platform.
What debug interface does the LPC1112FHI33/203 support?
The LPC1112FHI33/203 supports Serial Wire Debug (SWD) using two dedicated pins: SWDIO and SWCLK. This two-wire interface provides full programming, debugging, and real-time trace capabilities without requiring JTAG's five-pin footprint. SWD is natively supported by Keil MDK, LPCXpresso, and OpenOCD - ensuring broad toolchain compatibility for the LPC1112FHI33/203.
LPC1112FHI33/203,5 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-VFQFN Exposed Pad
- Series:
- LPC1100XL
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- I2C, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, WDT
- Number of I/O:
- 28
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC1112FHI33/203,5 FAQ
1.How can I place an order for LPC1112FHI33/203,5 through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC1112FHI33/203,5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC1112FHI33/203,5 reliable?
The price and inventory of LPC1112FHI33/203,5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC1112FHI33/203,5 is usually 5 days.
3.What payment methods are accepted for LPC1112FHI33/203,5?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC1112FHI33/203,5 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LPC1112FHI33/203,5?
LPC1112FHI33/203,5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC1112FHI33/203,5 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC1112FHI33/203,5?
For technical support, including LPC1112FHI33/203,5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC1112FHI33/203,5 requirements.
6.How does Aetrix verify that LPC1112FHI33/203,5 is sourced from the original manufacturer or authorized distributors?
All LPC1112FHI33/203,5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC1112FHI33/203,5 meets industry standards.
7.What is the process for return or replacement of LPC1112FHI33/203,5?
All LPC1112FHI33/203,5 units undergo pre-shipment inspection (PSI). If there is an issue with LPC1112FHI33/203,5, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC1112FHI33/203,5 part is unused and in its original packaging.
Return procedure for LPC1112FHI33/203,5:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LPC1112FHI33/203,5 Tags
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