My Inquiry
My Account
NXP Semiconductors LPC1316FHN33,551
- Part No.:
- LPC1316FHN33,551
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-VQFN Exposed Pad
- Datasheet:
-
LPC1316FHN33,551.pdf
- Description:
- IC MCU 32BIT 48KB FLASH 32HVQFN
- Quantity:
- Payment:
- Shipping:
Inventory:260
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LPC1316FHN33,551 from NXP Semiconductors is a 32-bit ARM Cortex-M3 microcontroller in HVQFN33 package, operating at up to 72 MHz with 48 kB flash, 8 kB SRAM, and no USB interface. It integrates an 8-channel 12-bit ADC (500 kSamples/s), two SSP interfaces, one Fast-mode Plus I²C-bus (1 Mbit/s), one RS-485/UART with smart card support, four general-purpose timers, and 28 GPIO pins - deployed in industrial control systems requiring deterministic real-time response and low-power operation.
For engineers reviewing the LPC1316FHN33,551 datasheet, LPC1316FHN33,551 pinout, LPC1316FHN33,551 application, or LPC1316FHN33,551 equivalent, this page delivers verified technical context, validated pin functions for HVQFN33, confirmed peripheral timing constraints, and direct alternative options with documented functional and packaging differences - all aligned to Rev. 3 (20 September 2012) product data sheet.
Technical Context
The LPC1316FHN33,551 implements ARM Cortex-M3 r2p1 core with Harvard architecture, 3-stage pipeline, and integrated NVIC for deterministic interrupt handling. Its clock system combines a 1–25 MHz crystal oscillator, 12 MHz ±1% IRC, and dual PLLs - one for CPU (PLL0) and one reserved for USB (not used in LPC1316).
Peripheral interconnect uses AHB-Lite to APB bridge; memory subsystem includes 48 kB flash (256-byte page erase), 8 kB SRAM, and no on-chip EEPROM. The device supports four reduced power modes (Sleep, Deep-sleep, Power-down, Deep power-down) with wake-up via GPIO, watchdog, or reset - enabled by integrated PMU and programmable brownout detection with four thresholds.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3 r2p1, 72 MHz max - enables hard real-time execution with <10 µs interrupt latency. |
| Flash / SRAM | 48 kB flash (256-byte page erase), 8 kB SRAM - sufficient for compact firmware with RTOS or protocol stacks. |
| ADC | 12-bit, 8-channel, 500 kSamples/s - supports high-fidelity sensor acquisition in industrial monitoring. |
| I²C Interface | Fast-mode Plus compliant, 1 Mbit/s - interoperates with legacy and high-speed I²C peripherals without level shifters. |
| Timers | Four general-purpose timers (two 16-bit, two 32-bit) with 13 match outputs and 8 capture inputs - enables PWM generation, input capture, and quadrature decoding. |
| GPIO | 28 configurable pins with glitch filter, pseudo open-drain, and 20 mA sink/source on select pins - drives LEDs, relays, and digital sensors directly. |
| Package | HVQFN33 (7 × 7 × 0.85 mm) - thermally enhanced, fine-pitch package suitable for space-constrained industrial PCBs. |
Pinout & Package
HVQFN33 package: plastic thermal enhanced very thin quad flat package, no leads, 33 terminals, body size 7 mm × 7 mm × 0.85 mm. Exposed thermal pad (EP) on underside for improved heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (VSS) | Ground | Primary digital ground reference; must be low-impedance connection to PCB ground plane. |
| 2 (PIO0_0/RESET) | Reset Input / GPIO | Active-low reset with 20 ns glitch filter; also serves as debug select (LOW = JTAG, HIGH = SWD). |
| 3 (PIO0_1/CLKOUT) | Clock Output / GPIO | Configurable clock output (crystal, IRC, or main clock); used for external timing verification or clocking peripherals. |
| 8 (PIO0_2/SSEL0) | SSP0 Slave Select / GPIO | Active-low chip select for SPI slave mode on SSP0; supports daisy-chain or multi-device configurations. |
| 10 (PIO0_4/SCL) | I²C Clock / GPIO | Open-drain I²C clock line; high-current sink only when Fast-mode Plus enabled in IOCON register. |
| 11 (PIO0_5/SDA) | I²C Data / GPIO | Open-drain I²C data line; supports multi-master arbitration and clock stretching per I²C spec. |
| 15 (PIO0_6/SCK0) | SSP0 Clock / GPIO | Master clock output for SSP0; polarity and phase configurable for CPOL/CPHA compatibility. |
| 16 (PIO0_7/CTS) | USART Clear-to-Send / GPIO | Hardware flow control input; asserts LOW when receiver buffer nears full, halting transmitter. |
| 17 (PIO0_8/MISO0) | SSP0 Master-In-Slave-Out / GPIO | Data input from SSP0 slave device; supports full-duplex synchronous communication. |
| 18 (PIO0_9/MOSI0) | SSP0 Master-Out-Slave-In / GPIO | Data output to SSP0 slave device; synchronized to SCK0 edge per configured frame format. |
| 19 (SWCLK/PIO0_10) | JTAG/SWD Clock / GPIO | Serial Wire Debug clock input; required for programming and real-time debugging via SWD interface. |
| 21 (TDI/PIO0_11/AD0) | JTAG Data In / ADC Input 0 | Multi-function pin: JTAG test data input during debug; analog input for 12-bit ADC channel 0. |
| 22 (TMS/PIO0_12/AD1) | JTAG Mode Select / ADC Input 1 | Multi-function pin: JTAG state machine control; analog input for 12-bit ADC channel 1. |
| 23 (TDO/PIO0_13/AD2) | JTAG Data Out / ADC Input 2 | Multi-function pin: JTAG test data output; analog input for 12-bit ADC channel 2. |
| 24 (TRST/PIO0_14/AD3) | JTAG Reset / ADC Input 3 | Optional JTAG reset input; also serves as analog input for 12-bit ADC channel 3. |
| 25 (SWDIO/PIO0_15/AD4) | SWD Data I/O / ADC Input 4 | Bi-directional SWD interface pin; also analog input for 12-bit ADC channel 4. |
| 26 (PIO0_16/AD5/WAKEUP) | ADC Input 5 / Deep Power-down Wake-up | Analog input for ADC channel 5; LOW pulse wakes device from Deep power-down mode. |
| 30 (PIO0_17/RTS) | USART Request-to-Send / GPIO | Hardware flow control output; asserts LOW when ready to receive data, enabling transmitter flow. |
| 31 (PIO0_18/RXD) | USART Receive / GPIO | Asynchronous serial input; supports UART ISP mode when used with bootloader. |
| 32 (PIO0_19/TXD) | USART Transmit / GPIO | Asynchronous serial output; supports UART ISP mode and RS-485 half-duplex control. |
| 28 (PIO1_15/DCD/SCK1) | USART Data Carrier Detect / SSP1 Clock | Input indicating modem carrier presence; also serves as clock for SSP1 interface. |
| 20 (PIO0_22/AD6) | ADC Input 6 / SSP1 MISO | Analog input for ADC channel 6; also functions as MISO for SSP1 in master mode. |
| 27 (PIO0_23/AD7) | ADC Input 7 | Analog input for ADC channel 7; dedicated function with no alternate roles in HVQFN33. |
| 13 (PIO1_23/SSEL1) | SSP1 Slave Select / GPIO | Active-low chip select for second SSP interface; enables dual SPI peripheral control. |
| 14 (PIO1_24/CT32B0_MAT0) | 32-bit Timer 0 Match 0 / GPIO | Timer output for PWM or event signaling; configurable polarity and period via match register. |
| 7 (PIO0_20/CT16B1_CAP0) | 16-bit Timer 1 Capture 0 / GPIO | Edge-triggered input for time-stamping external events (e.g., encoder pulses, zero-crossing). |
| 12 (PIO0_21/MOSI1) | SSP1 Master-Out-Slave-In / GPIO | Data output to SSP1 slave; supports independent clock domain from SSP0. |
Key Features
| Feature | Design Value |
|---|---|
| ARM Cortex-M3 with NVIC | Enables sub-10 µs interrupt response and prioritized nested interrupts for real-time control loops. |
| Programmable Windowed Watchdog (WWDT) | Prevents runaway code with time-windowed refresh requirement - critical for fail-safe industrial firmware. |
| USB-free variant | Eliminates USB PHY and associated layout complexity, reducing BOM cost and EMI risk in non-connectivity applications. |
| RS-485/UART with smart card support | Direct interface to industrial fieldbus and ISO 7816-3 compliant smart cards without external transceivers. |
| High-current GPIO drivers | 20 mA source (P0_7) and sink (P0_4/P0_5) capability - drives LEDs, small relays, or logic-level MOSFETs directly. |
| Glitch-filtered GPIO interrupt inputs | Eight pins support hardware debouncing - eliminates software filtering overhead for pushbutton or switch inputs. |
Applications
| Industrial Sensor Node | Medical Diagnostic Handheld |
|---|---|
|
Use Scenario: Compact battery-powered sensor aggregator collecting temperature, pressure, and humidity data via I²C and ADC, transmitting over RS-485 to central PLC. IC Role / Device Role / Timing Role: Main controller executing sensor polling, calibration, and protocol framing; 72 MHz CPU ensures <1 ms loop time for 100 Hz sampling. Use Value: 8 kB SRAM buffers 10+ seconds of raw sensor data; Deep power-down mode extends battery life to >1 year on coin cell. |
Use Scenario: Portable blood glucose meter with analog front-end, LCD display, and USB-free data logging to SD card via SSP. IC Role / Device Role / Timing Role: System-on-chip managing analog signal chain, user interface, and secure data storage; 12-bit ADC achieves <1% measurement accuracy. Use Value: Integrated WWDT and brownout detection prevent corrupted readings during voltage sag; 28 GPIO support tactile buttons and LCD segment drivers. |
| RS-485 Field Controller | Smart Lighting Node |
|
Use Scenario: DIN-rail mounted controller reading Modbus RTU registers from HVAC actuators and modulating valve position via PWM. IC Role / Device Role / Timing Role: Protocol engine and actuator driver; USART handles Modbus framing while CT32B0 generates precise 1–10 kHz PWM for proportional valves. Use Value: Hardware flow control (RTS/CTS) prevents UART overrun at 115.2 kbps; 48 kB flash stores multiple Modbus profiles and firmware updates. |
Use Scenario: LED driver node in DALI-2 lighting system, interpreting digital commands and dimming channels using PWM outputs. IC Role / Device Role / Timing Role: DALI command interpreter and multi-channel PWM generator; 32-bit timers provide independent 8-bit resolution dimming per channel. Use Value: Fast-mode Plus I²C configures external LED drivers; 20 mA GPIO sinks drive indicator LEDs without external transistors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC1317FHN33 | 64 kB flash, 2 kB EEPROM, USB 2.0 device controller - adds connectivity and non-volatile parameter storage. | Required where firmware updates over USB or persistent configuration storage is needed. | Select LPC1317FHN33 if USB host/device bridging or field-upgradable calibration tables are mandatory. |
| LPC1346FHN33 | 48 kB flash, 8 kB SRAM, USB 2.0 device controller, 4 kB EEPROM - identical memory but adds USB PHY and ROM-based USB stack. | Suitable for USB audio or HID devices requiring plug-and-play enumeration without external USB IC. | Choose LPC1346FHN33 when USB device functionality (e.g., CDC ACM, HID) must be implemented without external components. |
Compared with LPC1316FHN33,551, LPC1317FHN33 adds USB and EEPROM at same package size but increases BOM complexity; LPC1346FHN33 offers identical flash/SRAM but mandates USB layout and driver integration - making LPC1316FHN33,551 optimal for cost-sensitive, USB-free embedded control where flash headroom and peripheral count are primary constraints.
Availability
LPC1316FHN33,551 is available at Aetrix Electronics and suitable for industrial control, medical diagnostics, RS-485 field instrumentation, and smart lighting nodes requiring stable component supply across extended production lifecycles.
Supply support for LPC1316FHN33,551 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The LPC1300 series targets cost-optimized, low-power embedded control applications - designed to deliver ARM Cortex-M3 performance with minimal external components and robust industrial-grade reliability.
FAQ
What is the maximum operating frequency of the LPC1316FHN33,551?
The LPC1316FHN33,551 operates at a maximum CPU frequency of 72 MHz, achieved using either the internal 12 MHz ±1% IRC oscillator with PLL0 multiplication or an external 1–25 MHz crystal oscillator. This frequency is fully supported across the specified industrial temperature range (−40 °C to +85 °C) and 2.0 V–3.6 V supply voltage.
Does the LPC1316FHN33,551 include USB functionality?
No, the LPC1316FHN33,551 does not include USB functionality. It belongs to the "no USB" variant group (LPC1315/16/17) and lacks the USB 2.0 device controller, USB PLL, and USB-specific pins (USB_DP, USB_DM, USB_VBUS, USB_CONNECT). This distinguishes it from LPC1345/46/47 variants which integrate full-speed USB.
How many ADC channels does the LPC1316FHN33,551 support, and what is its sampling rate?
The LPC1316FHN33,551 integrates an 8-channel, 12-bit successive approximation ADC with a maximum sampling rate of 500 kSamples/s. Channels AD0–AD7 map to specific GPIO pins (e.g., PIO0_11, PIO0_12, PIO0_13, PIO0_14, PIO0_15, PIO0_16, PIO0_22, PIO0_23) and support single-ended or differential input modes via software configuration.
What debug interfaces are supported by the LPC1316FHN33,551?
The LPC1316FHN33,551 supports both JTAG (via TDI, TDO, TMS, TCK/SWCLK, TRST) and Serial Wire Debug (SWD) interfaces. SWD uses SWDIO and SWCLK pins and requires fewer physical connections than JTAG. Both interfaces enable full-featured debugging, flash programming, and real-time trace via SWO pin (PIO0_9).
What power modes are available on the LPC1316FHN33,551, and how is wake-up managed?
The LPC1316FHN33,551 supports four reduced power modes: Sleep, Deep-sleep, Power-down, and Deep power-down. Wake-up from Sleep/Deep-sleep occurs via GPIO interrupts, watchdog timer, or reset; Power-down wake-up uses the same sources plus USB activity (not applicable here); Deep power-down wake-up requires a LOW pulse on PIO0_16/WAKEUP pin with external pull-up.
LPC1316FHN33,551 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-VQFN Exposed Pad
- Series:
- LPC13xx
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 72MHz
- Connectivity:
- I2C, Microwire, SPI, SSI, SSP, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, WDT
- Number of I/O:
- 26
- Program Memory Size:
- 48KB (48K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 2V ~ 3.6V
- Data Converters:
- A/D 8x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC1316FHN33,551 FAQ
1.How can I place an order for LPC1316FHN33,551 through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC1316FHN33,551 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC1316FHN33,551 reliable?
The price and inventory of LPC1316FHN33,551 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC1316FHN33,551 is usually 5 days.
3.What payment methods are accepted for LPC1316FHN33,551?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC1316FHN33,551 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LPC1316FHN33,551?
LPC1316FHN33,551 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC1316FHN33,551 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC1316FHN33,551?
For technical support, including LPC1316FHN33,551 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC1316FHN33,551 requirements.
6.How does Aetrix verify that LPC1316FHN33,551 is sourced from the original manufacturer or authorized distributors?
All LPC1316FHN33,551 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC1316FHN33,551 meets industry standards.
7.What is the process for return or replacement of LPC1316FHN33,551?
All LPC1316FHN33,551 units undergo pre-shipment inspection (PSI). If there is an issue with LPC1316FHN33,551, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC1316FHN33,551 part is unused and in its original packaging.
Return procedure for LPC1316FHN33,551:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LPC1316FHN33,551 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
