NXP Semiconductors LPC1313FHN33/01,51

Overview

LPC1313FHN33/01 from NXP Semiconductors is a 32-bit ARM Cortex-M3 microcontroller in a 33-pin HVQFN package, delivering up to 72 MHz CPU operation, 32 kB flash, 8 kB SRAM, and integrated power management for low-power embedded control. It supports I²C Fast-mode Plus (1 Mbit/s), UART with RS-485 support, four general-purpose timers, 10-bit ADC (8 channels), and Windowed Watchdog Timer (WWDT) - deployed in smart lighting and white goods motor control.

For engineers reviewing the LPC1313FHN33/01 datasheet, LPC1313FHN33/01 pinout, LPC1313FHN33/01 application, or LPC1313FHN33/01 equivalent, key selection criteria include its HVQFN33 thermal-enhanced package, WWDT and BOD with four forced-reset thresholds, programmable pseudo open-drain GPIO, and boot-time power profile selection for active/sleep optimization - all without USB or second SSP controller.

Technical Context

The LPC1313FHN33/01 implements the ARM Cortex-M3 core with Harvard architecture, 3-stage pipeline, and internal prefetch unit enabling speculative branching. Its memory subsystem includes 32 kB on-chip flash (with ISP/IAP support) and 8 kB SRAM, backed by ROM-resident power profiles for runtime performance/power trade-off tuning.

Peripherals are connected via AHB-Lite and APB buses: one UART with fractional baud rate generation and RS-485 support, one I²C-bus interface compliant with Fast-mode Plus (1 Mbit/s), one SSP controller, four 32/16-bit timers (13 match outputs, 4 capture inputs), and an 8-channel 10-bit ADC. The device lacks USB and second SSP - distinguishing it from LPC1342/43 and LPC1313FBD48/01 variants.

Key Specifications

Pinout & Package

HVQFN33 package: plastic thermal enhanced very thin quad flat package, no leads, 33 terminals, body size 7 × 7 × 0.85 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with LPC1343FHN33, the LPC1313FHN33/01 trades USB for enhanced reliability via WWDT and granular BOD; versus LPC1313FBD48/01, it offers identical core functionality in a smaller HVQFN33 package at the cost of two SSP channels and extended UART signaling.

Availability

LPC1313FHN33/01 is available at Aetrix Electronics and suitable for smart lighting control, white goods motor interface, and home alarm system applications requiring stable component supply, long-term lifecycle assurance, and consistent parametric performance across production batches.

Supply support for LPC1313FHN33/01 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The LPC1300L series - including the LPC1313FHN33/01 - was designed specifically for ultra-low-power embedded control in cost-sensitive consumer and industrial appliances, emphasizing runtime power optimization without sacrificing real-time responsiveness.

FAQ

What is the maximum operating frequency of the LPC1313FHN33/01?

The LPC1313FHN33/01 operates at a maximum CPU frequency of 72 MHz, achieved via its ARM Cortex-M3 core with internal PLL driven by the system oscillator or 12 MHz internal RC oscillator. This frequency is fully supported across the specified 2.0 V to 3.6 V supply range and industrial temperature grade, enabling deterministic real-time execution for lighting and appliance control tasks within the LPC1313FHN33/01's thermal envelope.

Does the LPC1313FHN33/01 include USB functionality?

No, the LPC1313FHN33/01 does not include USB functionality. Unlike the LPC1342/43 variants, this part omits the USB 2.0 full-speed device controller and associated PHY. Its pinout contains no USB_DP or USB_DM signals, and the datasheet explicitly lists USB as "–" for all LPC1311/13 variants. The LPC1313FHN33/01 relies on UART, I²C, and SSP for host and peripheral communication - confirmed in Table 2 of the official NXP datasheet.

What distinguishes the /01 suffix in LPC1313FHN33/01?

The /01 suffix denotes the LPC1300L series variant, which adds critical reliability features absent in the base LPC1313FHN33: Windowed Watchdog Timer (WWDT), four-level Brownout Detect (BOD) forced reset, programmable pseudo open-drain GPIO, and boot-time power profile selection. These enhancements are documented in the "Remark" section of the NXP datasheet and validated in Table 2's "Power profiles" column - making the LPC1313FHN33/01 the preferred choice for safety-aware applications like alarm systems and metering.

How many ADC channels does the LPC1313FHN33/01 support?

The LPC1313FHN33/01 supports eight 10-bit ADC input channels (AD0–AD7), mapped to dedicated pins PIO0_11, PIO1_0–PIO1_2, SWDIO/PIO1_3, PIO1_4–PIO1_5, and PIO1_10–PIO1_11. All channels share a common reference (VDD) and are accessible via the on-chip ADC peripheral with configurable sample rate and burst mode - verified in both the "Features and benefits" section and Table 2 of the NXP datasheet.

What package type is used for the LPC1313FHN33/01?

The LPC1313FHN33/01 uses the HVQFN33 package: a 33-terminal, leadless, thermally enhanced very thin quad flat package measuring 7 × 7 × 0.85 mm. This package is explicitly listed in Table 1 ("Ordering information") and Figure 5 ("LPC1311/13 HVQFN33 package") of the NXP datasheet, and its pinout is fully detailed in Table 4 - confirming mechanical compatibility and thermal performance for compact, high-density PCB layouts.