My Inquiry
My Account
NXP Semiconductors LPC1113FHN33/302,5
- Part No.:
- LPC1113FHN33/302,5
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-VQFN Exposed Pad
- Datasheet:
-
LPC1113FHN33/302,5.pdf
- Description:
- IC MCU 32BIT 24KB FLASH 32HVQFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,285
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LPC1113FHN33/302 from NXP Semiconductors is a 32-bit ARM Cortex-M0 microcontroller in HVQFN33 package, operating at up to 50 MHz with 24 kB flash, 8 kB SRAM, and integrated UART (RS-485), Fast-mode Plus I²C, two SPI interfaces, four timers, 10-bit ADC (8 channels), and GPIO (28 pins). It targets low-power embedded control in industrial sensors and smart peripherals.
For engineers reviewing the LPC1113FHN33/302 datasheet, LPC1113FHN33/302 pinout, LPC1113FHN33/302 application, or LPC1113FHN33/302 equivalent, key selection criteria include power profile support (LPC1100L series), 3.3 V single-supply operation, 28 GPIO with programmable pseudo open-drain mode, and compatibility with ISP/IAP firmware updates.
Technical Context
The LPC1113FHN33/302 implements the ARMv6-M architecture with NVIC and Serial Wire Debug, enabling deterministic real-time interrupt handling and on-chip debug. Its clock system integrates a 12 MHz ±1% internal RC oscillator, crystal oscillator (1–25 MHz), PLL, and programmable watchdog oscillator (7.8 kHz–1.8 MHz).
Power management includes Sleep, Deep-sleep, and Deep power-down modes managed by an integrated PMU; power profiles are stored in boot ROM and activated via function call. Brownout detection supports four thresholds for reset/interrupt, and the device features a unique serial number for identification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M0, 32-bit RISC, up to 50 MHz - enables efficient execution of real-time control tasks with minimal code footprint. |
| Flash Memory | 24 kB - sufficient for medium-complexity firmware including bootloader, communication stacks, and application logic. |
| SRAM | 8 kB - supports dynamic data structures, buffers for UART/I²C/SPI, and RTOS task stacks. |
| GPIO Pins | 28 pins with configurable pull-up/pull-down and pseudo open-drain mode - simplifies interface to legacy buses and reduces external component count. |
| ADC | 10-bit SAR ADC with 8 input channels - suitable for analog sensor monitoring (e.g., temperature, voltage, current) without external signal conditioning. |
| Serial Interfaces | 1× UART (RS-485), 1× Fast-mode Plus I²C (1 Mbit/s), 2× SPI with FIFO - enables robust multi-drop industrial networking and peripheral expansion. |
| Timers | Four general-purpose timers (two 32-bit, two 16-bit), each with capture inputs and match outputs - supports PWM generation, pulse-width measurement, and precise event timing. |
| Operating Voltage | 1.8 V to 3.6 V - allows direct integration with 3.3 V systems and compatibility with battery-powered designs. |
Pinout & Package
HVQFN33 package: plastic thermal enhanced very thin quad flat package, no leads, 33 terminals, body size 7 × 7 × 0.85 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Core & I/O supply | 3.3 V nominal supply; decoupling required per datasheet layout guidelines to ensure stable operation. |
| VSS | GND reference | Digital ground plane connection; multiple VSS pins must be tied to low-impedance ground for noise immunity. |
| RESET | Active-low reset input | Can be used as GPIO if external reset not needed; must be pulled HIGH externally in deep power-down mode. |
| XTALIN / XTALOUT | Crytal oscillator interface | Supports 1–25 MHz crystal; XTALOUT not available on this variant per block diagram note (3). |
| PIO0_0 – PIO0_10, PIO1_0 – PIO1_11, PIO2_0 – PIO2_4, PIO3_0 – PIO3_4 | General-purpose I/O | 28 total GPIO pins; all support edge/level interrupts and configurable drive strength (20 mA sink on I²C pins). |
| TXD / RXD | UART transmit/receive | Supports RS-485 half-duplex operation; fractional baud rate generator enables precise timing across wide frequency ranges. |
| SDA / SCL | I²C-bus interface | Fast-mode Plus capable (1 Mbit/s); supports multiple address recognition and monitor mode for bus diagnostics. |
| SCK0 / MISO0 / MOSI0 / SSEL0 | SPI0 interface | Full-duplex master/slave SPI with FIFO; supports multi-protocol framing for interoperability with diverse peripherals. |
| SCK1 / MISO1 / MOSI1 / SSEL1 | SPI1 interface | Second SPI available on HVQFN33; SSEL1 function mapped to PIO2_0 per Table 170 and Figure 28. |
Key Features
| Feature | Design Value |
|---|---|
| Power Profiles | ROM-resident optimization functions reduce active/sleep power consumption without firmware modification - critical for battery-operated field devices. |
| Pseudo Open-Drain GPIO | Configurable per-pin output mode eliminates need for external pull-ups on I²C or wired-AND buses - saves board space and BOM cost. |
| In-Application Programming (IAP) | Page-erase capability (LPC1100XL series) enables safe firmware updates in-field without full chip erase - improves product serviceability. |
| High-Current I²C Drivers | 20 mA sink capability on SDA/SCL pins supports longer bus runs and higher capacitance loads - extends usable distance in industrial wiring. |
| Unique Device Serial Number | Factory-programmed 128-bit ID enables secure device authentication and traceability in production and field deployments. |
Applications
| Industrial Sensor Node | Smart HVAC Actuator |
|---|---|
Use Scenario: Compact environmental sensor node measuring temperature, humidity, and CO₂ in building automation systems. IC Role / Device Role / Timing Role: Central controller managing ADC sampling, RS-485 Modbus RTU communication, and local LED/status feedback. Use Value: 24 kB flash stores Modbus stack + sensor fusion algorithms; 8 kB SRAM buffers multi-sensor readings; power profiles extend battery life beyond 5 years. | Use Scenario: Motorized damper actuator with position feedback, fault reporting, and networked control in commercial HVAC units. IC Role / Device Role / Timing Role: Real-time motion controller executing PID loops, interpreting I²C sensor data, and driving H-bridge via GPIO PWM outputs. Use Value: Four timers enable simultaneous PWM generation, encoder counting, and watchdog supervision; 28 GPIO support discrete inputs (limit switches) and outputs (relays, LEDs). |
| Programmable Logic Relay | Energy Meter Interface Module |
Use Scenario: DIN-rail mounted relay module accepting digital inputs and controlling AC loads via solid-state relays. IC Role / Device Role / Timing Role: Deterministic I/O processor handling opto-isolated inputs, debouncing, and timed output sequencing. Use Value: ARM Cortex-M0 NVIC ensures sub-10 µs interrupt latency for safety-critical input response; pseudo open-drain mode simplifies interfacing to 24 V DC control signals. | Use Scenario: Add-on communication module bridging legacy pulse-output energy meters to LoRaWAN or NB-IoT gateways. IC Role / Device Role / Timing Role: Pulse counter and protocol translator converting meter kWh pulses into encrypted JSON payloads over UART/I²C. Use Value: Dedicated capture-capable timers accurately measure low-frequency meter pulses (≤10 Hz); 10-bit ADC monitors supply voltage for brownout resilience. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC1113FBD48/302 | LQFP48 package (48 pins), 42 GPIO, second SPI fully routed, same flash/SRAM/peripherals. | Requires larger PCB footprint; enables more I/O expansion and dual-SPI peripheral daisy-chaining. | Select when >28 GPIO or additional SPI routing is required; not pin-compatible with HVQFN33. |
| LPC1114FHN33/302 | 32 kB flash (vs. 24 kB), identical package, peripherals, and power profile support. | Provides 8 kB additional firmware space for larger protocol stacks (e.g., MQTT-SN, OTA update handlers). | Select when firmware size exceeds 24 kB; same pinout and layout - drop-in flash upgrade path. |
Compared with LPC1113FHN33/302, LPC1113FBD48/302 offers greater I/O scalability but increases board area, while LPC1114FHN33/302 delivers immediate firmware headroom within identical mechanical constraints - making it the optimal upgrade for memory-constrained designs.
Availability
LPC1113FHN33/302 is available at Aetrix Electronics and suitable for industrial sensor nodes, smart HVAC actuators, and programmable logic relays requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.
Supply support for LPC1113FHN33/302 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The LPC111x family was designed specifically for cost-sensitive, low-power 32-bit embedded control applications replacing legacy 8/16-bit MCUs - emphasizing simplicity, energy efficiency, and rapid time-to-market.
FAQ
What is the maximum operating frequency of the LPC1113FHN33/302?
The LPC1113FHN33/302 operates at a maximum CPU frequency of 50 MHz, achievable using the on-chip PLL driven by either the internal 12 MHz RC oscillator or an external crystal (1–25 MHz). This frequency is sustained across the full industrial temperature range (−40 °C to +85 °C) under 3.3 V supply conditions.
Does the LPC1113FHN33/302 support In-System Programming (ISP)?
Yes, the LPC1113FHN33/302 supports In-System Programming via its built-in bootloader, accessible through UART (RS-485), I²C, or SPI. As an LPC1100L-series part, it also supports power profiles and includes ROM-based ISP routines compatible with standard NXP Flash Magic and LPCXpresso tools.
How many ADC channels does the LPC1113FHN33/302 provide, and what is their resolution?
The LPC1113FHN33/302 integrates a single 10-bit successive approximation register (SAR) ADC with multiplexing across up to 8 input pins (AD[7:0]). All 8 channels are available in the HVQFN33 package, supporting sampling rates up to 400 kS/s with programmable trigger sources including timers and software.
Is the LPC1113FHN33/302 pin-compatible with other LPC111x HVQFN33 variants?
Yes, the LPC1113FHN33/302 shares identical pinout and package dimensions (7 × 7 × 0.85 mm HVQFN33) with all other LPC111x FHN33 variants (e.g., LPC1111/1112/1114 FHN33), enabling hardware reuse across different flash/SRAM configurations within the same series.
What debug interface does the LPC1113FHN33/302 support?
The LPC1113FHN33/302 supports Serial Wire Debug (SWD) via dedicated SWCLK and SWDIO pins, providing full JTAG-equivalent debugging capabilities including breakpoints, watchpoints, and real-time memory access - compatible with LPC-Link2, CMSIS-DAP, and SEGGER J-Link debug probes.
LPC1113FHN33/302,5 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-VQFN Exposed Pad
- Series:
- LPC1100L
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- I2C, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, WDT
- Number of I/O:
- 28
- Program Memory Size:
- 24KB (24K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC1113FHN33/302,5 FAQ
1.How can I place an order for LPC1113FHN33/302,5 through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC1113FHN33/302,5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC1113FHN33/302,5 reliable?
The price and inventory of LPC1113FHN33/302,5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC1113FHN33/302,5 is usually 5 days.
3.What payment methods are accepted for LPC1113FHN33/302,5?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC1113FHN33/302,5 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LPC1113FHN33/302,5?
LPC1113FHN33/302,5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC1113FHN33/302,5 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC1113FHN33/302,5?
For technical support, including LPC1113FHN33/302,5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC1113FHN33/302,5 requirements.
6.How does Aetrix verify that LPC1113FHN33/302,5 is sourced from the original manufacturer or authorized distributors?
All LPC1113FHN33/302,5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC1113FHN33/302,5 meets industry standards.
7.What is the process for return or replacement of LPC1113FHN33/302,5?
All LPC1113FHN33/302,5 units undergo pre-shipment inspection (PSI). If there is an issue with LPC1113FHN33/302,5, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC1113FHN33/302,5 part is unused and in its original packaging.
Return procedure for LPC1113FHN33/302,5:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LPC1113FHN33/302,5 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
