My Inquiry
My Account
NXP Semiconductors LPC1112JHN33/203E
- Part No.:
- LPC1112JHN33/203E
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-VQFN Exposed Pad
- Datasheet:
-
LPC1112JHN33/203E.pdf
- Description:
- IC MCU 32BIT 16KB FLASH 32HVQFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,126
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LPC1112JHN33/203E from NXP Semiconductors is a 32-bit ARM Cortex-M0 microcontroller in HVQFN33 package, operating up to 50 MHz with 16 kB flash, 4 kB SRAM, 10-bit ADC (8-channel), one UART with RS-485 support, one I²C-bus interface (Fast-mode Plus, 1 Mbit/s), two SPI controllers, four timers, and 28 GPIO pins. It targets cost-sensitive embedded control in lighting, alarm systems, and white goods.
For engineers reviewing the LPC1112JHN33/203E datasheet, LPC1112JHN33/203E pinout, LPC1112JHN33/203E application, or LPC1112JHN33/203E equivalent, this page delivers verified specifications, thermal-enhanced HVQFN33 package details, windowed watchdog timer functionality, extended temperature range (−40 °C to +105 °C), and power profile optimization for low-power industrial firmware development.
Technical Context
The LPC1112JHN33/203E belongs to the LPC1100XL series, featuring a programmable windowed watchdog timer (WWDT), power profiles stored in boot ROM for runtime performance/power trade-off selection, and configurable open-drain GPIO mode. Its clock system integrates a 12 MHz ±1 % internal RC oscillator, crystal oscillator (1–25 MHz), and PLL for CPU frequency scaling.
It supports In-System Programming (ISP) and In-Application Programming (IAP) via on-chip bootloader, includes Serial Wire Debug (SWD), and implements ARM Cortex-M0 NVIC with Non-Maskable Interrupt (NMI) capability. The device operates across 1.8 V to 3.6 V supply and supports Sleep, Deep-sleep, and Deep power-down modes with wake-up on up to 13 functional pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M0, 32-bit RISC architecture with Thumb-2 instruction set for compact code size and deterministic real-time response. |
| Max Clock Frequency | 50 MHz - enables fast interrupt handling and real-time control loop execution without external high-frequency crystals due to integrated PLL. |
| Flash Memory | 16 kB - sufficient for bootloader, RTOS kernel, and application logic in resource-constrained industrial nodes. |
| SRAM | 4 kB - supports stack, heap, and peripheral buffers for concurrent UART, I²C, and timer operations. |
| ADC | 10-bit, 8-channel multiplexed input - provides sufficient resolution for analog sensor interfacing (e.g., temperature, light, current sensing) in white goods. |
| I²C Interface | Fast-mode Plus (1 Mbit/s) with multi-address recognition and monitor mode - enables robust communication with multiple slave sensors or EEPROMs in noisy environments. |
| Operating Temperature | −40 °C to +105 °C (J-grade) - certified for under-hood automotive-adjacent or enclosed high-temperature industrial enclosures. |
| Power Modes | Sleep, Deep-sleep, Deep power-down - achieves sub-μA current draw in Deep power-down, critical for battery-backed alarm systems. |
Pinout & Package
HVQFN33 package: plastic thermal enhanced very thin quad flat package, no leads, 33 terminals, body size 7 × 7 × 0.85 mm, exposed thermal pad for improved heat dissipation in compact PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RESET/PIO0_0 | Reset input / GPIO port 0 pin 0 | Active-low hardware reset; configurable as general-purpose input/output with pull-up/down and interrupt capability. |
| XTALIN / XTALOUT | Crytal oscillator inputs | Supports 1–25 MHz external crystal for precise timing; optional bypass for internal RC oscillator use. |
| SWDIO / PIO1_3 / AD4 / CT32B1_MAT2 | SWD debug data / GPIO / ADC channel 4 / timer match output | Multi-function pin enabling debug access, analog sensing, and timer-based PWM generation without dedicated pins. |
| PIO0_4 / SCL | I²C clock line | Open-drain capable; supports Fast-mode Plus (1 Mbit/s); requires external pull-up for bus operation. |
| PIO0_5 / SDA | I²C data line | Open-drain capable; complements SCL for bidirectional communication with sensors, EEPROMs, or displays. |
| PIO1_6 / RXD / CT32B0_MAT0 | UART receive / timer match output | Hardware UART input with FIFO; dual-use for timer event triggering in protocol-aware state machines. |
| PIO1_7 / TXD / CT32B0_MAT1 | UART transmit / timer match output | Drives RS-485 transceiver enable lines or generates timed pulses for LED dimming or motor control. |
| VDD (x2) | Power supply | Dual 1.8–3.6 V supply pins improve noise immunity and current distribution across the die. |
| VSS (x2) | GND | Dual ground pins reduce ground bounce and enhance signal integrity for mixed-signal operation. |
| PIO1_4 / AD5 / CT32B1_MAT3 / WAKEUP | ADC channel 5 / timer match / wake-up source | Enables autonomous wake-from-Deep-sleep on analog threshold crossing or timer expiry - key for energy harvesting nodes. |
Key Features
| Feature | Design Value |
|---|---|
| Windowed Watchdog Timer (WWDT) | Prevents runaway code in safety-critical applications by requiring feed within defined time windows - not just periodic resets. |
| Power Profiles in Boot ROM | Runtime-selectable configurations optimize CPU/peripheral clocks and voltage scaling for specific tasks - eliminates manual register tuning per mode. |
| Configurable Open-Drain GPIO | Enables direct connection to I²C, SMBus, or wired-AND logic without external pull-ups on selected pins - reduces BOM count. |
| 12 MHz ±1 % Internal RC Oscillator | Eliminates need for external crystal in cost-sensitive designs while maintaining timing accuracy for UART baud rate generation. |
| Serial Wire Debug (SWD) | Two-pin debug interface (SWCLK/SWDIO) enables full firmware download, breakpoint, and register inspection with minimal PCB footprint. |
| In-Application Programming (IAP) | Allows field firmware updates via UART or I²C without external programmer - essential for remote device maintenance. |
Applications
| Lighting Control | Alarm System Panel |
|---|---|
Use Scenario: Digital LED driver with dimming, color mixing, and thermal monitoring in commercial downlights. IC Role / Device Role / Timing Role: Main controller executing PWM generation, ADC-based temperature feedback, and I²C communication with RGB LED drivers. Use Value: 28 GPIO and dual SPI interfaces allow direct control of multiple LED strings; WWDT ensures fail-safe shutdown if firmware hangs during thermal fault. | Use Scenario: Standalone burglar alarm panel with keypad, siren, PIR sensor inputs, and GSM module interface. IC Role / Device Role / Timing Role: Central security processor managing sensor polling, keypad scan, siren timing, and UART-based GSM command framing. Use Value: 10-bit ADC reads analog PIR outputs; extended −40 °C to +105 °C rating ensures reliability in unheated garages or attics. |
| White Goods UI | Industrial Sensor Node |
Use Scenario: User interface and motor control supervisor in washing machine or dishwasher with display, buttons, and pump/valve drivers. IC Role / Device Role / Timing Role: HMI coordinator handling button debounce, LCD segment driving (via GPIO), and UART communication with main MCU. Use Value: 16 kB flash stores localized language strings and UI state machine; power profiles reduce standby current to extend battery backup life. | Use Scenario: Battery-powered environmental monitor logging temperature, humidity, and door status in warehouse cold storage. IC Role / Device Role / Timing Role: Low-power data acquisition node performing periodic ADC sampling, I²C sensor reads, and UART transmission to gateway. Use Value: Deep power-down mode draws <1 μA; wake-up on ADC threshold allows event-driven sampling - extending 10-year battery life. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC1112FHN33/203 | Same core, flash, SRAM, and peripherals but rated for −40 °C to +85 °C (F-grade) and lacks extended temperature qualification. | Suitable for indoor consumer electronics where ambient temperature remains below 85 °C. | Select when cost sensitivity outweighs extended temperature requirement and industrial certification is not needed. |
| LPC1113JHN33/203 | 24 kB flash, same 4 kB SRAM, identical J-grade temperature range and peripheral set - adds 8 kB program memory headroom. | Better suited for applications requiring larger firmware (e.g., BLE stack integration or advanced UI rendering). | Choose when future firmware expansion or feature-rich field upgrades are anticipated without changing PCB layout. |
Compared with LPC1112JHN33/203E, LPC1112FHN33/203 offers identical functionality at lower cost but fails qualification for high-temperature industrial deployment, while LPC1113JHN33/203 provides immediate flash headroom for secure OTA updates and complex state machines - both retain pin compatibility and software binary compatibility.
Availability
LPC1112JHN33/203E is available at Aetrix Electronics and suitable for lighting control, alarm system panels, and white goods UI requiring stable component supply, long-term lifecycle assurance, and guaranteed traceability.
Supply support for LPC1112JHN33/203E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The LPC1100XL series, including LPC1112JHN33/203E, was designed for cost-optimized, low-power 32-bit embedded control in industrial and consumer appliances - emphasizing thermal robustness, debug accessibility, and firmware update flexibility.
FAQ
What is the maximum operating frequency of the LPC1112JHN33/203E?
The LPC1112JHN33/203E operates at a maximum CPU frequency of 50 MHz. This is achieved using the on-chip PLL, which can be driven by either the internal 12 MHz RC oscillator or an external crystal (1–25 MHz). The 50 MHz clock enables deterministic real-time response for control loops and communication stacks without requiring high-frequency external components.
Does the LPC1112JHN33/203E support In-Application Programming (IAP)?
Yes, the LPC1112JHN33/203E supports In-Application Programming (IAP) via its on-chip bootloader. This allows firmware updates to be performed dynamically during runtime using UART or I²C interfaces - eliminating the need for external programmers and enabling secure over-the-air (OTA) updates in deployed devices such as alarm panels or lighting controllers.
What is the significance of the 'J' suffix in LPC1112JHN33/203E?
The 'J' suffix in LPC1112JHN33/203E denotes the extended temperature grade: −40 °C to +105 °C. This qualifies the device for use in harsh thermal environments such as enclosed lighting fixtures, attic-mounted alarm hubs, or under-dash appliance control modules - distinguishing it from 'F'-grade parts rated only to +85 °C.
How many ADC channels does the LPC1112JHN33/203E support?
The LPC1112JHN33/203E integrates a 10-bit successive approximation ADC with input multiplexing across 8 pins (AD[7:0]). This configuration supports simultaneous monitoring of multiple analog sensors - for example, temperature, light intensity, and motor current - with sufficient resolution for closed-loop control in white goods and industrial sensor nodes.
Is the LPC1112JHN33/203E pin-compatible with other HVQFN33 variants in the LPC111x family?
Yes, the LPC1112JHN33/203E shares identical pinout and package dimensions (7 × 7 × 0.85 mm HVQFN33) with all other LPC111x parts in the same HVQFN33 variant group, including LPC1111/1112/1113/1114/1115 models with /FHN33 or /JHN33 suffixes. This enables drop-in replacement for flash/SRAM upgrades or temperature grade changes without PCB redesign.
LPC1112JHN33/203E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-VQFN Exposed Pad
- Series:
- LPC1100XL
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- I2C, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, WDT
- Number of I/O:
- 28
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC1112JHN33/203E FAQ
1.How can I place an order for LPC1112JHN33/203E through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC1112JHN33/203E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC1112JHN33/203E reliable?
The price and inventory of LPC1112JHN33/203E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC1112JHN33/203E is usually 5 days.
3.What payment methods are accepted for LPC1112JHN33/203E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC1112JHN33/203E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LPC1112JHN33/203E?
LPC1112JHN33/203E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC1112JHN33/203E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC1112JHN33/203E?
For technical support, including LPC1112JHN33/203E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC1112JHN33/203E requirements.
6.How does Aetrix verify that LPC1112JHN33/203E is sourced from the original manufacturer or authorized distributors?
All LPC1112JHN33/203E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC1112JHN33/203E meets industry standards.
7.What is the process for return or replacement of LPC1112JHN33/203E?
All LPC1112JHN33/203E units undergo pre-shipment inspection (PSI). If there is an issue with LPC1112JHN33/203E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC1112JHN33/203E part is unused and in its original packaging.
Return procedure for LPC1112JHN33/203E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LPC1112JHN33/203E Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
