NXP Semiconductors LPC1113FHN33/303,5

Overview

LPC1113FHN33/303 from NXP Semiconductors is an ARM Cortex-M0 32-bit microcontroller in HVQFN33 package, featuring 24 kB flash, 8 kB SRAM, 28 GPIO pins, 10-bit ADC with 8-channel input multiplexing, and support for UART, I²C-Fast-mode Plus (1 Mbit/s), and two SPI interfaces. It operates at up to 50 MHz and targets low-power embedded control in metering and lighting systems.

For engineers reviewing the LPC1113FHN33/303 datasheet, LPC1113FHN33/303 pinout, LPC1113FHN33/303 application, or LPC1113FHN33/303 equivalent, key selection criteria include its LPC1100XL series power profiles, windowed watchdog timer, configurable open-drain GPIO mode, and 7 × 7 mm thermal-enhanced HVQFN33 footprint for space-constrained designs.

Technical Context

The LPC1113FHN33/303 implements the ARM Cortex-M0 core with Nested Vectored Interrupt Controller (NVIC) and system tick timer, executing instructions at up to 50 MHz using either internal 12 MHz RC oscillator (±1 %) or external crystal (1–25 MHz). Its clock generation includes a PLL for CPU frequency scaling and programmable watchdog oscillator (9.4 kHz–2.3 MHz).

It belongs to the LPC1100XL series, enabling power optimization via boot-ROM-resident power profiles, windowed WDT, and three low-power modes (Sleep, Deep-sleep, Deep power-down). The device supports wake-up from Deep-sleep via up to 13 functional pins and features brownout detection with four threshold levels.

Key Specifications

Pinout & Package

HVQFN33 package: plastic thermal enhanced very thin quad flat package, no leads, 33 terminals, body size 7 × 7 × 0.85 mm. Exposed thermal pad improves heat dissipation in compact PCB layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with LPC1113FHN33/303, LPC1114FHN33/303 provides 33 % more flash for complex protocol stacks, while LPC11U14FHN33/303 adds USB 2.0 at the cost of slightly higher active power - both retain identical HVQFN33 footprint and low-power profile compatibility.

Availability

LPC1113FHN33/303 is available at Aetrix Electronics and suitable for smart metering, LED lighting control, home security panels, and refrigerator control units requiring stable component supply and long-term industrial availability.

Supply support for LPC1113FHN33/303 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The LPC1100XL series, including LPC1113FHN33/303, was designed for cost-sensitive, ultra-low-power embedded applications where small footprint, integrated analog peripherals, and robust power management are essential - especially in utility metering and appliance control.

FAQ

What is the maximum operating frequency of the LPC1113FHN33/303?

The LPC1113FHN33/303 operates at a maximum CPU frequency of 50 MHz. This is achieved using the on-chip PLL driven by either the internal 12 MHz RC oscillator (trimmed to ±1 % accuracy) or an external crystal (1–25 MHz range). The 50 MHz clock supports real-time execution of communication stacks and sensor processing without external clock synthesis.

Does the LPC1113FHN33/303 support I²C Fast-mode Plus?

Yes, the LPC1113FHN33/303 supports I²C Fast-mode Plus with a data rate of 1 Mbit/s. This capability is confirmed for the LPC1100XL series, to which LPC1113FHN33/303 belongs. The I²C interface also includes multiple address recognition and monitor mode, and its SDA/SCL pins support 20 mA sink current for driving heavy bus loads.

How much flash and SRAM does the LPC1113FHN33/303 have?

The LPC1113FHN33/303 integrates 24 kB of on-chip flash memory and 8 kB of SRAM. Flash supports page erase (256-byte granularity) and both In-System Programming (ISP) and In-Application Programming (IAP) via the on-chip bootloader. The 8 kB SRAM enables efficient buffering for UART/I²C/SPI transactions and accommodates lightweight RTOS kernels.

What power-saving features does the LPC1113FHN33/303 offer?

The LPC1113FHN33/303 offers Sleep, Deep-sleep, and Deep power-down modes managed by an integrated Power Management Unit (PMU). As part of the LPC1100XL series, it includes boot-ROM-resident power profiles for one-function optimization of performance vs. current draw. Wake-up from Deep-sleep is supported on up to 13 GPIO pins, and brownout detection has four programmable thresholds for interrupt or forced reset.

Is the LPC1113FHN33/303 pin-compatible with other HVQFN33 variants in the LPC111x family?

Yes, the LPC1113FHN33/303 shares identical pinout and package dimensions (7 × 7 × 0.85 mm HVQFN33) with other LPC111x FHN33 variants, including LPC1112FHN33/203, LPC1114FHN33/303, and LPC1115FBD48/303 (though the latter is LQFP48). Pin compatibility enables drop-in replacement within the same series, provided flash/SRAM requirements and peripheral enablement align with the target application.