NXP Semiconductors LPC1114FHN33/302K
- Part No.:
- LPC1114FHN33/302K
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-VQFN Exposed Pad
- Datasheet:
-
LPC1114FHN33/302K.pdf
- Description:
- IC MCU 32BIT 32KB FLASH 32HVQFN
- Quantity:
- Payment:

- Shipping:

Inventory:395
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Product details
Overview
LPC1114FHN33/302K from NXP Semiconductors is a 32-bit ARM Cortex-M0 microcontroller in HVQFN33 package, operating up to 50 MHz with 32 kB flash, 8 kB SRAM, one UART with RS-485 support, one Fast-mode Plus I²C-bus interface, two SPI controllers, four timers, and a 10-bit ADC-designed for low-power embedded control in lighting and alarm systems.
For engineers reviewing the LPC1114FHN33/302K datasheet, LPC1114FHN33/302K pinout, LPC1114FHN33/302K application, or LPC1114FHN33/302K equivalent, this page delivers verified specifications, validated pin functions, real-world use cases, and confirmed alternative options aligned with LPC1100L series power profiles and peripheral configuration.
Technical Context
The LPC1114FHN33/302K implements an ARM Cortex-M0 core with NVIC and system tick timer, supporting Serial Wire Debug and non-maskable interrupt routing. Its clock system integrates a 12 MHz ±1 % internal RC oscillator, crystal oscillator (1–25 MHz), programmable watchdog oscillator (9.4 kHz–2.3 MHz), and PLL for CPU operation at full 50 MHz without external high-frequency crystals.
Power management includes Sleep, Deep-sleep, and Deep power-down modes managed by an integrated PMU; the LPC1100L series-specific power profiles reside in boot ROM and are invoked via single-function calls to optimize performance versus current draw. GPIO supports configurable pull-up/pull-down and open-drain mode on all 28 pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M0, 32-bit RISC architecture with Thumb-2 instruction set, enabling compact code size vs. 8/16-bit MCUs. |
| Max Clock Frequency | 50 MHz - achieved via PLL from internal RC or crystal source, eliminating need for external high-frequency oscillators. |
| Flash Memory | 32 kB - sufficient for medium-complexity firmware including bootloader, communication stacks, and application logic. |
| SRAM | 8 kB - supports real-time data buffering, stack depth for nested interrupts, and small heap allocations. |
| I/O Pins | 28 GPIO - all configurable as edge/level-sensitive interrupt sources, with open-drain mode enabled per LPC1100L series specification. |
| Analog Input | 10-bit ADC with 8-channel multiplexing - enables direct sensing of temperature, voltage, or light-level signals without external signal conditioning. |
| Serial Interfaces | 1× UART (RS-485 capable), 1× Fast-mode Plus I²C (1 Mbit/s), 2× SPI with FIFO - supports industrial sensor networks and multi-device bus topologies. |
Pinout & Package
HVQFN33 package: plastic thermal enhanced very thin quad flat package, no leads, 33 terminals, body size 7 × 7 × 0.85 mm, exposed thermal pad for improved heat dissipation in space-constrained PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD (x2) | Power supply | Single 1.8 V–3.6 V supply input; dual pins reduce IR drop and improve noise immunity. |
| VSS (x2) | GND | Dedicated ground connections adjacent to power pins for low-impedance return paths. |
| RESET/PIO0_0 | Reset input / GPIO | Active-low reset with internal pull-up; configurable as general-purpose I/O after initialization. |
| XTALIN / XTALOUT | Crysal oscillator interface | Supports 1–25 MHz crystal; optional bypass for internal RC oscillator only. |
| SWDIO / SWCLK | Debug interface | Two-pin Serial Wire Debug for programming and real-time debugging without JTAG overhead. |
| PIO0_1/CLKOUT | Programmable clock output | Can mirror IRC, system, CPU, or watchdog clock - useful for synchronizing external peripherals. |
| PIO0_4/SCL & PIO0_5/SDA | I²C-bus interface | Fast-mode Plus compliant (1 Mbit/s); supports multiple address recognition and monitor mode. |
| PIO0_6/SCK0 & PIO0_8/MISO0 & PIO0_9/MOSI0 | SPI0 interface | Full-duplex master/slave SPI with hardware FIFO and SSP features for robust peripheral interfacing. |
| PIO1_6/RXD & PIO1_7/TXD | UART interface | RS-485/EIA-485 compatible with fractional baud rate generation and internal FIFO. |
| PIO1_3/AD4 & PIO1_4/AD5 & ... & PIO1_11/AD7 | ADC inputs | Eight 10-bit analog input channels mapped across GPIO pins; supports simultaneous sampling in burst mode. |
Key Features
| Feature | Design Value |
|---|---|
| Power profile selection | Boot ROM-resident power profiles enable runtime trade-off between performance and current draw via single API call - critical for battery-powered alarm systems. |
| Windowed watchdog timer | Prevents runaway code while tolerating valid timing windows - required for safety-critical white goods control loops. |
| Configurable open-drain GPIO | Enables direct wire-OR logic and I²C bus compatibility without external pull-ups on all 28 pins. |
| High-current I/O drivers | 20 mA sink capability on I²C pins allows direct LED driving or relay coil control without buffer transistors. |
| In-Application Programming (IAP) | Enables field firmware updates via UART or I²C without external programmer - essential for remote lighting controller maintenance. |
Applications
| Smart Lighting Control | Home Security Panel |
|---|---|
Use Scenario: Dimmable LED driver with ambient light sensing and wireless command reception. IC Role / Device Role / Timing Role: Main system controller executing PWM dimming algorithms, ADC-based lux measurement, and UART-based Zigbee/Bluetooth co-processor interface. Use Value: 32 kB flash stores lighting profiles and communication stack; 8 kB SRAM buffers sensor data and message queues; 28 GPIO support button inputs, status LEDs, and relay outputs. | Use Scenario: Battery-backed intrusion detection hub monitoring door/window contacts and motion sensors. IC Role / Device Role / Timing Role: Low-power supervisory MCU managing wake-on-interrupt, sensor polling, tamper detection, and GSM module handshaking. Use Value: Deep power-down mode draws <1 μA; windowed WDT ensures fail-safe reset; open-drain GPIO interfaces directly with dry-contact sensors. |
| Energy Meter Interface | Appliance Motor Control |
Use Scenario: Pulse-counting interface between mechanical kWh meter and smart grid communication module. IC Role / Device Role / Timing Role: Isolated pulse capture unit using edge-triggered GPIO interrupts and UART-forwarded telemetry. Use Value: Four 32-bit timers support precise pulse width measurement and time-stamped event logging; 10-bit ADC monitors auxiliary supply voltage. | Use Scenario: Fan speed regulator in HVAC system with thermal feedback and user interface buttons. IC Role / Device Role / Timing Role: Closed-loop motor controller reading thermistor ADC, generating PWM, and scanning keypad matrix. Use Value: 50 MHz CPU handles PID computation in <10 μs; 28 GPIO support 4×4 keypad scan and three-phase gate drive signals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC1114FBD48/302 | LQFP48 package (48 pins), 42 GPIO, identical flash/SRAM/peripherals; larger footprint but more I/O and ADC channels. | Better suited for designs requiring >28 GPIO or additional UART/SPI signals not available in HVQFN33 pinout. | Select when board layout permits larger package and higher I/O count is needed; same firmware compatibility. |
| LPC1114FHN33/301 | Same HVQFN33 package and pinout, but belongs to base LPC1100 series - lacks power profiles and windowed WDT. | Acceptable for cost-sensitive, non-safety-critical applications where dynamic power optimization is unnecessary. | Choose only if deep power-down behavior and certified watchdog functionality are not required. |
Compared with LPC1114FHN33/302K, LPC1114FBD48/302 offers expanded I/O and package compatibility for prototyping, while LPC1114FHN33/301 removes power management features to reduce BOM cost - making the /302K variant optimal for production-grade low-power embedded control requiring certified safety timing.
Availability
LPC1114FHN33/302K is available at Aetrix Electronics and suitable for smart lighting control, home security panels, energy metering interfaces, and appliance motor control requiring stable component supply across industrial temperature range (−40 °C to +85 °C).
Supply support for LPC1114FHN33/302K includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The LPC1100L series - including LPC1114FHN33/302K - was designed specifically for cost-sensitive, ultra-low-power 32-bit embedded applications replacing legacy 8/16-bit microcontrollers in lighting, security, and white goods.
FAQ
What is the maximum operating frequency of the LPC1114FHN33/302K?
The LPC1114FHN33/302K operates at a maximum CPU frequency of 50 MHz. This is achieved using the on-chip PLL, which can be clocked from either the internal 12 MHz ±1 % RC oscillator or an external crystal (1–25 MHz). The PLL eliminates dependency on high-frequency external crystals, simplifying design and reducing BOM cost while maintaining deterministic real-time performance for the LPC1114FHN33/302K.
Does the LPC1114FHN33/302K support in-system programming (ISP)?
Yes, the LPC1114FHN33/302K supports In-System Programming (ISP) via its built-in bootloader, accessible through UART or I²C interfaces. It also supports In-Application Programming (IAP), allowing firmware updates during normal operation without halting the application - a key requirement for remote maintenance in lighting and security systems using the LPC1114FHN33/302K.
What are the key differences between LPC1114FHN33/302K and LPC1114FHN33/202?
The LPC1114FHN33/302K includes 8 kB SRAM and LPC1100L-series power profiles, while LPC1114FHN33/202 has only 4 kB SRAM and lacks power profile support. Both share the same 32 kB flash and HVQFN33 package, but the /302K variant enables deeper power optimization and larger runtime data structures - making it preferable for complex sensor fusion or communication stack implementations on the LPC1114FHN33/302K.
Which debug interface does the LPC1114FHN33/302K use?
The LPC1114FHN33/302K uses Serial Wire Debug (SWD) with two dedicated pins: SWDIO and SWCLK. This two-wire interface provides full programming, breakpoint, and real-time variable inspection capabilities while minimizing PCB routing complexity compared to JTAG. SWD is natively supported by Keil MDK, IAR Embedded Workbench, and open-source tools like OpenOCD for the LPC1114FHN33/302K.
Is the LPC1114FHN33/302K qualified for industrial temperature operation?
Yes, the LPC1114FHN33/302K is rated for operation from −40 °C to +85 °C (industrial temperature grade, denoted by suffix 'F' in ordering code). This qualification ensures reliable performance in demanding environments such as outdoor lighting fixtures, HVAC control units, and security panel enclosures where ambient temperatures exceed commercial-grade limits - confirming suitability for long-term deployment of the LPC1114FHN33/302K.
LPC1114FHN33/302K Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-VQFN Exposed Pad
- Series:
- LPC1100L
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- I2C, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, WDT
- Number of I/O:
- 28
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- A/D 8x10b SAR
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC1114FHN33/302K FAQ
1.How can I place an order for LPC1114FHN33/302K through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC1114FHN33/302K on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC1114FHN33/302K reliable?
The price and inventory of LPC1114FHN33/302K are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC1114FHN33/302K is usually 5 days.
3.What payment methods are accepted for LPC1114FHN33/302K?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC1114FHN33/302K transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LPC1114FHN33/302K?
LPC1114FHN33/302K orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC1114FHN33/302K order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC1114FHN33/302K?
For technical support, including LPC1114FHN33/302K datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC1114FHN33/302K requirements.
6.How does Aetrix verify that LPC1114FHN33/302K is sourced from the original manufacturer or authorized distributors?
All LPC1114FHN33/302K products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC1114FHN33/302K meets industry standards.
7.What is the process for return or replacement of LPC1114FHN33/302K?
All LPC1114FHN33/302K units undergo pre-shipment inspection (PSI). If there is an issue with LPC1114FHN33/302K, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC1114FHN33/302K part is unused and in its original packaging.
Return procedure for LPC1114FHN33/302K:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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