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NXP Semiconductors LPC1112FHN33/102,5

Part No.:
LPC1112FHN33/102,5
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
32-VQFN Exposed Pad
Datasheet:
AetrixLPC1112FHN33/102,5.pdf
Description:
IC MCU 32BIT 16KB FLASH 32HVQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,761

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Product details

Overview

LPC1112FHN33/102 from NXP Semiconductors is an ARM Cortex-M0-based 32-bit microcontroller in HVQFN33 package, delivering up to 50 MHz CPU operation, 16 kB flash, 2 kB SRAM, and integrated peripherals including UART with RS-485 support, Fast-mode Plus I²C (1 Mbit/s), four timers, 10-bit ADC (8 channels), and 28 GPIO pins. It targets low-power industrial control and sensor interface applications requiring compact footprint and deterministic real-time response.

For engineers reviewing the LPC1112FHN33/102 datasheet, LPC1112FHN33/102 pinout, LPC1112FHN33/102 application, or LPC1112FHN33/102 equivalent, key selection criteria include its LPC1100L-series power profiles for active/sleep optimization, pseudo open-drain GPIO capability, internal 12 MHz RC oscillator trimmed to ±1%, and compatibility with NXP's ISP/IAP bootloader for field firmware updates.

Technical Context

The LPC1112FHN33/102 implements the ARMv6-M architecture with NVIC, Serial Wire Debug, and system tick timer. Its clock system supports multiple sources: internal 12 MHz IRC (±1%), external crystal (1–25 MHz), watchdog oscillator (7.8 kHz–1.8 MHz), and optional PLL for full 50 MHz operation.

Power management includes Sleep, Deep-sleep, and Deep power-down modes managed by an integrated PMU; wake-up from Deep-sleep is supported via up to 13 functional pins. The device belongs to the LPC1100L series, enabling programmable power profiles and internal pull-up resistors tied to full VDD level.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreARM Cortex-M0, 32-bit RISC, up to 50 MHz - enables efficient execution of real-time control tasks with minimal code size vs. legacy 8/16-bit MCUs.
Flash Memory16 kB - sufficient for compact firmware images with room for bootloader and parameter storage in embedded sensor nodes.
SRAM2 kB - supports moderate stack depth, interrupt handling, and small data buffers without external memory.
GPIO Pins28 pins with configurable pull-up/pull-down and edge/level-sensitive interrupts - allows direct connection to switches, sensors, and status indicators in space-constrained designs.
ADC10-bit SAR ADC with 8 input channels - provides adequate resolution for temperature, voltage, and analog sensor monitoring in industrial environments.
I²C InterfaceFast-mode Plus (1 Mbit/s) with multi-address recognition - enables high-speed communication with EEPROMs, sensors, and displays while maintaining bus robustness.
UARTRS-485-capable with fractional baud rate generator and FIFO - supports noise-immune long-distance serial communication in factory automation networks.
Operating Temperature−40 °C to +85 °C - qualified for deployment in uncontrolled industrial enclosures and outdoor equipment housings.

Pinout & Package

HVQFN33 package: plastic thermal enhanced very thin quad flat package, no leads, 33 terminals, body size 7 × 7 × 0.85 mm.

Pin/TerminalCircuit RoleDesign Meaning
VDDCore power supplySingle 3.3 V supply (1.8–3.6 V range); decoupling required per datasheet layout guidelines.
VSSGround referenceDedicated ground terminal; must be connected to low-impedance PCB ground plane for noise immunity.
RESETActive-low reset inputPulled HIGH externally in deep power-down mode; can serve as GPIO if external reset not used.
XTALIN / XTALOUTCry stal oscillator inputsSupports 1–25 MHz crystal; XTALOUT not available on this variant per Figure 1 note (3).
PIO0_0 – PIO0_10, PIO1_0 – PIO1_11, PIO2_0 – PIO2_7, PIO3_0 – PIO3_4General-purpose I/O28 total GPIO pins; all support interrupt generation and programmable pull-up/pull-down resistors tied to full VDD.
TXD / RXDUART transmit/receiveRS-485-ready signals; require external transceiver for differential bus implementation.
SCL / SDAI²C-bus clock/dataOpen-drain capable; support Fast-mode Plus (1 Mbit/s); internal pull-ups enabled when configured as I²C.
SCK0 / MISO0 / MOSI0 / SSEL0SPI0 interfaceFull-duplex synchronous serial interface; SSEL0 is chip-select input for master mode.
AD0 – AD7ADC input channels8 analog inputs multiplexed to 10-bit ADC; AD[7:0] available on HVQFN33 per Table 1 and Figure 1 note (4).

Key Features

FeatureDesign Value
Programmable power profilesOptimize current draw in Active/Sleep modes via single ROM function call - reduces design effort for battery-powered or thermally constrained systems.
Pseudo open-drain GPIOConfigurable drive strength enables I²C-compatible signaling without external pull-ups on selected pins - simplifies BOM and board layout.
Internal 12 MHz RC oscillatorTrimmed to ±1% accuracy - eliminates need for external crystal in cost-sensitive applications where precise timing is not critical.
In-System Programming (ISP)Bootloader supports UART-based firmware updates without debugger - enables field maintenance and remote firmware patching.
High-current GPIO drivers20 mA sink capability on two I²C pins - directly drives LEDs or small loads without external buffers in indicator circuits.
Wake-up from Deep-sleepDedicated logic allows wake-up via up to 13 GPIO pins - supports ultra-low-power sensor polling with fast response to external events.

Applications

Industrial Sensor NodeSmart Lighting Controller

Use Scenario: Compact environmental monitor collecting temperature, humidity, and voltage data in factory settings with RS-485 backhaul.

IC Role / Device Role / Timing Role: Central MCU executing sensor readout, data preprocessing, and UART-to-RS-485 protocol framing at 9600–115200 baud.

Use Value: 28 GPIO enable direct connection to multiple analog/digital sensors; 10-bit ADC resolves sub-degree thermal changes; 16 kB flash accommodates Modbus RTU stack and calibration tables.

Use Scenario: LED driver board controlling brightness and color via DALI or 0–10 V interfaces in commercial buildings.

IC Role / Device Role / Timing Role: Real-time PWM generator and communication bridge between DALI bus and LED power stages.

Use Value: Four independent timers provide precise PWM outputs; Fast-mode Plus I²C interfaces with ambient light and occupancy sensors; 2 kB SRAM buffers command queues during transient network load.

Energy Meter Front-EndIoT Edge Gateway Subsystem

Use Scenario: Low-cost electricity meter measuring voltage/current via shunt or CT, calculating kWh, and reporting via UART to GPRS module.

IC Role / Device Role / Timing Role: Analog acquisition controller with ADC sampling synchronization and UART packetization of energy data.

Use Value: 8-channel ADC supports simultaneous voltage/current/neutral measurements; RS-485 UART ensures noise-tolerant link to concentrator; 16 kB flash stores tariff tables and firmware update handler.

Use Scenario: Local aggregation node collecting BLE/Zigbee sensor data and forwarding via Ethernet or cellular to cloud platform.

IC Role / Device Role / Timing Role: Protocol translator and buffer manager coordinating UART, SPI, and I²C traffic between wireless SoCs and host processor.

Use Value: Dual SPI interfaces connect to multiple wireless modules; 28 GPIO allow hardware flow control and status signaling; power profiles extend battery life in portable gateway variants.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
LPC1112FHN33/202Same package and pinout; 4 kB SRAM instead of 2 kB; identical flash (16 kB) and peripherals.Better suited for applications requiring larger stack depth or intermediate data buffering (e.g., protocol stacks with encryption).Select when firmware complexity demands >2 kB runtime RAM but same footprint and power profile behavior are required.
LPC1112FHI33/102HVQFN33 package with smaller 5 × 5 × 0.85 mm body (vs. 7 × 7 × 0.85 mm); identical electrical specs and feature set.Preferred for ultra-dense PCB layouts where board area is more constrained than thermal dissipation.Choose when mechanical envelope limits component height/area and thermal load remains within 5×5 mm package capability.

Compared with LPC1112FHN33/102, the /202 variant offers doubled SRAM for complex firmware without layout change, while the /102 variant in 5×5 mm HVQFN reduces footprint by ~50% - both retain identical peripheral configuration, power profiles, and debug interface.

Availability

LPC1112FHN33/102 is available at Aetrix Electronics and suitable for industrial sensor nodes, smart lighting controllers, and energy meter front-ends requiring stable component supply across extended production lifecycles.

Supply support for LPC1112FHN33/102 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The LPC111x family was designed specifically for cost-sensitive, low-power 32-bit replacement of legacy 8/16-bit microcontrollers in industrial control, sensor interfacing, and simple HMI applications - emphasizing ease of migration, small code size, and integrated power management.

FAQ

What is the maximum operating frequency of the LPC1112FHN33/102?

The LPC1112FHN33/102 operates at a maximum CPU frequency of 50 MHz. This is achieved using the on-chip PLL driven by either the internal 12 MHz RC oscillator or an external crystal (1–25 MHz). The core maintains full performance across its specified −40 °C to +85 °C temperature range without derating.

Does the LPC1112FHN33/102 support in-application programming (IAP)?

Yes, the LPC1112FHN33/102 supports In-Application Programming via its on-chip bootloader. It implements page-erase IAP commands only in LPC1100XL variants; however, the LPC1112FHN33/102 belongs to the LPC1100L series and supports standard ISP and limited IAP functions - full page-erase capability requires upgrading to an XL-series part such as LPC1112FHN33/103.

What are the key differences between LPC1112FHN33/102 and LPC1112FHN33/202?

The LPC1112FHN33/102 and LPC1112FHN33/202 share identical package, pinout, flash size (16 kB), and peripheral set. Their primary difference is SRAM capacity: the /102 variant has 2 kB SRAM, while the /202 variant provides 4 kB. Both belong to the LPC1100L series and support the same power profiles and GPIO features.

Can the LPC1112FHN33/102 operate without an external crystal?

Yes, the LPC1112FHN33/102 can operate without an external crystal. Its internal 12 MHz RC oscillator is factory-trimmed to ±1% accuracy and may be used directly as the system clock source. This eliminates BOM cost and board space for crystal components in applications where precise timing (e.g., USB, audio) is not required.

Which development tools are officially supported for the LPC1112FHN33/102?

NXP officially supports LPCXpresso IDE, MCUXpresso SDK, and LPC-Link2 debug probe for the LPC1112FHN33/102. The device is compatible with ARM GCC toolchains and OpenOCD for debugging via SWD interface. Reference schematics and pinout diagrams are provided in UM10398, and example projects for UART, I²C, and timer peripherals are included in the MCUXpresso SDK v2.10+.

LPC1112FHN33/102,5 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
32-VQFN Exposed Pad
Series:
LPC1100L
Packaging:
Tray
Product Status:
Discontinued at Digi-Key
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, WDT
Number of I/O:
28
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
2K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LPC1112FHN33/102,5 FAQ

1.How can I place an order for LPC1112FHN33/102,5 through Aetrix?

Please submit a Request for Quotation (RFQ) for LPC1112FHN33/102,5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LPC1112FHN33/102,5 reliable?

The price and inventory of LPC1112FHN33/102,5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC1112FHN33/102,5 is usually 5 days.

3.What payment methods are accepted for LPC1112FHN33/102,5?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC1112FHN33/102,5 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LPC1112FHN33/102,5?

LPC1112FHN33/102,5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LPC1112FHN33/102,5 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LPC1112FHN33/102,5?

For technical support, including LPC1112FHN33/102,5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC1112FHN33/102,5 requirements.

6.How does Aetrix verify that LPC1112FHN33/102,5 is sourced from the original manufacturer or authorized distributors?

All LPC1112FHN33/102,5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC1112FHN33/102,5 meets industry standards.

7.What is the process for return or replacement of LPC1112FHN33/102,5?

All LPC1112FHN33/102,5 units undergo pre-shipment inspection (PSI). If there is an issue with LPC1112FHN33/102,5, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LPC1112FHN33/102,5 part is unused and in its original packaging.

Return procedure for LPC1112FHN33/102,5:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

LPC1112FHN33/102,5 Tags

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