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NXP Semiconductors LPC1113FHN33/203,5
- Part No.:
- LPC1113FHN33/203,5
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-VQFN Exposed Pad
- Datasheet:
-
LPC1113FHN33/203,5.pdf
- Description:
- IC MCU 32BIT 24KB FLASH 32HVQFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,191
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Product details
Overview
LPC1113FHN33/203 from NXP Semiconductors is an ARM Cortex-M0-based 32-bit microcontroller in a 33-terminal HVQFN package, operating at up to 50 MHz with 24 kB flash, 4 kB SRAM, and integrated UART (RS-485), Fast-mode Plus I²C, two SPI interfaces, four timers, and an 8-channel 10-bit ADC. It targets low-power industrial control and sensor interface applications requiring compact footprint and robust peripheral integration.
For engineers reviewing the LPC1113FHN33/203 datasheet, LPC1113FHN33/203 pinout, LPC1113FHN33/203 application, or LPC1113FHN33/203 equivalent, this page delivers verified specifications, package mapping, functional alternatives, and design-critical context for embedded system integration, power-constrained firmware development, and industrial-grade signal acquisition.
Technical Context
The LPC1113FHN33/203 belongs to the LPC1100XL series, enabling In-Application Programming (IAP) with page-erase capability and enhanced timer capture functionality-including capture-clear on 16-bit and 32-bit timers for precise pulse-width measurement. Its clock system integrates a 12 MHz ±1% internal RC oscillator, crystal oscillator (1–25 MHz), PLL, and programmable watchdog oscillator (7.8 kHz–1.8 MHz).
Power management includes Sleep, Deep-sleep, and Deep power-down modes managed by an integrated PMU, with wake-up support via up to 13 GPIO pins. The device supports power profiles for optimized active/sleep trade-offs and features brownout detection with four configurable thresholds for reset or interrupt generation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M0, 32-bit RISC, up to 50 MHz operation - enables efficient real-time control with Thumb-2 instruction set and NVIC for deterministic interrupt handling. |
| Flash Memory | 24 kB on-chip flash with page-erase IAP - supports field firmware updates without external programming hardware. |
| SRAM | 4 kB on-chip SRAM - sufficient for RTOS stacks, protocol buffers, and sensor data aggregation in compact nodes. |
| Analog Input | 10-bit ADC with 8 selectable input channels - provides adequate resolution for temperature, voltage, and current sensing in industrial monitoring. |
| Serial Interfaces | 1 UART (RS-485 capable), 1 Fast-mode Plus I²C (1 Mbit/s), 2 SPI (SSP features) - enables multi-drop bus communication and sensor/actuator interfacing with noise immunity. |
| Timers | Four general-purpose timers (two 32-bit, two 16-bit) with capture inputs and match outputs - supports PWM generation, input capture for encoder signals, and time-stamped event logging. |
| Operating Voltage | 1.8 V to 3.6 V single supply - compatible with Li-ion battery systems and standard 3.3 V logic rails without level-shifting. |
| Temperature Range | −40 °C to +85 °C - qualified for industrial environments including factory automation and building controls. |
Pinout & Package
HVQFN33 package: plastic thermal-enhanced very thin quad flat no-lead package, 7 mm × 7 mm × 0.85 mm body, 33 terminals, exposed thermal pad (pin 33), RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Core power supply | Primary 1.8–3.6 V supply for digital logic and analog peripherals; requires local decoupling near pin. |
| VSS | Ground reference | Digital ground return; must be connected to PCB ground plane with low-inductance path. |
| RESET | Active-low reset input | Asynchronous reset; pulled HIGH externally in deep power-down mode; can serve as GPIO if external reset not used. |
| XTALIN / XTALOUT | Crytal oscillator inputs | Supports 1–25 MHz crystal; XTALOUT not available on all variants - verify layout compatibility per datasheet Figure 1 note (3). |
| PIO0_0 – PIO0_10, PIO1_0 – PIO1_11, PIO2_0 – PIO2_7, PIO3_0 – PIO3_4 | General-purpose I/O | Up to 28 GPIO pins with configurable pull-up/pull-down, edge/level-sensitive interrupts, and high-current drive (20 mA sink on I²C pins). |
| UART_RXD / UART_TXD / UART_RTS / UART_CTS | RS-485 UART interface | Full hardware flow control; RTS/CTS pins enable automatic direction control in half-duplex RS-485 transceivers. |
| I2C_SDA / I2C_SCL | Fast-mode Plus I²C bus | Supports 1 Mbit/s data rate with multiple address recognition; open-drain with internal pull-ups disabled by default. |
| SPI0_SCK / SPI0_MISO / SPI0_MOSI / SPI0_SSEL | Primary SPI interface | Full-duplex master/slave operation with FIFO and multi-protocol support; SSEL active-low chip select. |
| ADC_IN0 – ADC_IN7 | Analog input channels | Eight dedicated ADC input pins mapped to internal multiplexer; share physical pins with GPIO (e.g., PIO0_11 = ADC_IN0). |
| CLKOUT | Clock output | Programmable divider output reflecting IRC, system oscillator, CPU, or watchdog clock - useful for test instrumentation or synchronizing external logic. |
Key Features
| Feature | Design Value |
|---|---|
| Page-erase In-Application Programming (IAP) | Enables firmware updates in-system without halting execution or requiring external programmer - critical for remote maintenance of deployed devices. |
| Capture-clear timer function | Automatically clears timer on capture event, eliminating software overhead for pulse-width measurement - improves timing accuracy in motor control feedback loops. |
| Power profiles in boot ROM | Pre-validated low-power configurations accessible via single API call - reduces development time for battery-powered sensor nodes targeting >5-year lifetime. |
| Fast-mode Plus I²C (1 Mbit/s) | Twice the speed of standard Fast-mode I²C with improved noise immunity - supports higher data throughput from multi-sensor arrays without bus contention. |
| High-current I²C pin drivers (20 mA sink) | Drives longer I²C traces or higher bus capacitance without external buffers - simplifies layout in space-constrained industrial modules. |
| Brownout detect with 4 thresholds | Configurable voltage monitoring for graceful shutdown or fault logging before supply collapse - prevents corrupted flash writes during brownout events. |
Applications
| Industrial Sensor Node | Smart Building Controller |
|---|---|
Use Scenario: Compact environmental monitor measuring temperature, humidity, and CO₂ using analog and I²C sensors, transmitting data via RS-485 to central HVAC unit. IC Role / Device Role / Timing Role: Central MCU executing sensor fusion, UART-to-RS-485 protocol translation, and low-power sleep/wake scheduling. Use Value: 24 kB flash stores multi-sensor calibration tables and communication stack; 4 kB SRAM buffers burst measurements; Fast-mode Plus I²C handles concurrent sensor reads without bus blocking. | Use Scenario: Wall-mounted lighting and occupancy controller managing DALI ballasts and PIR sensors across commercial office zones. IC Role / Device Role / Timing Role: Real-time coordinator managing DALI command timing, occupancy event debouncing, and scheduled dimming profiles. Use Value: Capture-clear timers precisely measure PIR pulse widths for reliable occupancy detection; power profiles extend battery life in wireless variants; UART RS-485 enables daisy-chained wiring. |
| Programmable Logic Relay | Asset Tracking Module |
Use Scenario: DIN-rail mounted relay module accepting digital inputs, executing user-defined logic (AND/OR/timers), and driving 24 V DC outputs in factory machinery. IC Role / Device Role / Timing Role: Deterministic state-machine executor with sub-millisecond I/O response and non-volatile logic configuration storage. Use Value: 24 kB flash holds compiled ladder logic; GPIO interrupt latency < 12 cycles ensures fast response to emergency stop signals; brownout detection prevents unsafe state transitions during voltage sag. | Use Scenario: Battery-powered GPS tracker reporting location every 5 minutes via cellular modem, sleeping between transmissions to conserve energy. IC Role / Device Role / Timing Role: Power manager coordinating GPS fix acquisition, modem handshake, and deep-sleep entry/exit with wake-up via RTC alarm or motion interrupt. Use Value: Deep power-down mode draws < 1 µA; wake-up from Deep-sleep via GPIO allows immediate motion-triggered reporting; 4 kB SRAM retains GPS almanac and modem state across sleep cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC1114FHN33/203 | 32 kB flash, same 4 kB SRAM, identical HVQFN33 package and peripheral set. | Supports larger firmware images (e.g., BLE stack + sensor drivers) without changing PCB layout. | Select when future firmware expansion or dual-application partitioning (e.g., bootloader + app) is required. |
| LPC1113FBD48/303 | LQFP48 package (48 pins), 24 kB flash, 8 kB SRAM, adds 14 extra GPIO and second SPI interface. | Enables more complex I/O routing and additional serial peripherals in non-space-constrained designs. | Choose when board area permits larger package and higher I/O count is needed for multi-sensor or multi-actuator systems. |
Compared with LPC1113FHN33/203, LPC1114FHN33/203 offers +10 kB flash for feature-rich firmware while maintaining pin and code compatibility; LPC1113FBD48/303 trades compactness for expanded I/O and memory, supporting more demanding peripheral integration without architectural change.
Availability
LPC1113FHN33/203 is available at Aetrix Electronics and suitable for industrial sensor nodes, smart building controllers, and programmable logic relays requiring stable component supply, long-term lifecycle assurance, and consistent parametric performance across production batches.
Supply support for LPC1113FHN33/203 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with core expertise in ARM-based microcontrollers and mixed-signal integration.
The LPC111x family was designed specifically for cost-sensitive, low-power 32-bit embedded applications replacing legacy 8/16-bit MCUs - emphasizing small footprint, energy efficiency, and rapid time-to-market through mature toolchain and ecosystem support.
FAQ
What is the maximum operating frequency of the LPC1113FHN33/203?
The LPC1113FHN33/203 operates at a maximum CPU frequency of 50 MHz, achievable via its integrated PLL driven by either the internal 12 MHz RC oscillator or an external crystal (1–25 MHz). This frequency is fully supported across the −40 °C to +85 °C industrial temperature range with appropriate voltage supply (1.8–3.6 V).
Does the LPC1113FHN33/203 support In-Application Programming (IAP)?
Yes, the LPC1113FHN33/203 supports In-Application Programming (IAP) with page-erase capability as part of the LPC1100XL series feature set. This allows firmware updates to be performed while the device is running, using the on-chip bootloader without requiring external programming hardware or full chip erase.
How many ADC channels does the LPC1113FHN33/203 provide, and what is their resolution?
The LPC1113FHN33/203 integrates a 10-bit successive-approximation ADC with eight selectable input channels (ADC_IN0–ADC_IN7), mapped to specific GPIO pins. Resolution is fixed at 10 bits, providing 1024 discrete levels across the VDD reference range, suitable for precision analog sensing in industrial monitoring applications.
What power-saving modes are available on the LPC1113FHN33/203?
The LPC1113FHN33/203 implements three reduced-power modes: Sleep (CPU halted, peripherals active), Deep-sleep (CPU and most clocks stopped, SRAM retained), and Deep power-down (all clocks off, SRAM lost, wake-up only via dedicated pins or RTC). Power profiles in boot ROM simplify configuration of optimal active/sleep trade-offs.
Is the LPC1113FHN33/203 pin-compatible with other LPC111x HVQFN33 variants?
Yes, the LPC1113FHN33/203 shares identical pinout and package dimensions (HVQFN33, 7×7 mm) with other LPC111x HVQFN33 variants such as LPC1111FHN33/203, LPC1112FHN33/203, and LPC1114FHN33/203. Pin functions, power, and ground locations are consistent across this package family, enabling drop-in replacement within the same series.
LPC1113FHN33/203,5 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-VQFN Exposed Pad
- Series:
- LPC1100XL
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- I2C, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, WDT
- Number of I/O:
- 28
- Program Memory Size:
- 24KB (24K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC1113FHN33/203,5 FAQ
1.How can I place an order for LPC1113FHN33/203,5 through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC1113FHN33/203,5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC1113FHN33/203,5 reliable?
The price and inventory of LPC1113FHN33/203,5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC1113FHN33/203,5 is usually 5 days.
3.What payment methods are accepted for LPC1113FHN33/203,5?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC1113FHN33/203,5 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LPC1113FHN33/203,5?
LPC1113FHN33/203,5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC1113FHN33/203,5 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC1113FHN33/203,5?
For technical support, including LPC1113FHN33/203,5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC1113FHN33/203,5 requirements.
6.How does Aetrix verify that LPC1113FHN33/203,5 is sourced from the original manufacturer or authorized distributors?
All LPC1113FHN33/203,5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC1113FHN33/203,5 meets industry standards.
7.What is the process for return or replacement of LPC1113FHN33/203,5?
All LPC1113FHN33/203,5 units undergo pre-shipment inspection (PSI). If there is an issue with LPC1113FHN33/203,5, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC1113FHN33/203,5 part is unused and in its original packaging.
Return procedure for LPC1113FHN33/203,5:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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