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NXP Semiconductors LPC1113FHN33/202,5
- Part No.:
- LPC1113FHN33/202,5
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-VQFN Exposed Pad
- Datasheet:
-
LPC1113FHN33/202,5.pdf
- Description:
- IC MCU 32BIT 24KB FLASH 32HVQFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,720
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Product details
Overview
LPC1113FHN33/202 from NXP Semiconductors is a 32-bit ARM Cortex-M0 microcontroller in HVQFN33 package, operating at up to 50 MHz with 24 kB flash, 4 kB SRAM, and 28 GPIO pins. It integrates UART with RS-485 support, Fast-mode Plus I²C (1 Mbit/s), two SPI interfaces, four timers, a 10-bit ADC (8-channel), and power profiles for low-power embedded control in industrial sensors and smart actuators.
For engineers reviewing the LPC1113FHN33/202 datasheet, LPC1113FHN33/202 pinout, LPC1113FHN33/202 application, or LPC1113FHN33/202 equivalent, this page delivers verified specifications, package mapping, functional pin roles, real-world use cases, and validated alternative options aligned with LPC1100L series requirements.
Technical Context
The LPC1113FHN33/202 implements the ARM Cortex-M0 core with NVIC and Serial Wire Debug, supporting deterministic real-time execution. Its clock system combines a 12 MHz ±1% internal RC oscillator, external crystal (1–25 MHz), programmable watchdog oscillator (7.8 kHz–1.8 MHz), and PLL for CPU frequencies up to 50 MHz.
Power management includes Sleep, Deep-sleep, and Deep power-down modes managed by an integrated PMU; power profiles are enabled in boot ROM for runtime optimization. The device supports pseudo open-drain GPIO mode, high-current I²C drivers (20 mA), and edge/level-sensitive interrupts on all GPIO pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M0, 32-bit RISC, up to 50 MHz operation - enables efficient C/C++ firmware and real-time interrupt response. |
| Flash Memory | 24 kB on-chip flash - sufficient for bootloader + application firmware with IAP support for field updates. |
| SRAM | 4 kB on-chip SRAM - supports moderate stack depth, data buffers, and RTOS task contexts. |
| GPIO Pins | 28 configurable GPIO pins with pull-up/pull-down, interrupt capability, and pseudo open-drain mode - suitable for sensor interfacing and discrete control. |
| ADC | 10-bit SAR ADC with 8 input channels - provides sufficient resolution for temperature, voltage, and analog sensor monitoring. |
| I²C Interface | Fast-mode Plus I²C (1 Mbit/s) with multiple address recognition - enables high-speed communication with EEPROMs, sensors, and displays. |
| UART | RS-485-capable UART with fractional baud rate generator and FIFO - supports robust long-distance industrial serial communication. |
| Timers | Four general-purpose timers (two 32-bit, two 16-bit) with capture inputs and match outputs - supports PWM generation, pulse-width measurement, and time-stamped event logging. |
Pinout & Package
HVQFN33 package: plastic thermal enhanced very thin quad flat package, no leads, 33 terminals, body size 7 × 7 × 0.85 mm, exposed thermal pad, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Core power supply | Single 3.3 V supply (1.8–3.6 V range); decoupling required per datasheet layout guidelines. |
| VSS | Ground reference | Dedicated ground terminal; connects to PCB ground plane for noise immunity and thermal dissipation. |
| RESET | Active-low reset input | Pulled HIGH externally in deep power-down; can function as GPIO if external reset not used. |
| XTALIN / XTALOUT | Crytal oscillator interface | Supports 1–25 MHz crystal; XTALOUT not available on HVQFN24 but present on HVQFN33. |
| PIO0_0 – PIO0_10, PIO1_0 – PIO1_11, PIO2_0 – PIO2_4, PIO3_0 – PIO3_4 | General-purpose I/O | 28 total GPIO pins; configurable as digital input/output, interrupt source, or peripheral function (e.g., UART, I²C, SPI). |
| SWDIO / SWCLK | Serial Wire Debug interface | Enables programming and debug via standard ARM SWD protocol using 2-pin connection. |
Key Features
| Feature | Design Value |
|---|---|
| Power Profiles | Boot ROM-resident power profiles enable one-function-call optimization of active/sleep current and wake-up latency for battery-powered devices. |
| Pseudo Open-Drain GPIO | Programmable GPIO mode eliminates need for external pull-ups on I²C or wired-AND buses, reducing BOM count and board space. |
| High-Current I²C Drivers | 20 mA sink capability on SDA/SCL pins supports Fast-mode Plus (1 Mbit/s) without external drivers or level shifters. |
| In-Application Programming (IAP) | Page-erase IAP commands allow firmware updates in-system without halting application execution - critical for remote maintenance. |
| RS-485 UART Support | Hardware flow control (RTS/CTS) and driver enable control simplify integration into industrial Modbus networks. |
Applications
| Industrial Sensor Node | Smart Actuator Controller |
|---|---|
Use Scenario: Compact environmental sensor node measuring temperature, humidity, and pressure in factory automation cabinets. IC Role / Device Role / Timing Role: Central MCU executing sensor polling, data preprocessing, and RS-485 Modbus RTU transmission every 500 ms. Use Value: 24 kB flash stores dual-firmware images; 4 kB SRAM accommodates sensor buffers and protocol stack; low-power profiles extend battery life beyond 2 years. | Use Scenario: Motorized valve controller receiving setpoint commands over I²C from PLC and driving H-bridge via GPIO PWM. IC Role / Device Role / Timing Role: Real-time actuation coordinator with precise 100 µs timer-based PWM and fault-safe watchdog supervision. Use Value: 28 GPIO pins directly drive enable/control signals and read feedback switches; Fast-mode Plus I²C handles configuration updates at 1 Mbit/s. |
| Energy Metering Subsystem | IoT Edge Gateway Module |
Use Scenario: Sub-metering module in commercial lighting systems, sampling AC line voltage/current via ADC and reporting via UART to central controller. IC Role / Device Role / Timing Role: Signal acquisition and local decision engine - triggers alerts on overvoltage events using ADC threshold interrupts. Use Value: 10-bit ADC with 8-channel multiplexing captures multiple analog inputs; 50 MHz CPU ensures sub-millisecond response to transient faults. | Use Scenario: Low-cost edge node aggregating BLE sensor data and forwarding via RS-485 to cloud gateway in building automation. IC Role / Device Role / Timing Role: Protocol bridge between short-range wireless (via external host MCU) and wired industrial network. Use Value: Two SPI interfaces manage external BLE SoC and flash storage; UART+RS-485 ensures interoperability with legacy BACnet MS/TP infrastructure. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC1113FHN33/302 | Same 24 kB flash, 4 kB SRAM, HVQFN33 package, but belongs to LPC1100XL series with dual SPI and page-erase IAP enabled. | Required where in-field firmware updates via IAP page erase are mandatory; not needed for static firmware deployments. | Select LPC1113FHN33/302 when full IAP functionality is required; LPC1113FHN33/202 suffices for fixed-feature applications with simpler update needs. |
| LPC1114FHN33/202 | 32 kB flash, 4 kB SRAM, identical package and peripheral set - adds 8 kB code capacity without changing footprint or software porting effort. | Suitable for applications requiring larger firmware (e.g., added crypto, OTA stack, or extended diagnostics) while retaining same power and timing behavior. | Choose LPC1114FHN33/202 when future firmware growth is anticipated; no PCB change needed due to pin-to-pin compatibility. |
Compared with LPC1113FHN33/202, the LPC1113FHN33/302 adds page-erase IAP and second SPI for enhanced field-upgrade flexibility, while the LPC1114FHN33/202 extends flash headroom by 33% - both retain identical power profiles, GPIO count, and timing characteristics for drop-in scalability.
Availability
LPC1113FHN33/202 is available at Aetrix Electronics and suitable for industrial sensor nodes, smart actuator controllers, and energy metering subsystems requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.
Supply support for LPC1113FHN33/202 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The LPC111x family targets cost-sensitive, low-power 32-bit embedded control applications - designed to replace legacy 8/16-bit MCUs with ARM Cortex-M0 efficiency, reduced code size, and simplified toolchain adoption.
FAQ
What is the maximum operating frequency of the LPC1113FHN33/202?
The LPC1113FHN33/202 operates at a maximum CPU frequency of 50 MHz, achievable via its integrated PLL driven by either the internal 12 MHz RC oscillator or an external crystal (1–25 MHz). This frequency is fully supported across the specified industrial temperature range (−40 °C to +85 °C) and meets all timing constraints in the UM10398 user manual.
Does the LPC1113FHN33/202 support In-Application Programming (IAP)?
Yes, the LPC1113FHN33/202 supports In-Application Programming (IAP) through its on-chip bootloader. As a member of the LPC1100L series, it supports standard IAP commands including copy RAM to flash and erase sector; however, page-erase IAP is only enabled in the LPC1100XL variant (e.g., LPC1113FHN33/302), not in the LPC1113FHN33/202.
How many ADC channels does the LPC1113FHN33/202 provide, and what is its resolution?
The LPC1113FHN33/202 features a single 10-bit successive approximation register (SAR) ADC with up to 8 input channels (AD0–AD7), accessible on specific GPIO pins depending on package. All 8 channels are available on the HVQFN33 package, enabling simultaneous monitoring of multiple analog sensors without external multiplexing.
Is the LPC1113FHN33/202 pin-compatible with other LPC111x HVQFN33 variants?
Yes, the LPC1113FHN33/202 is pin-compatible with all other LPC111x devices in the HVQFN33 package (e.g., LPC1111FHN33/202, LPC1112FHN33/202, LPC1114FHN33/202), sharing identical pin count, mechanical footprint, and signal assignment. This allows direct substitution within the same hardware design when flash/SRAM or peripheral requirements align.
What debug interface does the LPC1113FHN33/202 support?
The LPC1113FHN33/202 supports Serial Wire Debug (SWD) via dedicated SWDIO and SWCLK pins, compliant with ARM CoreSight standards. It does not include JTAG; SWD enables full programming, breakpoint setting, and real-time variable inspection using standard tools like LPC-Link2, CMSIS-DAP, or SEGGER J-Link.
LPC1113FHN33/202,5 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-VQFN Exposed Pad
- Series:
- LPC1100L
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- I2C, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, WDT
- Number of I/O:
- 28
- Program Memory Size:
- 24KB (24K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC1113FHN33/202,5 FAQ
1.How can I place an order for LPC1113FHN33/202,5 through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC1113FHN33/202,5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC1113FHN33/202,5 reliable?
The price and inventory of LPC1113FHN33/202,5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC1113FHN33/202,5 is usually 5 days.
3.What payment methods are accepted for LPC1113FHN33/202,5?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC1113FHN33/202,5 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LPC1113FHN33/202,5?
LPC1113FHN33/202,5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC1113FHN33/202,5 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC1113FHN33/202,5?
For technical support, including LPC1113FHN33/202,5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC1113FHN33/202,5 requirements.
6.How does Aetrix verify that LPC1113FHN33/202,5 is sourced from the original manufacturer or authorized distributors?
All LPC1113FHN33/202,5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC1113FHN33/202,5 meets industry standards.
7.What is the process for return or replacement of LPC1113FHN33/202,5?
All LPC1113FHN33/202,5 units undergo pre-shipment inspection (PSI). If there is an issue with LPC1113FHN33/202,5, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC1113FHN33/202,5 part is unused and in its original packaging.
Return procedure for LPC1113FHN33/202,5:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LPC1113FHN33/202,5 Tags
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