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NXP Semiconductors LPC1112LVFHI33/103

Part No.:
LPC1112LVFHI33/103
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
32-VFQFN Exposed Pad
Datasheet:
AetrixLPC1112LVFHI33/103.pdf
Description:
IC MCU 32BIT 16KB FLASH 32HVQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,364

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Product details

Overview

LPC1112LVFHI33/103 from NXP Semiconductors is a 32-bit ARM Cortex-M0 microcontroller in HVQFN33 package, operating at up to 50 MHz with 16 kB flash, 4 kB SRAM, 8-channel 8-bit ADC, and 27 GPIO pins. It integrates UART, SPI/SSP, Fast-mode Plus I²C (1 Mbit/s), four counter/timers, and supports ultra-low-power Deep-sleep mode (≤1.6 µA) for battery-constrained portable electronics.

For engineers reviewing the LPC1112LVFHI33/103 datasheet, LPC1112LVFHI33/103 pinout, LPC1112LVFHI33/103 application, or LPC1112LVFHI33/103 equivalent, key selection criteria include its 1.65–1.95 V single-supply operation, 27-pin HVQFN33 footprint, 8-channel ADC capability, Fast-mode Plus I²C support, and wake-up-from-Deep-sleep via up to 13 GPIO pins.

Technical Context

The LPC1112LVFHI33/103 implements an ARM Cortex-M0 core with integrated NVIC and Serial Wire Debug, executing from on-chip flash with 256-byte page erase. Its clock system combines a 12 MHz ±2.5% internal RC oscillator, external crystal support (1–25 MHz), programmable watchdog oscillator (9.4 kHz–2.3 MHz), and PLL for CPU frequency scaling up to 50 MHz.

Digital peripherals include accelerated AHB-based GPIO with configurable pull-up/pull-down and open-drain mode on select pins, plus dedicated timer match/capture functions distributed across CT32B0, CT32B1, CT16B0, and CT16B1 - with CT16B1_CAP0, CT16B1_MAT0, CT16B1_MAT1, CT16B0_CAP1, and CT32B0_MAT3 explicitly available on HVQFN33 per datasheet Figure 4 and Table 3.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreARM Cortex-M0, 32-bit RISC, up to 50 MHz operation - enables deterministic real-time control with Thumb-2 instruction set and low code footprint vs. 8/16-bit MCUs.
Memory16 kB flash (256-byte page erase), 4 kB SRAM - sufficient for compact firmware with data buffering; supports ISP/IAP for field updates without external programmer.
Analog Input8-bit ADC with 8-channel multiplexing - provides direct sensor interface for temperature, voltage, or simple transducers in space-constrained designs.
Serial InterfacesUART (fractional baud, 16-byte FIFO), SPI/SSP (25 Mbit/s master), I²C Fast-mode Plus (1 Mbit/s) - enables robust communication with sensors, displays, and legacy peripherals.
Power SupplySingle 1.65–1.95 V rail - targets ultra-low-voltage applications such as coin-cell-powered accessories and energy-harvesting systems.
Low-Power ModesDeep-sleep mode ≤1.6 µA with 5 µs wake-up - extends battery life in intermittently active devices like wearables and remote sensors.
GPIO27 general-purpose I/O pins with configurable pull-up/pull-down, hysteresis, and interrupt capability on level/edge - supports flexible peripheral interfacing and wake-up signaling.

Pinout & Package

HVQFN33 package: plastic thermal enhanced very thin quad flat package, no leads, 33 terminals, body size 5 × 5 × 0.85 mm. Pin 1 marked by index area; exposed thermal pad (not electrically connected).

Pin/TerminalCircuit RoleDesign Meaning
RESET/PIO0_0Reset input / General-purpose I/OActive-Low reset with 20 ns glitch filter; also serves as digital I/O with 10 ns glitch filter and internal pull-up.
XTALIN / XTALOUTCry stal oscillator inputsSupports 1–25 MHz external crystal; XTALIN accepts ≤1.8 V input; XTALOUT drives external load - required for precise timing when IRC accuracy is insufficient.
SWDIO / SWCLKSerial Wire Debug interfaceEnables programming and real-time debugging via two-wire interface - eliminates need for JTAG connector space and pin count.
PIO0_4/SCL & PIO0_5/SDAI²C-bus interfaceOpen-drain pins supporting standard-mode and Fast-mode Plus (1 Mbit/s); high-current sink enabled only when Fast-mode Plus is configured in IOCON.
PIO1_10/AD6 & PIO1_11/AD7ADC input channelsTwo of eight dedicated analog inputs on HVQFN33; digital section disabled when used as ADC - prevents noise coupling during conversion.
PIO2_0/DTR & PIO3_4/RXD & PIO3_5/TXDUART modem control & dataDTR output and full UART RX/TX on extended pins - enables hardware flow control and RS-485/9-bit mode in compact form factor.

Key Features

FeatureDesign Value
Accelerated GPIOAHB-connected port registers enable single-cycle bit manipulation and full-port writes - critical for time-sensitive bit-banging or PWM generation without software overhead.
Fast-mode Plus I²C1 Mbit/s data rate with high-current sink drivers on SCL/SDA - reduces bus rise time on capacitive loads, enabling reliable communication with multiple slaves in dense PCB layouts.
Wake-up from Deep-sleepDedicated start logic triggered by up to 13 GPIO pins - allows selective, low-latency wake-up without polling or external interrupt controllers.
Programmable windowed WDTConfigurable timeout and window violation detection - prevents runaway code while allowing safe firmware update windows without premature resets.
ADC burst modeAutomatic sequential sampling across multiple channels with individual result registers - minimizes CPU intervention and interrupt latency during multi-sensor acquisition.

Applications

Mobile AccessoriesPortable Medical Electronics

Use Scenario: USB-C active cables with embedded power delivery negotiation and signal integrity monitoring.

IC Role / Device Role / Timing Role: Main controller managing PD protocol stack, voltage/current sensing via ADC, and status LED timing via GPIO PWM.

Use Value: 27 GPIO and 8-channel ADC enable simultaneous interface management; 1.65–1.95 V operation matches USB-C VCONN supply constraints.

Use Scenario: Disposable glucose meters with electrochemical sensor readout and Bluetooth LE connectivity.

IC Role / Device Role / Timing Role: Sensor signal acquisition (ADC), BLE subsystem coordination (UART/SPI), and ultra-low-power sleep/wake scheduling.

Use Value: ≤1.6 µA Deep-sleep current extends single-button-cell lifetime beyond 6 months; Fast-mode Plus I²C interfaces cleanly with display driver ICs.

CamerasTablets/Ultrabooks

Use Scenario: Embedded camera modules requiring lens focus control, flash sequencing, and image sensor configuration.

IC Role / Device Role / Timing Role: Peripheral manager handling I²C sensor register writes, GPIO-driven motor drivers, and timer-based flash pulse width control.

Use Value: Four independent timers with match/capture provide precise, jitter-free actuator timing; HVQFN33 footprint fits tight module board space.

Use Scenario: Keyboard/trackpad subsystems with capacitive touch sensing and HID report generation.

IC Role / Device Role / Timing Role: Dedicated input processor scanning GPIO matrix, filtering touch events, and transmitting HID reports via UART to main SoC.

Use Value: 27 GPIO support large key matrices; 5 µs wake-up ensures responsive user input without continuous polling power penalty.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
LPC1114LVFHI33/30332 kB flash, 8 kB SRAM, same HVQFN33 package and peripheral set - adds 16 kB program memory and 4 kB RAM.Supports larger firmware images and deeper data buffers; identical pinout and voltage range.Select when firmware exceeds 16 kB or requires >4 kB runtime RAM - no PCB change needed.
LPC11U12FHN24/203HVQFN24 package, 16 kB flash, 4 kB SRAM, USB 2.0 device controller - lacks USB but offers smaller footprint and same core/peripherals.Targets space-constrained designs where USB is unnecessary and 20 GPIO suffice.Choose for cost-optimized, USB-free applications needing minimal board area - requires layout revision due to 24-pin vs. 33-pin footprint.

Compared with LPC1114LVFHI33/303, the LPC1112LVFHI33/103 trades flash/RAM capacity for lower BOM cost in fixed-function roles; versus LPC11U12FHN24/203, it gains 7 additional GPIO and 2 ADC channels at the expense of USB - making it optimal for sensor-rich, non-USB embedded control.

Availability

LPC1112LVFHI33/103 is available at Aetrix Electronics and suitable for mobile accessories, portable medical electronics, camera modules, and tablet subsystems requiring stable component supply, long-term lifecycle assurance, and consistent parametric performance across production batches.

Supply support for LPC1112LVFHI33/103 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and consumer applications.

The LPC111xLV family was designed for cost-sensitive, ultra-low-power 32-bit embedded control in space-constrained portable electronics - delivering Cortex-M0 performance within 1.65–1.95 V operation and HVQFN packaging.

FAQ

What is the maximum operating frequency of the LPC1112LVFHI33/103?

The LPC1112LVFHI33/103 operates at a maximum CPU frequency of 50 MHz. This is achieved using the on-chip PLL driven by either the internal 12 MHz RC oscillator or an external crystal (1–25 MHz). The 50 MHz clock feeds the ARM Cortex-M0 core, timers, and peripherals - enabling real-time response in demanding sensor or communication tasks without external clock components.

Does the LPC1112LVFHI33/103 support USB functionality?

No, the LPC1112LVFHI33/103 does not include a USB controller. It provides UART, SPI/SSP, and Fast-mode Plus I²C for serial communication. For USB-enabled designs, engineers should consider NXP's LPC11Uxx series (e.g., LPC11U12FHN24/203), which integrates USB 2.0 device capability but uses a different peripheral set and package variant.

How many ADC channels are available on the LPC1112LVFHI33/103?

The LPC1112LVFHI33/103 features an 8-bit successive approximation ADC with input multiplexing across 8 pins - specifically enabled on the HVQFN33 package. Pins AD0 through AD7 correspond to PIO0_11, PIO1_0, PIO1_1, PIO1_2, PIO1_3, PIO1_4, PIO1_10, and PIO1_11. This 8-channel capability supports simultaneous multi-sensor monitoring in compact portable devices.

What power modes does the LPC1112LVFHI33/103 support?

The LPC1112LVFHI33/103 supports Sleep and Deep-sleep power modes. In Deep-sleep mode, current consumption is ≤1.6 µA with a 5 µs wake-up time - achieved by gating clocks to non-essential blocks while retaining SRAM and register state. Wake-up sources include GPIO interrupts (up to 13 pins), timer match events, and UART activity, making it ideal for battery-powered intermittent-operation systems.

Is the LPC1112LVFHI33/103 pin-compatible with other LPC111xLV variants?

Yes, the LPC1112LVFHI33/103 shares identical pinout and package (HVQFN33) with LPC1114LVFHI33/303, enabling drop-in replacement where increased flash (32 kB) or SRAM (8 kB) is required. However, it is not pin-compatible with HVQFN24 variants (e.g., LPC1112LVFHN24/003) due to differing terminal count and signal mapping - requiring PCB redesign for migration.

LPC1112LVFHI33/103 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
32-VFQFN Exposed Pad
Series:
LPC1100LV
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, WDT
Number of I/O:
27
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
4K x 8
Voltage - Supply (Vcc/Vdd):
1.65V ~ 1.95V
Data Converters:
A/D 6x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LPC1112LVFHI33/103 FAQ

1.How can I place an order for LPC1112LVFHI33/103 through Aetrix?

Please submit a Request for Quotation (RFQ) for LPC1112LVFHI33/103 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LPC1112LVFHI33/103 reliable?

The price and inventory of LPC1112LVFHI33/103 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC1112LVFHI33/103 is usually 5 days.

3.What payment methods are accepted for LPC1112LVFHI33/103?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC1112LVFHI33/103 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LPC1112LVFHI33/103?

LPC1112LVFHI33/103 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LPC1112LVFHI33/103 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LPC1112LVFHI33/103?

For technical support, including LPC1112LVFHI33/103 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC1112LVFHI33/103 requirements.

6.How does Aetrix verify that LPC1112LVFHI33/103 is sourced from the original manufacturer or authorized distributors?

All LPC1112LVFHI33/103 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC1112LVFHI33/103 meets industry standards.

7.What is the process for return or replacement of LPC1112LVFHI33/103?

All LPC1112LVFHI33/103 units undergo pre-shipment inspection (PSI). If there is an issue with LPC1112LVFHI33/103, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LPC1112LVFHI33/103 part is unused and in its original packaging.

Return procedure for LPC1112LVFHI33/103:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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