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NXP Semiconductors LPC1113JHN33/303E
- Part No.:
- LPC1113JHN33/303E
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-VQFN Exposed Pad
- Datasheet:
-
LPC1113JHN33/303E.pdf
- Description:
- IC MCU 32BIT 24KB FLASH 32HVQFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,983
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Product details
Overview
LPC1113JHN33/303E from NXP Semiconductors is a 32-bit ARM Cortex-M0 microcontroller in HVQFN33 package, featuring 24 kB flash, 8 kB SRAM, 10-bit ADC with 8-channel input multiplexing, UART with RS-485 support, and Fast-mode Plus I²C interface operating at 1 Mbit/s - deployed in smart lighting control systems requiring low-power, compact footprint, and industrial temperature operation.
For engineers reviewing the LPC1113JHN33/303E datasheet, LPC1113JHN33/303E pinout, LPC1113JHN33/303E application, or LPC1113JHN33/303E equivalent, this page delivers verified technical context, validated pin functions, real-world use cases, and confirmed alternative options for embedded firmware development, BOM optimization, and thermal-grade MCU selection.
Technical Context
The LPC1113JHN33/303E implements an ARM Cortex-M0 core with Nested Vectored Interrupt Controller (NVIC) and system tick timer, executing at up to 50 MHz using internal 12 MHz RC oscillator (±1 %) or external crystal (1–25 MHz). It integrates a programmable windowed watchdog timer and power management unit supporting Sleep, Deep-sleep, and Deep power-down modes.
Peripherals include one UART with fractional baud rate generation and RS-485 support, one Fast-mode Plus I²C-bus interface (1 Mbit/s), two SPI controllers (SSP features, FIFO), four general-purpose timers (up to 13 match outputs), and a 10-bit ADC with configurable channel selection across 8 pins - all accessible via 28 GPIOs in the HVQFN33 package.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M0, 32-bit RISC, supports Thumb-2 instruction set for compact code size vs. 8/16-bit MCUs. |
| Max Clock Frequency | 50 MHz - enables real-time response in lighting dimming algorithms and sensor polling loops. |
| Flash Memory | 24 kB - sufficient for bootloader + application firmware with OTA update partitioning. |
| SRAM | 8 kB - supports multiple concurrent peripheral buffers (UART FIFO, SPI DMA, ADC result storage). |
| I²C Speed | 1 Mbit/s Fast-mode Plus - allows high-speed communication with RGB LED drivers and digital sensors. |
| ADC Resolution | 10-bit - provides 1024-level precision for ambient light sensing and thermal monitoring inputs. |
| GPIO Count | 28 pins - includes configurable pull-up/pull-down, open-drain mode, and edge/level interrupt capability. |
| Operating Temp | −40 °C to +105 °C (J-grade) - qualified for enclosed LED driver housings and industrial control panels. |
Pinout & Package
HVQFN33 package: plastic thermal-enhanced very thin quad flat no-lead package, 7 mm × 7 mm × 0.85 mm body, 33 terminals, exposed thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Power supply | Single 1.8–3.6 V rail powering core and I/O; requires local 100 nF decoupling per VDD pin. |
| VSS | GND | Digital ground reference; connects to exposed thermal pad for thermal dissipation and noise reduction. |
| RESET/PIO0_0 | Reset input / GPIO | Active-low reset with internal pull-up; dual-function pin usable as general-purpose input after boot. |
| XTALIN / XTALOUT | Clock input/output | Supports external crystal (1–25 MHz) or ceramic resonator; enables precise timing for UART baud rates and ADC sampling. |
| SWDIO / PIO1_3 | Debug I/O | Serial Wire Debug bidirectional data line; shares pin with ADC input AD4 and timer capture CT32B1_MAT2. |
| SWCLK / PIO0_10 | Debug clock | Serial Wire Debug clock input; also functions as SPI0 SCK and timer match output CT16B0_MAT2. |
| PIO0_4 / SCL | I²C clock | Open-drain I²C bus clock line; supports Fast-mode Plus (1 Mbit/s) for fast sensor configuration. |
| PIO0_5 / SDA | I²C data | Open-drain I²C bus data line; shares functionality with GPIO and interrupt-capable input. |
| PIO1_6 / RXD | UART receive | Asynchronous serial input with internal FIFO; supports RS-485 half-duplex mode via RTS control. |
| PIO1_7 / TXD | UART transmit | Asynchronous serial output; compatible with RS-485 transceivers for long-distance lighting network control. |
| PIO0_9 / MOSI0 | SPI master out | Primary SPI0 data output for driving LED matrix drivers or external flash memory. |
| PIO0_8 / MISO0 | SPI master in | SPI0 data input for reading status registers from connected peripherals. |
| PIO0_2 / SSEL0 | SPI slave select | Active-low chip select for SPI0 peripheral addressing; configurable as GPIO or timer capture input. |
| AD[7:0] | ADC inputs | Eight analog input channels mapped to GPIO pins; supports single-ended acquisition with 10-bit resolution. |
Key Features
| Feature | Design Value |
|---|---|
| Windowed Watchdog Timer | Prevents runaway code in safety-critical lighting control by requiring periodic windowed refreshes - available only in LPC1100XL series (includes LPC1113JHN33/303E). |
| Power Profiles in Boot ROM | Optimizes current consumption across Sleep/Deep-sleep/Deep power-down modes via single API call - exclusive to LPC1100L/XL variants. |
| Configurable Open-Drain Mode | Enables direct drive of I²C buses and logic-level translation without external pull-ups on selected GPIOs. |
| High-Current Sink on I²C Pins | 20 mA sink capability on SDA/SCL supports robust bus driving under capacitive loads typical in multi-node lighting networks. |
| 12 MHz Internal RC Oscillator | ±1 % accuracy eliminates need for external crystal in cost-sensitive applications while maintaining UART timing integrity. |
| Serial Wire Debug (SWD) | Two-pin debug interface reduces PCB footprint and simplifies in-circuit programming and real-time trace during firmware validation. |
Applications
| Smart Lighting Control | Industrial Sensor Node |
|---|---|
Use Scenario: Dimmable LED driver board with ambient light and temperature feedback. IC Role / Device Role / Timing Role: Main controller executing PWM dimming logic, ADC sampling, and I²C communication with color sensor ICs. Use Value: 28 GPIOs enable direct PWM output and sensor interface; 10-bit ADC resolves lux changes down to 1% increments; J-grade temp rating ensures reliability inside sealed fixtures. | Use Scenario: Battery-powered environmental monitor in HVAC ducts or factory floors. IC Role / Device Role / Timing Role: Low-power data aggregator collecting temperature, humidity, and air quality readings before wireless transmission. Use Value: Deep power-down mode draws <1 μA; windowed WDT prevents firmware lockup; UART supports RS-485 daisy-chaining across multiple nodes. |
| Alarm System Panel | White Goods Interface Module |
Use Scenario: Entry-level security panel managing door/window contact sensors and siren output. IC Role / Device Role / Timing Role: Central MCU handling zone polling, tamper detection, and audible alarm triggering via GPIO-driven buzzer. Use Value: 24 kB flash accommodates encrypted event logging; 8 kB SRAM buffers sensor state history; GPIO interrupt capability detects edge-triggered contact closures instantly. | Use Scenario: User interface module for washing machine control panel with rotary encoder and LED indicators. IC Role / Device Role / Timing Role: Dedicated UI processor managing button debouncing, encoder quadrature decoding, and LED brightness control. Use Value: Four 32-bit timers support precise encoder pulse counting and PWM-based LED dimming; Fast-mode Plus I²C interfaces with touch controller ICs at 1 Mbit/s. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC1113FHN33/303 | Same flash/SRAM/peripherals but F-grade (−40 °C to +85 °C); lacks extended temperature qualification. | Suitable for commercial indoor lighting or consumer appliances where ambient temperature remains below 85 °C. | Select when cost sensitivity outweighs industrial thermal requirements and board layout allows same HVQFN33 footprint. |
| LPC1114JHN33/303 | 32 kB flash (+8 kB), identical SRAM, peripherals, package, and J-grade temperature range. | Preferred for designs requiring larger firmware image (e.g., integrated BLE stack or advanced UI rendering). | Choose when future firmware expansion or feature-rich application logic demands additional non-volatile storage beyond 24 kB. |
Compared with LPC1113JHN33/303E, the LPC1113FHN33/303 offers identical functionality at lower cost but reduced thermal margin, while the LPC1114JHN33/303 provides 33 % more flash without changing pinout, power, or peripheral compatibility - enabling seamless scalability within the same hardware design.
Availability
LPC1113JHN33/303E is available at Aetrix Electronics and suitable for smart lighting control, industrial sensor nodes, alarm system panels, and white goods interface modules requiring stable component supply across extended temperature ranges.
Supply support for LPC1113JHN33/303E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The LPC111x series targets cost-sensitive, low-power embedded applications - designed to replace legacy 8/16-bit MCUs with ARM Cortex-M0 efficiency, simplified toolchain support, and integrated analog/digital peripherals for rapid system integration.
FAQ
What is the maximum operating frequency of the LPC1113JHN33/303E?
The LPC1113JHN33/303E operates at a maximum CPU frequency of 50 MHz. This speed is achievable using either the internal 12 MHz RC oscillator (with PLL multiplication) or an external crystal oscillator in the 1 MHz to 25 MHz range. The PLL allows full-speed operation without requiring a high-frequency crystal, reducing BOM cost and layout complexity while maintaining timing accuracy for UART and ADC subsystems in the LPC1113JHN33/303E.
Does the LPC1113JHN33/303E support in-system programming (ISP)?
Yes, the LPC1113JHN33/303E supports In-System Programming (ISP) via its built-in bootloader, accessible through UART using standard serial commands. This enables field firmware updates without requiring dedicated debug hardware. ISP functionality is retained across all LPC111x variants including the LPC1113JHN33/303E and works with common terminal tools and NXP's Flash Magic utility, provided the device is not secured.
How many ADC channels does the LPC1113JHN33/303E support, and what is their resolution?
The LPC1113JHN33/303E integrates a 10-bit successive approximation ADC with input multiplexing across up to 8 pins (AD[7:0]), as supported by the HVQFN33 package. Each conversion delivers 1024 discrete levels, enabling precise measurement of analog sensor outputs such as thermistors or photodiodes. Channel selection is software-configurable, and conversions can be triggered manually or by timer match events - a capability confirmed in the LPC1113JHN33/303E datasheet section "Analog peripherals".
What debug interface does the LPC1113JHN33/303E provide?
The LPC1113JHN33/303E provides Serial Wire Debug (SWD), a two-pin (SWDIO and SWCLK) ARM-standard debug interface that replaces JTAG for reduced pin count and simpler routing. SWD supports full breakpoint, register access, and memory inspection capabilities via tools like LPCXpresso IDE or Segger J-Link. Both debug pins are shared with GPIO and peripheral functions (e.g., SWDIO = PIO1_3 = AD4), requiring careful pin assignment during PCB layout - a key constraint documented for the LPC1113JHN33/303E.
Is the LPC1113JHN33/303E pin-compatible with other LPC111x HVQFN33 variants?
Yes, the LPC1113JHN33/303E is pin-compatible with all other LPC111x family members in the HVQFN33 package, including LPC1111/1112/1114/1115 variants across F/J grades and /201–/333 suffixes. Pin functions, power domains, and peripheral mappings are consistent across the series, enabling hardware reuse and firmware portability. This compatibility is explicitly confirmed in NXP's pin description tables (e.g., Table 11 for J-grade HVQFN33) and applies directly to the LPC1113JHN33/303E.
LPC1113JHN33/303E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-VQFN Exposed Pad
- Series:
- LPC1100XL
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- I2C, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, WDT
- Number of I/O:
- 28
- Program Memory Size:
- 24KB (24K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC1113JHN33/303E FAQ
1.How can I place an order for LPC1113JHN33/303E through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC1113JHN33/303E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC1113JHN33/303E reliable?
The price and inventory of LPC1113JHN33/303E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC1113JHN33/303E is usually 5 days.
3.What payment methods are accepted for LPC1113JHN33/303E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC1113JHN33/303E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LPC1113JHN33/303E?
LPC1113JHN33/303E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC1113JHN33/303E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC1113JHN33/303E?
For technical support, including LPC1113JHN33/303E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC1113JHN33/303E requirements.
6.How does Aetrix verify that LPC1113JHN33/303E is sourced from the original manufacturer or authorized distributors?
All LPC1113JHN33/303E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC1113JHN33/303E meets industry standards.
7.What is the process for return or replacement of LPC1113JHN33/303E?
All LPC1113JHN33/303E units undergo pre-shipment inspection (PSI). If there is an issue with LPC1113JHN33/303E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC1113JHN33/303E part is unused and in its original packaging.
Return procedure for LPC1113JHN33/303E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LPC1113JHN33/303E Tags
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