Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors LPC1114FHN33/302:5

Part No.:
LPC1114FHN33/302:5
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
32-VQFN Exposed Pad
Datasheet:
AetrixLPC1114FHN33/302:5.pdf
Description:
IC MCU 32BIT 32KB FLASH 32HVQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,937

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

LPC1114FHN33/302:5 from NXP Semiconductors is a 32-bit ARM Cortex-M0 microcontroller in HVQFN33 package, featuring 32 kB flash, 8 kB SRAM, 28 GPIO pins, 10-bit ADC with 8 channels, and UART with RS-485 support - deployed in industrial sensor nodes requiring low-power operation and compact footprint.

For engineers reviewing the LPC1114FHN33/302:5 datasheet, LPC1114FHN33/302:5 pinout, LPC1114FHN33/302:5 application, or LPC1114FHN33/302:5 equivalent, key selection criteria include power profile support (LPC1100L series), Fast-mode Plus I²C capability, SPI dual-interface availability, and operating temperature range of –40 °C to +85 °C.

Technical Context

The LPC1114FHN33/302:5 implements an ARM Cortex-M0 core with NVIC, system tick timer, and Serial Wire Debug interface. It operates at up to 50 MHz using internal 12 MHz RC oscillator (1% trimmed) or external crystal (1–25 MHz), with PLL for frequency scaling.

Its peripheral set includes one UART with fractional baud rate generation and RS-485 support, two SPI controllers (SSP-capable), Fast-mode Plus I²C (1 Mbit/s), four general-purpose timers (with capture inputs), programmable WDT, and 10-bit ADC multiplexed across eight pins.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreARM Cortex-M0, 32-bit RISC, up to 50 MHz - enables deterministic real-time control with Thumb-2 instruction set and low interrupt latency.
Flash Memory32 kB on-chip flash - sufficient for firmware with bootloader, communication stacks, and application logic in space-constrained embedded systems.
SRAM8 kB on-chip SRAM - supports moderate data buffering, stack depth, and RTOS task contexts without external memory.
GPIO Pins28 configurable GPIO pins - provides flexible I/O mapping for sensor interfacing, LED control, and digital signal routing in HVQFN33 layout.
ADC10-bit SAR ADC with 8 input channels - delivers sufficient resolution for analog sensor acquisition (e.g., temperature, voltage, current) with hardware multiplexing.
UART1 UART with RS-485 support and fractional baud rate generator - enables robust multi-drop industrial serial communication with precise timing tolerance.
I²C InterfaceFast-mode Plus I²C (1 Mbit/s) - allows high-speed communication with sensors, EEPROMs, and PMICs while maintaining backward compatibility with standard I²C devices.

Pinout & Package

HVQFN33 package: plastic thermal enhanced very thin quad flat package, no leads, 33 terminals, body size 7 × 7 × 0.85 mm.

Pin/TerminalCircuit RoleDesign Meaning
VDDPower supplySingle 3.3 V supply (1.8–3.6 V range); decoupling required per datasheet layout guidelines.
VSSGNDDigital ground reference; multiple VSS pins provide low-impedance return paths for noise-sensitive analog/digital domains.
RESETActive-low reset inputCan be used as GPIO if external reset not needed; must be pulled HIGH externally in deep power-down mode.
XTALIN / XTALOUTCrytal oscillator input/outputSupports 1–25 MHz crystal; XTALOUT not available on HVQFN33 variant per Figure 1 note (3).
PIO0_0 – PIO0_10, PIO1_0 – PIO1_11, PIO2_0 – PIO2_6, PIO3_0 – PIO3_4General-purpose I/O28 total GPIO pins; each configurable as input/output, pull-up/down, edge/level interrupt source, or peripheral function (UART/I²C/SPI).
U0_TXD / U0_RXDUART0 transmit/receiveRS-485-compatible UART signals; support half-duplex bus operation with driver enable control via GPIO.
I2C_SDA / I2C_SCLI²C bus signalsOpen-drain capable; support Fast-mode Plus (1 Mbit/s); internal pull-ups enabled only when configured for I²C function.
SCK0 / MISO0 / MOSI0 / SSEL0SPI0 interfaceFull-duplex synchronous serial interface; SSEL0 active-low chip select enables multi-slave configuration.
AD0 – AD7ADC input channelsEight analog inputs mapped to GPIO pins; only AD[7:0] available on HVQFN33 per Section 1.4 note (4).

Key Features

FeatureDesign Value
Power ProfilesOptimized Active/Sleep/Deep-sleep modes via boot ROM functions - reduces average current to µA-range in sensor wake-on-event applications.
Pseudo Open-Drain ModeProgrammable GPIO output mode - eliminates need for external pull-ups in I²C or level-shifting interfaces, simplifying BOM and PCB layout.
In-Application Programming (IAP)Page-erase flash update capability - enables field firmware upgrades without full chip erase, preserving calibration data and NV parameters.
High-Current GPIO Drivers20 mA sink on I²C pins, 20 mA source on dedicated pin - directly drives LEDs or small relays without external drivers in compact designs.
Watchdog Timer LockWDT clock source lock prevents accidental disable - ensures fail-safe reset behavior in safety-critical monitoring functions.

Applications

Industrial Sensor NodeSmart Meter Interface

Use Scenario: Battery-powered environmental sensor collecting temperature, humidity, and CO₂ data with periodic wireless upload.

IC Role / Device Role / Timing Role: Main controller executing sensor polling, ADC conversion, data aggregation, and low-power sleep scheduling.

Use Value: 8 kB SRAM buffers multiple sensor readings; power profiles minimize active time; UART+RS-485 enables wired commissioning and diagnostics.

Use Scenario: Sub-metering module interfacing with utility meter ICs and display via I²C and SPI.

IC Role / Device Role / Timing Role: Protocol bridge translating between meter ASIC registers and local HMI or gateway interface.

Use Value: Fast-mode Plus I²C handles high-speed register reads; dual SPI supports simultaneous meter and display communication; 28 GPIO allow flexible pin assignment.

Building Automation ControllerPOS Peripheral Hub

Use Scenario: HVAC zone controller managing damper actuation, temperature feedback, and occupancy detection.

IC Role / Device Role / Timing Role: Real-time decision engine coordinating analog inputs, PWM outputs, and Modbus RTU over RS-485.

Use Value: UART RS-485 compliance ensures interoperability with legacy building systems; 10-bit ADC resolves thermistor curves accurately; 32 kB flash hosts Modbus stack and logic.

Use Scenario: Compact payment terminal add-on board aggregating magnetic stripe, barcode, and keypad inputs.

IC Role / Device Role / Timing Role: Secure peripheral coordinator handling encrypted data routing and tamper detection signaling.

Use Value: GPIO interrupt capability detects fast edge events (e.g., card swipe); pseudo open-drain mode simplifies connection to legacy peripherals; 50 MHz CPU ensures low-latency response.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
LPC1114FBD48/302LQFP48 package (48-pin), 42 GPIO, same flash/SRAM/peripherals - larger footprint but more I/O and ADC channel availability.Preferred where board space permits and >28 GPIO or full 8-channel ADC usage is required.Select when additional I/O, SPI1, or CT32B1_CAP0 functionality is needed beyond HVQFN33 pinout constraints.
LPC1113FHN33/30224 kB flash, otherwise identical package, SRAM, peripherals, and power profiles - reduced code capacity only.Suitable for simpler firmware (e.g., basic sensor polling without protocol stacks) where flash headroom is not critical.Choose when application firmware fits within 24 kB and cost optimization is prioritized without sacrificing package or feature compatibility.

Compared with LPC1114FHN33/302:5, the LQFP48 alternative offers expanded I/O and peripheral access at the cost of board area, while the LPC1113FHN33/302 provides identical integration in a lower-cost variant with 8 kB less flash - both retain full software compatibility and power management features.

Availability

LPC1114FHN33/302:5 is available at Aetrix Electronics and suitable for industrial sensor nodes, smart meter interfaces, and building automation controllers requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.

Supply support for LPC1114FHN33/302:5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications.

The LPC111x family targets cost-sensitive, low-power 32-bit embedded control - designed to replace 8/16-bit MCUs with ARM Cortex-M0 efficiency, simplified toolchain, and integrated analog/digital peripherals.

FAQ

What is the maximum operating frequency of the LPC1114FHN33/302:5?

The LPC1114FHN33/302:5 operates at up to 50 MHz using its internal PLL, which can be driven by either the 12 MHz internal RC oscillator (trimmed to ±1%) or an external crystal (1–25 MHz). This frequency is confirmed in Section 1.2 of UM10398 and applies specifically to the LPC1100L series variant denoted by the /302 suffix.

Does the LPC1114FHN33/302:5 support In-Application Programming (IAP)?

Yes, the LPC1114FHN33/302:5 supports page-erase In-Application Programming as part of the LPC1100XL feature set. Although the /302 suffix places it in the LPC1100L series, Table 3 confirms that /302 parts include power profiles and - critically - the IAP command set is enabled for all LPC1114 variants with ≥32 kB flash, including LPC1114FHN33/302:5.

What is the operating temperature range for the LPC1114FHN33/302:5?

The LPC1114FHN33/302:5 has an industrial operating temperature range of –40 °C to +85 °C, indicated by the "F" suffix in the ordering information (Table 3). This rating is validated for continuous operation under specified voltage and load conditions per UM10398 Section 1.3.

How many ADC channels are accessible on the LPC1114FHN33/302:5?

The LPC1114FHN33/302:5 provides eight 10-bit ADC input channels (AD0–AD7), all accessible on the HVQFN33 package as confirmed in Section 1.4 note (4) and Table 3. This matches the full ADC channel count specified for LPC1100L-series HVQFN33 variants.

Is the LPC1114FHN33/302:5 pin-compatible with other LPC1114 variants in HVQFN33?

Yes, all LPC1114 variants in HVQFN33 package - including LPC1114FHN33/201, /202, /203, /301, /302, /303, /333, and /FHI33 derivatives - share identical pinout and mechanical footprint. Differences lie solely in flash size, SRAM allocation, power profile support, and temperature grade - not pin function or assignment.

LPC1114FHN33/302:5 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
32-VQFN Exposed Pad
Series:
LPC1100L
Packaging:
Bulk
Product Status:
Discontinued at Digi-Key
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, WDT
Number of I/O:
28
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
8K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LPC1114FHN33/302:5 FAQ

1.How can I place an order for LPC1114FHN33/302:5 through Aetrix?

Please submit a Request for Quotation (RFQ) for LPC1114FHN33/302:5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LPC1114FHN33/302:5 reliable?

The price and inventory of LPC1114FHN33/302:5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC1114FHN33/302:5 is usually 5 days.

3.What payment methods are accepted for LPC1114FHN33/302:5?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC1114FHN33/302:5 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LPC1114FHN33/302:5?

LPC1114FHN33/302:5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LPC1114FHN33/302:5 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LPC1114FHN33/302:5?

For technical support, including LPC1114FHN33/302:5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC1114FHN33/302:5 requirements.

6.How does Aetrix verify that LPC1114FHN33/302:5 is sourced from the original manufacturer or authorized distributors?

All LPC1114FHN33/302:5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC1114FHN33/302:5 meets industry standards.

7.What is the process for return or replacement of LPC1114FHN33/302:5?

All LPC1114FHN33/302:5 units undergo pre-shipment inspection (PSI). If there is an issue with LPC1114FHN33/302:5, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LPC1114FHN33/302:5 part is unused and in its original packaging.

Return procedure for LPC1114FHN33/302:5:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

LPC1114FHN33/302:5 Tags

  • LPC1114FHN33/302:5
  • LPC1114FHN33/302:5 PDF
  • LPC1114FHN33/302:5 Datasheet
  • LPC1114FHN33/302:5 Specifications
  • LPC1114FHN33/302:5 Images
  • NXP Semiconductors
  • NXP Semiconductors LPC1114FHN33/302:5
  • Buy LPC1114FHN33/302:5
  • LPC1114FHN33/302:5 Price
  • LPC1114FHN33/302:5 Distributor
  • LPC1114FHN33/302:5 Supplier
  • LPC1114FHN33/302:5 Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER