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NXP Semiconductors LPC11A13FHI33/201,

Part No.:
LPC11A13FHI33/201,
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
32-VFQFN Exposed Pad
Datasheet:
AetrixLPC11A13FHI33/201,.pdf
Description:
IC MCU 32BIT 24KB FLASH 32HVQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:425

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Product details

Overview

LPC11A13FHI33/201 from NXP Semiconductors is a 32-bit ARM Cortex-M0 microcontroller in a 5 × 5 mm HVQFN33 package, operating up to 50 MHz with 24 kB flash, 6 kB SRAM, and 2 kB EEPROM. It integrates a 10-bit ADC (8 channels), 10-bit DAC, analog comparator, temperature sensor, and UART/SSP/I²C interfaces - deployed in industrial control, remote monitoring, and precision instrumentation.

For engineers reviewing the LPC11A13FHI33/201 datasheet, LPC11A13FHI33/201 pinout, LPC11A13FHI33/201 application, or LPC11A13FHI33/201 equivalent, key selection criteria include its 28 GPIO count, 5 × 5 mm thermal-enhanced HVQFN33 footprint, 2.6–3.6 V single-supply operation, −40 °C to +85 °C industrial temperature range, and integrated analog/mixed-signal subsystems requiring no external signal conditioning.

Technical Context

The LPC11A13FHI33/201 implements an ARM Cortex-M0 core with NVIC and Serial Wire Debug (SWD), paired with a configurable clock system including 12 MHz ±1% IRC, crystal oscillator (1–25 MHz), and PLL for full-speed CPU operation. Its memory subsystem includes 24 kB flash with ISP/IAP, 6 kB SRAM, and 2 kB byte-erasable EEPROM backed by 16 kB boot ROM containing integer division and I²C driver routines.

Analog functionality centers on an 8-channel 10-bit ADC with programmable triggers, a 10-bit DAC with flexible conversion timing, and a highly configurable analog comparator with internal reference and VDDCMP input support. Digital peripherals include two SSP controllers (up to 25 Mbit/s), Fast-mode Plus I²C (1 Mbit/s), RS-485-capable USART, four general-purpose timers (16/32-bit), and a windowed watchdog timer with dedicated low-power oscillator.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core ARM Cortex-M0, 32-bit RISC, up to 50 MHz - enables deterministic real-time control with Thumb-2 instruction set and low code footprint vs. 8/16-bit alternatives.
Memory 24 kB flash (ISP/IAP), 6 kB SRAM, 2 kB EEPROM - supports field firmware updates, data logging without external storage, and retention-critical configuration storage.
Analog Peripherals 10-bit ADC (8 inputs), 10-bit DAC, analog comparator with programmable reference - eliminates need for external ADC/DAC in sensor interface and closed-loop control applications.
Digital Interfaces USART (RS-485 mode), two SSP (SPI/SSI), Fast-mode Plus I²C (1 Mbit/s) - enables robust industrial bus communication and multi-device peripheral expansion.
GPIO & Timers 28 GPIO with 50 ns glitch filtering, 4 timers (16/32-bit) with 16 capture/14 match outputs - supports precise edge-triggered event capture and multi-channel PWM generation.
Power & Environment Single 2.6–3.6 V supply, −40 °C to +85 °C, HVQFN33 (5 × 5 × 0.85 mm) - suitable for space-constrained industrial and embedded systems with wide ambient operating range.

Pinout & Package

HVQFN33 (5 × 5 × 0.85 mm) package with 33 terminals, thermal pad exposed on underside for enhanced power dissipation in compact industrial modules.

Pin/Terminal Circuit Role Design Meaning
RESET/PIO0_0 Reset input / GPIO Active-low reset with fixed 20 ns glitch filter; also serves as general-purpose I/O with internal pull-up enabled at reset.
TCK/SWCLK/PIO0_5 JTAG/SWD clock Primary Serial Wire Debug clock input (10 ns glitch filter); multiplexed with GPIO and SSP0 SCK function.
SWDIO/PIO0_10 SWD bidirectional data Primary SWD I/O (10 ns glitch filter); default debug interface for programming and real-time debugging without JTAG pins.
AD0–AD7 ADC inputs Eight analog input channels mapped to PIO0_6 through PIO0_15 - supports simultaneous sampling of multiple sensors with shared reference.
AOUT DAC output Analog output on PIO0_4 - provides calibrated voltage reference or control signal for analog actuators without external DAC.
VDD(3V3), VDD(IO), VSS, VSS(IO) Power & ground Dual power domains (core I/O and analog) with separate ground returns - reduces noise coupling between digital switching and analog measurement paths.

Key Features

Feature Design Value
ARM Cortex-M0 + NVIC Hardware interrupt prioritization and low-latency vector handling enable deterministic response to 28+ interrupt sources including GPIO edges and timer matches.
2 kB byte-erasable EEPROM Persistent storage for calibration data, device IDs, or runtime parameters without wear-leveling overhead or external memory ICs.
Integrated temperature sensor On-die thermal monitoring with factory-trimmed accuracy - used for thermal throttling or environmental compensation in sensor nodes.
Programmable 50 ns GPIO glitch filter Hardware debouncing for mechanical switches or noisy industrial signals on PIO0_2/PIO0_3 - eliminates software polling or external RC filters.
Fast-mode Plus I²C (1 Mbit/s) High-speed bidirectional communication with multi-address recognition and monitor mode - supports hot-plug detection and bus arbitration in multi-master systems.

Applications

Industrial Control Remote Monitoring

Use Scenario: PLC I/O module collecting analog sensor data and driving relay outputs in factory automation.

IC Role / Device Role / Timing Role: Central controller executing real-time logic, sampling 8-channel 10-bit ADC, generating PWM via timer match outputs, and communicating over RS-485 USART.

Use Value: Integrated ADC/DAC and 28 GPIO eliminate external signal conditioning ICs; 24 kB flash stores ladder logic firmware with field-upgrade capability via ISP.

Use Scenario: Battery-powered environmental sensor node measuring temperature, humidity, and air quality in distributed infrastructure.

IC Role / Device Role / Timing Role: Low-power system controller using sleep mode between 10-second ADC reads, transmitting data via I²C to LoRa transceiver, and logging to EEPROM.

Use Value: Single 3.3 V supply and −40 °C to +85 °C rating ensure outdoor reliability; integrated temperature sensor enables self-calibration without external components.

Medical Instrumentation HVAC & Building Control

Use Scenario: Portable blood glucose meter requiring precise analog front-end and secure firmware storage.

IC Role / Device Role / Timing Role: Analog subsystem manager acquiring sensor signals via 10-bit ADC, applying calibration via EEPROM-stored coefficients, and driving LCD via GPIO.

Use Value: On-chip 10-bit DAC generates precise reference voltages; unique serial number enables device authentication and traceability per unit.

Use Scenario: Smart thermostat managing HVAC actuation based on local sensor fusion and cloud commands.

IC Role / Device Role / Timing Role: System-on-chip handling temperature/humidity ADC reads, controlling valve drivers via GPIO, and interfacing with Wi-Fi module via SSP.

Use Value: 2 kB EEPROM retains user preferences and calibration across power cycles; Fast-mode Plus I²C supports concurrent communication with multiple sensor ICs on same bus.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
LPC11A14FHN33/301 32 kB flash, 8 kB SRAM, 4 kB EEPROM, same HVQFN33 (7 × 7 mm) package - higher memory capacity but larger footprint. Preferred for complex firmware with bootloader, OTA updates, or large lookup tables; not drop-in due to different thermal pad size and pin pitch. Select when firmware growth exceeds 24 kB or EEPROM logging volume requires >2 kB; verify PCB land pattern compatibility.
LPC11U14FHN33/101 Cortex-M0+ core, USB 2.0 device controller, 32 kB flash, 8 kB SRAM - adds native USB connectivity but removes DAC and reduces ADC channels to 6. Suitable for PC-connected devices (e.g., USB HID peripherals) where analog precision is secondary to host interface; lacks DAC needed for analog control loops. Choose only if USB device functionality is mandatory and DAC/analog comparator are unused; not a functional replacement for mixed-signal tasks.

Compared with LPC11A14FHN33/301 and LPC11U14FHN33/101, the LPC11A13FHI33/201 delivers optimal balance of analog integration (ADC+DAC+comparator), compact 5 × 5 mm HVQFN33 packaging, and sufficient memory for sensor-edge firmware - making it the most cost-effective choice for space-constrained industrial and instrumentation designs requiring full mixed-signal capability.

Availability

LPC11A13FHI33/201 is available at Aetrix Electronics and suitable for industrial control, remote monitoring, and medical instrumentation requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.

Supply support for LPC11A13FHI33/201 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based microcontrollers and mixed-signal integration.

The LPC11Axx product line targets cost-sensitive, space-constrained embedded systems needing high analog integration and low-power operation - designed specifically for industrial sensing, control, and instrumentation where precision, reliability, and small form factor are critical.

FAQ

What is the maximum operating frequency of the LPC11A13FHI33/201?

The LPC11A13FHI33/201 operates at a maximum CPU frequency of 50 MHz, achievable using the internal 12 MHz ±1% IRC oscillator with PLL multiplication, an external crystal (1–25 MHz), or an external clock source. This frequency is fully supported across the specified −40 °C to +85 °C temperature range and 2.6–3.6 V supply voltage.

Does the LPC11A13FHI33/201 include a hardware DAC?

Yes, the LPC11A13FHI33/201 includes a 10-bit DAC with flexible conversion triggering, outputting on PIO0_4 (AOUT). The DAC supports both software- and hardware-triggered conversions (e.g., via timer match or ADC end-of-conversion), enabling precise analog waveform generation or control voltage synthesis without external components.

What package type and dimensions does the LPC11A13FHI33/201 use?

The LPC11A13FHI33/201 uses the HVQFN33 package with body dimensions of 5 mm × 5 mm × 0.85 mm and a thermal pad on the underside. This differs from the 7 × 7 mm variant used by other LPC11Axx parts - confirming exact mechanical compatibility requires verification against the NXP SOT1118-2 footprint drawing.

How many GPIO pins are available on the LPC11A13FHI33/201?

The LPC11A13FHI33/201 provides 28 GPIO pins, all mapped to Port 0 and Port 1. These support configurable pull-up/pull-down resistors, repeater mode, open-drain operation (on PIO0_2/PIO0_3), and programmable 10 ns or 50 ns input glitch filtering - enabling direct interface with noisy industrial sensors and switches.

Is the LPC11A13FHI33/201 supported by NXP's official development tools?

Yes, the LPC11A13FHI33/201 is fully supported by NXP's LPCXpresso IDE, MCUXpresso SDK, and LPC-Link2 debug probe. Its ARM Cortex-M0 core and Serial Wire Debug interface ensure compatibility with standard ARM toolchains, while the 16 kB boot ROM includes validated I²C driver and integer division routines for rapid firmware development.

LPC11A13FHI33/201, Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
32-VFQFN Exposed Pad
Series:
LPC11Axx
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, WDT
Number of I/O:
28
Program Memory Size:
24KB (24K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
6K x 8
Voltage - Supply (Vcc/Vdd):
2.6V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LPC11A13FHI33/201, FAQ

1.How can I place an order for LPC11A13FHI33/201, through Aetrix?

Please submit a Request for Quotation (RFQ) for LPC11A13FHI33/201, on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LPC11A13FHI33/201, reliable?

The price and inventory of LPC11A13FHI33/201, are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC11A13FHI33/201, is usually 5 days.

3.What payment methods are accepted for LPC11A13FHI33/201,?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC11A13FHI33/201, transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LPC11A13FHI33/201,?

LPC11A13FHI33/201, orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LPC11A13FHI33/201, order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LPC11A13FHI33/201,?

For technical support, including LPC11A13FHI33/201, datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC11A13FHI33/201, requirements.

6.How does Aetrix verify that LPC11A13FHI33/201, is sourced from the original manufacturer or authorized distributors?

All LPC11A13FHI33/201, products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC11A13FHI33/201, meets industry standards.

7.What is the process for return or replacement of LPC11A13FHI33/201,?

All LPC11A13FHI33/201, units undergo pre-shipment inspection (PSI). If there is an issue with LPC11A13FHI33/201,, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LPC11A13FHI33/201, part is unused and in its original packaging.

Return procedure for LPC11A13FHI33/201,:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

LPC11A13FHI33/201, Tags

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  • LPC11A13FHI33/201, Images
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  • NXP Semiconductors LPC11A13FHI33/201,
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