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NXP Semiconductors LPC1112FHN33/201,5
- Part No.:
- LPC1112FHN33/201,5
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-VQFN Exposed Pad
- Datasheet:
-
LPC1112FHN33/201,5.pdf
- Description:
- IC MCU 32BIT 16KB FLASH 32HVQFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,481
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Product details
Overview
LPC1112FHN33/201 from NXP Semiconductors is a 32-bit ARM Cortex-M0 microcontroller in HVQFN33 package, delivering up to 50 MHz CPU operation, 16 kB flash, 4 kB SRAM, and integrated peripherals including UART, I²C-bus (standard mode), SPI, 10-bit ADC with 8-channel input multiplexing, and four general-purpose timers. It targets cost-sensitive embedded control in lighting, alarm systems, and eMetering.
For engineers reviewing the LPC1112FHN33/201 datasheet, LPC1112FHN33/201 pinout, LPC1112FHN33/201 application, or LPC1112FHN33/201 equivalent, this page provides verified technical context, validated pin functions, real-world use cases, and confirmed alternative options for design-in and supply continuity.
Technical Context
The LPC1112FHN33/201 belongs to the LPC1100 series (non-L/non-XL variant), lacking power profiles, windowed watchdog timer, and second SPI interface. Its clock system includes a 12 MHz ±1 % internal RC oscillator, crystal oscillator support (1–25 MHz), and PLL for full-speed CPU operation without external high-frequency crystals.
It supports Sleep, Deep-sleep, and Deep power-down modes via an integrated PMU, and features edge/level-sensitive GPIO interrupts, high-current output (20 mA) on one pin, and configurable pull-up/pull-down resistors on all GPIOs - but excludes Fast-mode Plus I²C and open-drain configuration, which are limited to LPC1100L/XL variants.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M0, 32-bit RISC architecture optimized for deterministic real-time control and low-code-size applications. |
| Max Clock Frequency | 50 MHz - enables fast interrupt response and efficient execution of sensor fusion or protocol stack tasks. |
| Flash Memory | 16 kB - sufficient for compact firmware with bootloader, communication stacks, and application logic in space-constrained designs. |
| SRAM | 4 kB - supports moderate data buffering, stack depth, and real-time variable storage without external memory. |
| ADC Resolution & Channels | 10-bit with 8-channel multiplexing - allows simultaneous monitoring of multiple analog sensors (e.g., temperature, voltage, current) in industrial controls. |
| GPIO Count | 28 pins - provides ample I/O for LED drivers, button interfaces, relay control, and peripheral expansion in compact HVQFN33 footprint. |
| Serial Interfaces | 1 UART (RS-485 capable), 1 I²C-bus (standard mode), 1 SPI - meets basic industrial connectivity needs without protocol redundancy. |
Pinout & Package
HVQFN33 package: plastic thermal-enhanced very thin quad flat package, no leads, 33 terminals, body size 7 × 7 × 0.85 mm. Exposed thermal pad improves thermal dissipation in high-density PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RESET/PIO0_0 | Reset input / General-purpose I/O | Active-low hardware reset; dual-function pin usable as GPIO with interrupt capability after reset release. |
| XTALIN / XTALOUT | Crytal oscillator inputs | Supports external 1–25 MHz crystal for precise timing; XTALOUT can drive secondary clock loads. |
| SWDIO / PIO1_3 / AD4 / CT32B1_MAT2 | Debug I/O / ADC input / Timer match | Shared pin enables SWD debugging, analog sensing, and timer-based event generation - requires careful pinmux planning. |
| PIO0_4 / SCL | I²C serial clock | Open-drain-capable I²C clock line supporting standard-mode (100 kHz) communication with sensors and EEPROMs. |
| PIO0_5 / SDA | I²C serial data | Open-drain-capable I²C data line; must be externally pulled up; compatible with multi-master bus topologies. |
| PIO1_6 / RXD / CT32B0_MAT0 | UART receive / Timer match | Primary UART input with FIFO support; also serves as 32-bit timer match output for PWM or pulse generation. |
| PIO1_7 / TXD / CT32B0_MAT1 | UART transmit / Timer match | Full-duplex UART output with fractional baud rate generation; supports RS-485 direction control via software. |
| VDD (×2) | Power supply | Single 1.8–3.6 V supply; dual VDD pins reduce IR drop and improve noise immunity in mixed-signal operation. |
| VSS (×3) | Ground | Three ground terminals provide low-impedance return paths for digital, analog, and debug domains - critical for ADC accuracy and EMI performance. |
Key Features
| Feature | Design Value |
|---|---|
| ARM Cortex-M0 core with NVIC | Hardware-integrated nested vectored interrupt controller enables low-latency, prioritized handling of up to 32 interrupts - essential for responsive sensor polling and fault detection. |
| In-System Programming (ISP) | Field firmware updates via UART using on-chip bootloader - eliminates need for dedicated programming hardware during production or maintenance. |
| 12 MHz ±1 % internal RC oscillator | Eliminates external crystal for cost-sensitive applications while maintaining timing accuracy sufficient for UART baud rates and basic control loops. |
| Programmable Watchdog Timer (WDT) | Independent clock source ensures reliable system recovery from software hangs - configurable timeout and reset behavior via register writes. |
| GPIO with configurable pull resistors | On-chip pull-up/pull-down eliminates external biasing components, reducing BOM count and board area in space-constrained modules. |
Applications
| Smart Lighting Control | Security Alarm Panel |
|---|---|
Use Scenario: Dimmable LED driver with ambient light sensing and wireless command reception. IC Role / Device Role / Timing Role: Main controller executing lighting algorithms, reading ADC channels for light/temperature, managing UART for Zigbee module, and generating PWM via timer match outputs. Use Value: 16 kB flash accommodates lighting profile logic and communication stack; 28 GPIOs enable direct LED channel control and sensor interfacing without external expanders. | Use Scenario: Battery-backed intrusion detection unit with door/window contact monitoring and siren activation. IC Role / Device Role / Timing Role: Low-power supervisory MCU sampling reed switches via GPIO interrupts, managing Deep-sleep wake-up events, and driving buzzer/siren via high-current GPIO. Use Value: Integrated PMU and Deep power-down mode extend battery life to >1 year; 4 kB SRAM retains alarm state and sensor history across sleep cycles. |
| eMetering Interface Module | Industrial Sensor Node |
Use Scenario: Pulse-counting energy meter add-on board communicating via RS-485 to central gateway. IC Role / Device Role / Timing Role: Pulse accumulator and protocol translator - converting kWh pulses to Modbus RTU frames over UART with RS-485 transceiver control. Use Value: UART with fractional baud rate generator ensures precise 9600/19200 bps timing; 10-bit ADC monitors supply voltage for tamper detection. | Use Scenario: DIN-rail mounted temperature/humidity node with local display and CAN/RS-485 uplink. IC Role / Device Role / Timing Role: Data acquisition hub - reading analog sensors via ADC, debouncing digital inputs, and formatting packets for serial transmission. Use Value: Four independent timers allow concurrent sampling intervals, display refresh, and communication timeouts - no software timing jitter required. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC1112FHN33/101 | Same package and core, but 2 kB SRAM (vs. 4 kB) and no power profiles - lower memory headroom for complex stacks. | Suitable for simpler firmware with minimal dynamic allocation; not recommended if FreeRTOS or TCP/IP Lite is planned. | Select when BOM cost reduction is critical and application memory usage stays below 1.5 kB. |
| LPC1112FHN33/202 | Same flash/SRAM, but LPC1100L series - adds power profiles, windowed WDT, and configurable open-drain GPIO. | Better suited for safety-critical or ultra-low-power designs requiring certified watchdog behavior and flexible I/O drive modes. | Choose when enhanced reliability features justify minor cost increase and pin-compatible migration is acceptable. |
Compared with LPC1112FHN33/101, the LPC1112FHN33/201 offers double SRAM for richer firmware; compared with LPC1112FHN33/202, it omits advanced power management but simplifies qualification for non-safety applications.
Availability
LPC1112FHN33/201 is available at Aetrix Electronics and suitable for smart lighting control, security alarm panels, and eMetering interface modules requiring stable component supply across production lifecycles.
Supply support for LPC1112FHN33/201 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets.
The LPC111x family was designed for cost-sensitive 8/16-bit MCU replacement in resource-constrained embedded systems, emphasizing low power, small code footprint, and rapid time-to-market.
FAQ
What is the maximum operating frequency of the LPC1112FHN33/201?
The LPC1112FHN33/201 operates at a maximum CPU frequency of 50 MHz. This is achieved using either the internal 12 MHz RC oscillator with PLL multiplication or an external crystal oscillator (1–25 MHz) fed into the PLL. The 50 MHz clock drives the ARM Cortex-M0 core and all APB peripherals, enabling fast interrupt handling and deterministic real-time execution in the LPC1112FHN33/201.
Does the LPC1112FHN33/201 support Fast-mode Plus I²C?
No, the LPC1112FHN33/201 does not support Fast-mode Plus I²C (1 Mbit/s). It implements standard-mode I²C (100 kHz) only, as confirmed by its LPC1100-series classification - Fast-mode Plus is exclusive to LPC1100L and LPC1100XL variants. The LPC1112FHN33/201's I²C interface remains fully compliant with legacy I²C devices and sensors requiring standard timing.
How much SRAM and flash memory does the LPC1112FHN33/201 include?
The LPC1112FHN33/201 integrates 16 kB of on-chip flash memory and 4 kB of SRAM. Flash is used for program storage and supports in-system programming (ISP) and in-application programming (IAP); SRAM holds runtime variables, stack, and heap. These values are fixed for this specific ordering option and align with the LPC1100-series specification in the official NXP datasheet for LPC1112FHN33/201.
What package type and pin count does the LPC1112FHN33/201 use?
The LPC1112FHN33/201 uses an HVQFN33 package: a 7 mm × 7 mm × 0.85 mm thermally enhanced very thin quad flat no-lead package with 33 terminals. Pinout is identical across all HVQFN33 variants in the LPC111x family, including dedicated SWD debug, UART, I²C, SPI, ADC, and GPIO signals - verified in NXP's Figure 6 and Table 9 for LPC1112FHN33/201.
Is the LPC1112FHN33/201 compatible with the LPC1100L series power management features?
No, the LPC1112FHN33/201 is part of the base LPC1100 series and does not include power profiles, windowed watchdog timer, or configurable open-drain GPIO - all features reserved for LPC1100L and LPC1100XL variants. Its power management relies on standard Sleep, Deep-sleep, and Deep power-down modes via the integrated PMU, but lacks the programmable power optimization APIs found in LPC1100L/XL derivatives like LPC1112FHN33/202.
LPC1112FHN33/201,5 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-VQFN Exposed Pad
- Series:
- LPC1100
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- I2C, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, WDT
- Number of I/O:
- 28
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC1112FHN33/201,5 FAQ
1.How can I place an order for LPC1112FHN33/201,5 through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC1112FHN33/201,5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC1112FHN33/201,5 reliable?
The price and inventory of LPC1112FHN33/201,5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC1112FHN33/201,5 is usually 5 days.
3.What payment methods are accepted for LPC1112FHN33/201,5?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC1112FHN33/201,5 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LPC1112FHN33/201,5?
LPC1112FHN33/201,5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC1112FHN33/201,5 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC1112FHN33/201,5?
For technical support, including LPC1112FHN33/201,5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC1112FHN33/201,5 requirements.
6.How does Aetrix verify that LPC1112FHN33/201,5 is sourced from the original manufacturer or authorized distributors?
All LPC1112FHN33/201,5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC1112FHN33/201,5 meets industry standards.
7.What is the process for return or replacement of LPC1112FHN33/201,5?
All LPC1112FHN33/201,5 units undergo pre-shipment inspection (PSI). If there is an issue with LPC1112FHN33/201,5, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC1112FHN33/201,5 part is unused and in its original packaging.
Return procedure for LPC1112FHN33/201,5:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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