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NXP Semiconductors LPC11E14FHN33/401,

Part No.:
LPC11E14FHN33/401,
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
32-VQFN Exposed Pad
Datasheet:
AetrixLPC11E14FHN33/401,.pdf
Description:
IC MCU 32BIT 32KB FLASH 32HVQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:210

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Product details

Overview

LPC11E14FHN33/401 from NXP Semiconductors is a 32-bit ARM Cortex-M0 microcontroller in HVQFN33 package, operating up to 50 MHz with 32 kB flash, 10 kB SRAM, and 4 kB byte-erasable EEPROM. It integrates a 10-bit ADC (8-channel), dual SSP interfaces, Fast-mode Plus I²C, RS-485-capable USART with smart card support, four timers, and 28 GPIO pins - deployed in handheld scanners and industrial control systems requiring compact, low-power embedded processing.

For engineers reviewing the LPC11E14FHN33/401 datasheet, LPC11E14FHN33/401 pinout, LPC11E14FHN33/401 application, or LPC11E14FHN33/401 equivalent, key selection criteria include its HVQFN33 thermal-enhanced package, 28 GPIO count, 4 kB EEPROM endurance, 3.3 V single-supply operation, and support for Deep power-down wake-up via dedicated WAKEUP pin.

Technical Context

The LPC11E14FHN33/401 implements an ARM Cortex-M0 core with NVIC supporting 24 vectored interrupts and non-maskable interrupt (NMI) routing from multiple sources. Its memory subsystem includes 16 kB boot ROM with integer division routines and power profile APIs, enabling rapid low-power configuration.

Clock generation combines a 1–25 MHz crystal oscillator, 12 MHz internal RC oscillator, programmable watchdog oscillator, and PLL for CPU scaling to 50 MHz. Power management includes four reduced-power modes (Sleep, Deep-sleep, Power-down, Deep power-down), with wake-up capability from Deep power-down via a single dedicated pin with 20 ns glitch filter.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreARM Cortex-M0, 32-bit RISC architecture optimized for deterministic real-time response and code density vs. 8/16-bit MCUs.
Max Clock Frequency50 MHz - enables high-throughput peripheral handling while maintaining sub-100 µA/MHz active power efficiency.
Flash Memory32 kB - sufficient for complex firmware with bootloader, communication stacks, and application logic in space-constrained designs.
EEPROM4 kB byte-erasable/programmable - retains calibration data, device IDs, or user settings across 100k+ write cycles without external NV memory.
ADC Resolution10-bit with 8 input channels - supports precision sensor interfacing (e.g., temperature, pressure) with configurable sampling rates up to 400 kS/s.
I²C InterfaceFast-mode Plus (1 Mbit/s) - delivers twice the speed of standard Fast-mode, reducing bus arbitration time in multi-sensor systems.
GPIO Count28 pins - matches HVQFN33 package terminal count; all support configurable pull-up/down, repeater mode, and open-drain output.
Supply Voltage1.8 V to 3.6 V - allows direct integration with 3.3 V logic and battery-powered operation down to 1.8 V cutoff.

Pinout & Package

Package: HVQFN33 (plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 × 7 × 0.85 mm).

Pin/TerminalCircuit RoleDesign Meaning
RESET/PIO0_0Reset input / GPIO port 0 pin 0External reset with 20 ns glitch filter; also debug select input (LOW = JTAG, HIGH = SWD); 5 V tolerant.
SWDIO/PIO0_15/AD4/CT32B1_MAT2SWD debug I/O / ADC input 4 / timer match outputSingle-pin debug interface supporting programming and real-time trace; shares analog input and timer function - requires careful multiplexing in firmware.
PIO0_16/AD5/CT32B1_MAT3/WAKEUPADC input 5 / timer match output / deep power-down wakeDedicated wake-up pin for Deep power-down mode; must be pulled LOW externally to exit; also serves as ADC channel and timer output.
XTALIN / XTALOUTCrytal oscillator input/outputSupports 1–25 MHz crystal; XTALIN accepts ≤1.8 V input; unused pins must be grounded (XTALIN) or left floating (XTALOUT) to minimize noise susceptibility.
PIO0_4/SCL & PIO0_5/SDAI²C-bus clock/dataOpen-drain pins compliant with I²C Fast-mode Plus (1 Mbit/s); high-current sink enabled only when Fast-mode Plus is configured in IOCON register.
VDD / VSSPower supply / groundVDD supplies internal regulator, ADC reference, and external rail; VSS is system ground - both required for stable 3.3 V operation and ADC accuracy.

Key Features

FeatureDesign Value
In-Application Programming (IAP)Enables field firmware updates and EEPROM writes without halting CPU execution - critical for remote industrial devices requiring zero-downtime maintenance.
Windowed Watchdog Timer (WWDT)Prevents runaway code with time-windowed refresh requirement; uses dedicated low-power watchdog oscillator to maintain timing integrity during Sleep/Deep-sleep modes.
Smart Card Interface (ISO 7816-3)Direct USART support for asynchronous smart card protocols eliminates need for external level-shifting or protocol translation ICs in secure access systems.
High-Current GPIO Drivers20 mA source on one pin and 20 mA sink on true open-drain pins enable direct LED driving or relay control without external buffers in compact designs.
Power Profiles in Boot ROMPre-validated configurations for Sleep/Deep-sleep/Power-down modes callable via single API - reduces firmware development time and ensures optimal current consumption per use case.
GPIO Group InterruptsTwo programmable modules generate interrupts based on logical patterns across GPIO groups - simplifies event-driven sensing (e.g., keypad scan, status monitoring) without polling overhead.

Applications

Handheld ScannersIndustrial Control Panels

Use Scenario: Battery-powered barcode scanner with real-time decode, display, and Bluetooth LE connectivity.

IC Role / Device Role / Timing Role: Main application MCU managing image capture, decoding algorithm, USB/UART bridge, and low-power sleep/wake scheduling.

Use Value: 4 kB EEPROM stores calibration offsets and device-specific parameters; 28 GPIO support button matrix, buzzer, and status LEDs; Deep power-down mode extends battery life beyond 6 months.

Use Scenario: DIN-rail mounted HMI panel controlling PLC I/O, displaying process data, and logging events over RS-485.

IC Role / Device Role / Timing Role: Local controller interfacing with sensors, relays, and serial fieldbus; handles protocol translation and local decision logic.

Use Value: RS-485 USART with hardware flow control ensures robust noise immunity in electrically noisy factory environments; 10-bit ADC reads analog sensor inputs directly; 32 kB flash accommodates Modbus RTU stack and UI firmware.

Medical Diagnostic ToolsConsumer Peripherals

Use Scenario: Portable blood glucose meter with LCD, button interface, USB charging, and data export via UART.

IC Role / Device Role / Timing Role: System-on-chip managing analog front-end (ADC), user interface, power sequencing, and USB CDC communication.

Use Value: Single 3.3 V supply simplifies power design; 10-bit ADC achieves ±1 LSB INL for clinical-grade measurement accuracy; WAKEUP pin enables instant-on response from ultra-low-power standby.

Use Scenario: Smart home remote with IR emitter, capacitive touch buttons, and BLE connectivity.

IC Role / Device Role / Timing Role: Low-cost, low-power host MCU coordinating sensor input, IR signal generation, and wireless transmission.

Use Value: 28 GPIO support multi-function buttons and IR driver; Fast-mode Plus I²C interfaces with environmental sensors at 1 Mbit/s; 50 MHz CPU handles real-time IR modulation without dedicated hardware timers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
LPC11U14FHN33/401Same package and pinout; replaces EEPROM with 8 kB USB RAM; adds USB 2.0 device controller.Requires USB host connectivity; lacks non-volatile data retention without external EEPROM.Select when USB device functionality is mandatory and EEPROM is not required for persistent storage.
LPC812M101JDH20ARM Cortex-M0+, 30 MHz, 16 kB flash, 4 kB SRAM, no EEPROM; HVQFN20 package (20 pins, fewer GPIO).Lower cost and smaller footprint but limited memory and peripheral set; no built-in EEPROM or RS-485 USART.Select for simpler, lower-BOM-cost applications where EEPROM and RS-485 are unnecessary and GPIO count < 20 suffices.

Compared with LPC11U14FHN33/401, the LPC11E14FHN33/401 prioritizes data persistence over USB connectivity; versus LPC812M101JDH20, it delivers higher memory capacity, EEPROM, and RS-485 support at the cost of larger package and higher unit price - making it optimal for feature-rich, field-deployed embedded controllers.

Availability

LPC11E14FHN33/401 is available at Aetrix Electronics and suitable for handheld scanners, industrial control panels, and medical diagnostic tools requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for LPC11E14FHN33/401 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.

The LPC11E1x product line targets cost-sensitive, low-power embedded systems needing rich analog/digital peripherals and EEPROM in compact packages - designed specifically for 8/16-bit MCU replacement in consumer, medical, and industrial edge devices.

FAQ

What is the maximum operating frequency of the LPC11E14FHN33/401?

The LPC11E14FHN33/401 operates at a maximum CPU frequency of 50 MHz, achievable using either the internal 12 MHz IRC oscillator with PLL multiplication or an external 1–25 MHz crystal oscillator. This frequency is fully supported across the specified industrial temperature range (−40 °C to +85 °C) and 1.8–3.6 V supply voltage.

Does the LPC11E14FHN33/401 include EEPROM, and what are its write characteristics?

Yes, the LPC11E14FHN33/401 integrates 4 kB of on-chip EEPROM that is byte-erasable and byte-programmable. It supports In-Application Programming (IAP) via the boot ROM API, enabling firmware-controlled writes during runtime. Endurance is rated for ≥100,000 write/erase cycles, with data retention guaranteed for 10 years at 85 °C.

How many GPIO pins does the LPC11E14FHN33/401 provide, and what advanced features do they support?

The LPC11E14FHN33/401 provides 28 general-purpose I/O pins in its HVQFN33 package. Each pin supports configurable pull-up/pull-down resistors, repeater mode, and open-drain output. Eight pins can serve as edge- or level-sensitive interrupt sources, and two GPIO group interrupt modules allow pattern-matching logic across pin groups - enabling efficient keypad scanning or status monitoring without CPU polling.

Can the LPC11E14FHN33/401 enter Deep power-down mode, and how is wake-up implemented?

Yes, the LPC11E14FHN33/401 supports Deep power-down mode with typical current draw below 1 µA. Wake-up is implemented exclusively via the dedicated WAKEUP pin (PIO0_16), which features a 20 ns glitch filter. An external LOW-going pulse ≥50 ns triggers wake-up and full system restart; the pin must be pulled HIGH externally to enter Deep power-down mode.

What communication interfaces are integrated into the LPC11E14FHN33/401?

The LPC11E14FHN33/401 integrates a Fast-mode Plus I²C-bus interface (1 Mbit/s), one RS-485/EIA-485 USART with synchronous mode and ISO 7816-3 smart card support, and two SSP controllers with FIFO and multi-protocol capability. These interfaces operate independently and can be simultaneously active, supporting complex peripheral ecosystems in space-constrained designs.

LPC11E14FHN33/401, Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
32-VQFN Exposed Pad
Series:
LPC11Exx
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, WDT
Number of I/O:
28
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
10K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

LPC11E14FHN33/401, FAQ

1.How can I place an order for LPC11E14FHN33/401, through Aetrix?

Please submit a Request for Quotation (RFQ) for LPC11E14FHN33/401, on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LPC11E14FHN33/401, reliable?

The price and inventory of LPC11E14FHN33/401, are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC11E14FHN33/401, is usually 5 days.

3.What payment methods are accepted for LPC11E14FHN33/401,?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC11E14FHN33/401, transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LPC11E14FHN33/401,?

LPC11E14FHN33/401, orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LPC11E14FHN33/401, order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LPC11E14FHN33/401,?

For technical support, including LPC11E14FHN33/401, datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC11E14FHN33/401, requirements.

6.How does Aetrix verify that LPC11E14FHN33/401, is sourced from the original manufacturer or authorized distributors?

All LPC11E14FHN33/401, products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC11E14FHN33/401, meets industry standards.

7.What is the process for return or replacement of LPC11E14FHN33/401,?

All LPC11E14FHN33/401, units undergo pre-shipment inspection (PSI). If there is an issue with LPC11E14FHN33/401,, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LPC11E14FHN33/401, part is unused and in its original packaging.

Return procedure for LPC11E14FHN33/401,:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

LPC11E14FHN33/401, Tags

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