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NXP Semiconductors LPC1112FHN33/103,5

Part No.:
LPC1112FHN33/103,5
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
32-VQFN Exposed Pad
Datasheet:
AetrixLPC1112FHN33/103,5.pdf
Description:
IC MCU 32BIT 16KB FLASH 32HVQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:260

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Product details

Overview

LPC1112FHN33/103 from NXP Semiconductors is an ARM Cortex-M0 32-bit microcontroller in a 33-terminal HVQFN package, featuring 16 kB flash, 2 kB SRAM, one UART with RS-485 support, one I²C-bus interface (Fast-mode Plus), one SPI, four timers, and a 10-bit ADC with 8 input channels-designed for low-power embedded control in lighting and alarm systems.

For engineers reviewing the LPC1112FHN33/103 datasheet, LPC1112FHN33/103 pinout, LPC1112FHN33/103 application, or LPC1112FHN33/103 equivalent, this page delivers verified specifications, package mapping, functional role in system-level timing and peripheral control, and validated alternative options for cost-sensitive industrial MCU selection.

Technical Context

The LPC1112FHN33/103 implements the ARM Cortex-M0 core with Nested Vectored Interrupt Controller (NVIC) and operates at up to 50 MHz using internal RC oscillator (1 % trimmed) or external crystal (1–25 MHz). It integrates a programmable windowed watchdog timer and power management unit supporting Sleep, Deep-sleep, and Deep power-down modes.

Its peripheral set includes a 10-bit ADC with multiplexed inputs across 8 pins, two SPI controllers (one active on this variant), UART with fractional baud rate generation and RS-485 support, and I²C-bus compliant with Fast-mode Plus (1 Mbit/s), all accessible via 28 GPIO pins with configurable pull-up/pull-down and open-drain capability.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreARM Cortex-M0, 32-bit RISC, supports Thumb-2 instruction set for compact code size vs. 8/16-bit MCUs.
Max Clock Frequency50 MHz - enables real-time response in motor control and sensor polling without external PLL dependency.
Flash Memory16 kB - sufficient for bootloader + application firmware in space-constrained white goods and metering devices.
SRAM2 kB - supports stack, heap, and data buffers for UART/I²C transaction handling and ADC sampling.
I/O Pins28 GPIO - includes dedicated UART (RXD/TXD/CTS/RTS), I²C (SDA/SCL), SPI (MISO/MOSI/SCK/SSEL), and ADC channel routing.
ADC Resolution10-bit - provides 1024 discrete levels for analog sensor interfacing (e.g., temperature, light intensity) with ±1 LSB INL.
Operating Voltage1.8 V to 3.6 V - compatible with single-cell Li-ion, 3.3 V logic rails, and battery-backed industrial sensors.

Pinout & Package

HVQFN33 package: plastic thermal enhanced very thin quad flat package, no leads, 33 terminals, body size 7 × 7 × 0.85 mm, exposed thermal pad, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
1 (VSS)GroundPrimary digital ground reference; connects to PCB ground plane for noise immunity and thermal dissipation.
2 (PIO0_8/MISO0/CT16B0_MAT0)GPIO / SPI MISO / Timer MatchConfigurable as SPI slave input, 16-bit timer match output, or general-purpose I/O with interrupt capability.
3 (PIO1_8/CT16B1_CAP0)GPIO / Timer CaptureSupports edge-triggered capture for pulse-width measurement (e.g., encoder signals) or standard I/O.
4 (PIO0_2/SSEL0/CT16B0_CAP0)GPIO / SPI Slave Select / Timer CaptureActive-low SPI chip select or timer input capture; dual function reduces pin count in compact designs.
5 (PIO0_9/MOSI0/CT16B0_MAT1)GPIO / SPI MOSI / Timer MatchDrives SPI data out or generates precise timing pulses for LED dimming or PWM-like control.
6 (VDD)Power SupplyCore and I/O supply (1.8–3.6 V); requires local 100 nF decoupling capacitor per VDD pin.
7 (SWCLK/PIO0_10/SCK0/CT16B0_MAT2)Debug Clock / SPI Clock / Timer MatchShared JTAG/SWD clock input and SPI master clock; enables in-circuit debug without dedicated debug header.
8 (XTALOUT)Crystal Oscillator OutputDrives external crystal (1–25 MHz); used with XTALIN for high-accuracy clock source in timing-critical applications.
9 (PIO1_10/AD6/CT16B1_MAT1)GPIO / ADC Input / Timer MatchAnalog input for 10-bit ADC channel 6; also serves as 16-bit timer match output for synchronized event generation.
10 (XTALIN)Crystal Oscillator InputAccepts external crystal or clock source; paired with XTALOUT to configure system clock with ±50 ppm stability.
11 (R/PIO0_11/AD0/CT32B0_MAT3)Reset / ADC Input / Timer MatchActive-low reset input with internal pull-up; also functions as ADC channel 0 or 32-bit timer match output.
12 (PIO0_1/CLKOUT/CT32B0_MAT2)GPIO / Clock Output / Timer MatchOutputs system, IRC, CPU, or watchdog clock divided by programmable prescaler for external sync or test probing.
13 (R/PIO1_0/AD1/CT32B1_CAP0)GPIO / ADC Input / Timer CaptureADC channel 1 input with 10-bit resolution; also captures rising/falling edges for frequency measurement.
14 (RESET/PIO0_0)Reset InputHardware reset assertion resets CPU, peripherals, and NVIC; debounced externally or via internal POR/BOR circuitry.
15 (R/PIO1_1/AD2/CT32B1_MAT0)GPIO / ADC Input / Timer MatchADC channel 2 input; also drives match signal for 32-bit timer 1, enabling periodic interrupts or waveform generation.
16 (PIO2_0/DTR)GPIO / UART DTRData Terminal Ready signal for modem handshaking; configurable as general-purpose output with 20 mA sink capability.
17 (R/PIO1_2/AD3/CT32B1_MAT1)GPIO / ADC Input / Timer MatchADC channel 3 input; also outputs match pulse from 32-bit timer 1 for precise timing control of external peripherals.
18 (PIO0_3)GPIOGeneral-purpose I/O with interrupt-on-change; used for button sensing, status indication, or wake-up trigger from Deep-sleep.
19 (PIO0_4/SCL)GPIO / I²C ClockOpen-drain I²C-bus clock line (Fast-mode Plus, 1 Mbit/s); supports multi-master arbitration and monitor mode.
20 (PIO0_5/SDA)GPIO / I²C DataOpen-drain I²C-bus data line with slew-rate control; compatible with standard and Fast-mode Plus I²C slaves.
21 (PIO1_9/CT16B1_MAT0)GPIO / Timer Match16-bit timer 1 match output; drives LEDs, relays, or triggers ADC conversions synchronously with timer events.
22 (PIO3_4)GPIOGeneral-purpose I/O with configurable pull-up/pull-down; supports level- or edge-sensitive interrupt for sensor wake-up.
23 (PIO3_5)GPIOGeneral-purpose I/O; used for system status signaling or secondary UART control lines (e.g., DSR, RI).
24 (PIO0_6/SCK0)GPIO / SPI ClockSPI master clock output; configurable polarity and phase for compatibility with legacy SPI peripherals.
25 (PIO0_7/CTS)GPIO / UART CTSClear-to-Send input for hardware flow control in RS-485 half-duplex communication.
26 (PIO1_7/TXD/CT32B0_MAT1)GPIO / UART TX / Timer MatchUART transmit output with fractional baud rate generator; also serves as 32-bit timer 0 match output.
27 (PIO1_6/RXD/CT32B0_MAT0)GPIO / UART RX / Timer MatchUART receive input with FIFO and parity support; also functions as 32-bit timer 0 match output.
28 (PIO1_5/RTS/CT32B0_CAP0)GPIO / UART RTS / Timer CaptureRequest-to-Send output for RS-485 transceiver direction control; also captures external event timing.
29 (VDD)Power SupplySecond VDD pin for improved power integrity; must be decoupled independently to reduce switching noise.
30 (PIO3_2)GPIOGeneral-purpose I/O with wake-up capability from Deep-sleep; used for tamper detection or low-power sensor polling.
31 (PIO1_11/AD7)GPIO / ADC InputADC channel 7 input; enables full 8-channel analog acquisition on HVQFN33 package for multi-sensor systems.
32 (PIO1_4/AD5/CT32B1_MAT3/WAKEUP)GPIO / ADC Input / Timer Match / Wake-upMulti-function pin: ADC channel 5 input, 32-bit timer 1 match output, and wake-up source from Deep-sleep mode.
33 (SWDIO/PIO1_3/AD4/CT32B1_MAT2)Debug I/O / GPIO / ADC Input / Timer MatchSingle-wire debug interface I/O; also supports ADC channel 4, timer match, and general I/O for maximum pin utility.

Key Features

FeatureDesign Value
Windowed Watchdog Timer (WWDT)Prevents runaway code execution with time-windowed refresh requirement-critical for alarm systems requiring fail-safe behavior.
Configurable Open-Drain ModeEnables direct connection to I²C-bus or wired-AND logic without external pull-ups, reducing BOM count in lighting control modules.
Power Profiles in Boot ROMOne function call selects optimized performance/power trade-offs-reduces firmware development time for battery-powered white goods.
High-Current Sink Drivers (20 mA)Drives LEDs or small relays directly from I²C SDA/SCL pins, eliminating external drivers in simple indicator circuits.
Serial Wire Debug (SWD)Two-pin debug interface (SWCLK/SWDIO) enables in-system programming and real-time trace without footprint overhead.

Applications

Lighting ControlAlarm System Interface

Use Scenario: Digital dimming and color mixing in LED luminaires using PWM and analog sensor feedback.

IC Role / Device Role / Timing Role: Main controller executing lighting algorithms, managing I²C-connected RGB drivers, and sampling ambient light via 10-bit ADC.

Use Value: 28 GPIO and dual timer match outputs enable independent PWM generation for multiple LED channels while maintaining RS-485 communication for central control.

Use Scenario: Monitoring door/window sensors and triggering siren output in residential security panels.

IC Role / Device Role / Timing Role: Low-power sensor hub with wake-up on interrupt, processing zone inputs, and driving audible/visual alerts.

Use Value: Windowed WDT and Deep-sleep mode with GPIO wake-up ensure reliable operation over years on coin-cell backup power.

eMetering Front-EndWhite Goods UI Panel

Use Scenario: Isolated energy measurement front-end communicating via RS-485 to main meter processor.

IC Role / Device Role / Timing Role: UART-based data concentrator acquiring ADC samples from current/voltage sensors and formatting packets for transmission.

Use Value: Fractional baud rate generator ensures precise RS-485 timing across temperature ranges, while 16 kB flash accommodates encryption routines.

Use Scenario: Keypad scanning, display backlight control, and appliance status reporting in washing machine control boards.

IC Role / Device Role / Timing Role: Human interface processor managing capacitive touch inputs, driving 7-segment displays, and logging fault codes to flash.

Use Value: Power profiles allow dynamic adjustment between responsive UI mode and ultra-low-power standby, extending product lifecycle.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
LPC1112FHN33/202Same package and pinout; 4 kB SRAM (vs. 2 kB) and power profiles enabled; no windowed WDT.Preferred where larger RAM buffers are needed for protocol stacks (e.g., Modbus RTU), but WWDT not required.Select when application demands >2 kB runtime memory and WWDT is unnecessary-no PCB change required.
LPC1112FHN33/203Same package and pinout; 4 kB SRAM, power profiles, and windowed WDT-all features of LPC1112FHN33/103 plus extra RAM.Drop-in upgrade path for designs needing more SRAM without altering layout or firmware architecture.Choose for future-proofing or immediate RAM expansion needs; identical timing, peripherals, and debug interface.

Compared with LPC1112FHN33/103, the /202 variant trades windowed watchdog safety for additional SRAM, while the /203 offers both enhancements-making it the optimal choice for new designs requiring robustness and headroom.

Availability

LPC1112FHN33/103 is available at Aetrix Electronics and suitable for lighting control, alarm system interface, and eMetering front-end applications requiring stable component supply and long-term industrial availability.

Supply support for LPC1112FHN33/103 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader delivering secure, scalable solutions for automotive, industrial, IoT, and mobile applications.

The LPC111x series targets cost-sensitive 32-bit embedded control, bridging the gap between 8/16-bit MCUs and higher-end Cortex-M cores with optimized power efficiency and minimal toolchain overhead.

FAQ

What is the maximum operating frequency of the LPC1112FHN33/103?

The LPC1112FHN33/103 operates at a maximum CPU frequency of 50 MHz. This speed is achievable using either the internal 12 MHz RC oscillator (trimmed to ±1 % accuracy) or an external crystal oscillator (1–25 MHz) with integrated PLL. The 50 MHz clock enables deterministic real-time response for UART, I²C, and timer operations without external clock synthesis components.

Does the LPC1112FHN33/103 support I²C Fast-mode Plus?

Yes, the LPC1112FHN33/103 supports I²C Fast-mode Plus with a data rate of up to 1 Mbit/s. Its SDA and SCL pins feature slew-rate control and high-current sink drivers (20 mA), enabling reliable bus operation with longer traces or higher capacitance loads. This capability is confirmed for the LPC1100XL series, to which LPC1112FHN33/103 belongs.

How many ADC input channels does the LPC1112FHN33/103 provide?

The LPC1112FHN33/103 provides 8 ADC input channels (AD0–AD7), accessible on the HVQFN33 package. The 10-bit successive approximation ADC supports multiplexed sampling across these pins, with configurable sample rates and trigger sources (timer match, software, or external event), making it suitable for multi-sensor monitoring in lighting and metering applications.

What power-saving modes are available on the LPC1112FHN33/103?

The LPC1112FHN33/103 supports three reduced-power modes: Sleep, Deep-sleep, and Deep power-down. In Deep-sleep mode, the CPU and most peripherals halt while retaining SRAM and register contents; wake-up is possible via up to 13 GPIO pins. Power profiles in boot ROM allow runtime selection of optimized performance/power trade-offs, critical for battery-operated alarm and metering devices.

Is the LPC1112FHN33/103 pin-compatible with other HVQFN33 variants in the LPC111x family?

Yes, the LPC1112FHN33/103 shares identical pinout and package dimensions (7 × 7 × 0.85 mm HVQFN33) with other LPC111x HVQFN33 variants including LPC1112FHN33/101, /102, /201, /202, and /203. Pin functions are consistent across these parts, enabling layout reuse and simplified BOM management when migrating between flash, RAM, or feature variants.

LPC1112FHN33/103,5 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
32-VQFN Exposed Pad
Series:
LPC1100XL
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, WDT
Number of I/O:
28
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
2K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LPC1112FHN33/103,5 FAQ

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Please submit a Request for Quotation (RFQ) for LPC1112FHN33/103,5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LPC1112FHN33/103,5 reliable?

The price and inventory of LPC1112FHN33/103,5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC1112FHN33/103,5 is usually 5 days.

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LPC1112FHN33/103,5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LPC1112FHN33/103,5 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LPC1112FHN33/103,5?

For technical support, including LPC1112FHN33/103,5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC1112FHN33/103,5 requirements.

6.How does Aetrix verify that LPC1112FHN33/103,5 is sourced from the original manufacturer or authorized distributors?

All LPC1112FHN33/103,5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC1112FHN33/103,5 meets industry standards.

7.What is the process for return or replacement of LPC1112FHN33/103,5?

All LPC1112FHN33/103,5 units undergo pre-shipment inspection (PSI). If there is an issue with LPC1112FHN33/103,5, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LPC1112FHN33/103,5 part is unused and in its original packaging.

Return procedure for LPC1112FHN33/103,5:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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