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NXP Semiconductors LPC1766FBD100K
- Part No.:
- LPC1766FBD100K
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
LPC1766FBD100K.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:179
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Product details
Overview
LPC1766FBD100K from NXP Semiconductors is a 32-bit ARM Cortex-M3 microcontroller in LQFP100 package, operating at up to 100 MHz with 256 kB flash, 64 kB SRAM, dual CAN 2.0B interfaces, USB 2.0 Device/Host/OTG, Ethernet MAC, and 70 GPIOs - deployed in industrial motor control and networked white goods.
For engineers reviewing the LPC1766FBD100K datasheet, LPC1766FBD100K pinout, LPC1766FBD100K application, or LPC1766FBD100K equivalent, key selection criteria include verified Ethernet + USB + CAN coexistence, 100-pin LQFP footprint compatibility with LPC236x Arm7 series, and DAC/I2S availability status per Table 2.
Technical Context
The LPC1766FBD100K implements an Arm Cortex-M3 core with 3-stage pipeline, Harvard architecture, and integrated MPU supporting eight memory regions. It uses a multilayer AHB matrix interconnect enabling concurrent CPU, GPDMA, Ethernet MAC, and USB access without arbitration delay.
Peripheral subsystems include a 12-bit ADC (8-channel, 200 kHz), 10-bit DAC (dedicated timer + DMA), four general-purpose timers (eight capture inputs, ten compare outputs), motor control PWM, quadrature encoder interface, and RTC with battery-backed registers - all accessible via APB bridges and configurable pin-muxing through the Pin Connect Block.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M3, 100 MHz max - enables deterministic real-time control with NVIC and MPU for safety-critical firmware partitioning. |
| Memory | 256 kB flash + 64 kB SRAM (32 kB AHB SRAM0 + 16 kB AHB SRAM1 + 16 kB AHB SRAM2) - supports simultaneous Ethernet/USB DMA buffering and application code execution. |
| Connectivity | USB 2.0 Device/Host/OTG + 2× CAN 2.0B + Ethernet MAC (RMII) - allows embedded gateway functionality with protocol bridging in industrial automation. |
| Analog Peripherals | 12-bit ADC (8 inputs, 200 kHz) + 10-bit DAC (DMA-capable) - enables closed-loop analog signal acquisition and waveform generation without CPU overhead. |
| Digital I/O | 70 GPIO pins with configurable pull-up/down, open-drain mode, and bit-banding support - simplifies direct sensor/actuator interfacing and legacy bus emulation (e.g., RS-485 via RTS/CTS pins). |
| Package | LQFP100 (14 × 14 × 1.4 mm, SOT407-1) - provides full pin compatibility with LPC236x Arm7 series for drop-in migration in existing PCB layouts. |
Pinout & Package
LQFP100 package (SOT407-1), 14 mm × 14 mm × 1.4 mm body, 100 leads, exposed pad not specified.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0[0]/RD1/TXD3/SDA1 | CAN1 receiver / UART3 TX / I²C1 data | Multi-function pin supporting CAN bus termination, serial debug over UART3, and I²C peripheral expansion with non-open-drain SDA1. |
| P0[29]/USB_D+ | USB differential data positive | Dedicated full-speed USB 2.0 physical layer I/O requiring controlled impedance routing (90 Ω differential) and ESD protection per USB spec. |
| P1[0]/ENET_TXD0 | Ethernet transmit data bit 0 | Part of RMII interface; must be routed with matched length to P1[1], P1[4], and P1[15] for timing compliance at 50 MHz. |
| P2[0]/PWM1[1]/TXD1 | PWM output / UART1 TX | Enables hardware-timed motor phase control while simultaneously providing asynchronous debug output on same pin. |
| P0[26]/AD0[3]/AOUT/RXD3 | ADC input / DAC output / UART3 RX | Shared analog/digital path - DAC output usable only when AD0[3] not selected; requires careful pin function prioritization in software. |
Key Features
| Feature | Design Value |
|---|---|
| ARM Cortex-M3 with MPU | Eight-region memory protection enables certified separation of bootloader, application, and communication stacks in safety-compliant designs. |
| GPDMA controller | Eight-channel AHB-based DMA supports concurrent transfers across UART, ADC, USB, Ethernet, and memory - eliminating CPU bottlenecks in high-throughput data logging. |
| Pin multiplexing via Pin Connect Block | Runtime-selectable alternate functions per pin (e.g., P0[10] as UART2 TX, I²C2 SDA, or Timer3 match) - reduces external logic and enables flexible board reuse. |
| Low-power modes | Four reduced-power states (Sleep, Deep-sleep, Power-down, Deep power-down) with wake-up from CAN, RTC, USB, or GPIO - extends battery life in portable industrial monitors. |
| Debug & trace | Serial Wire Debug (SWD) + Serial Wire Trace (SWO) + Emulation Trace Module - enables non-intrusive real-time instruction tracing for timing-critical ISR validation. |
Applications
| Industrial Motor Control | Smart Energy Metering |
|---|---|
Use Scenario: Three-phase BLDC motor drive with current sensing, position feedback, and field-oriented control loop. IC Role / Device Role / Timing Role: Main system controller executing FOC algorithm, managing PWM timing, capturing encoder pulses, and communicating via CAN bus. Use Value: Integrated motor control PWM with dead-time insertion and quadrature encoder interface eliminate external gate drivers and counter ICs, reducing BOM count by ≥3 components. | Use Scenario: DIN-rail mounted electricity meter with tariff switching, tamper detection, and HAN communication. IC Role / Device Role / Timing Role: Central processing unit handling metrology calculations, secure firmware updates, and dual-interface connectivity (M-Bus + PLC or RF). Use Value: Dual CAN + USB + Ethernet enables simultaneous utility-side M-Bus reporting and consumer-side local configuration - no external protocol bridge required. |
| Networked White Goods | Alarm & Security Systems |
Use Scenario: Wi-Fi-connected washing machine with remote diagnostics, energy monitoring, and OTA firmware updates. IC Role / Device Role / Timing Role: Application processor interfacing with Wi-Fi module via UART/USB, managing appliance state machine, and logging sensor data to flash. Use Value: 256 kB flash + 64 kB SRAM accommodates dual-application image storage (active + update), enabling atomic firmware swaps without external memory. | Use Scenario: Commercial intrusion panel with keypad, siren, door/window sensors, and cellular backup. IC Role / Device Role / Timing Role: Real-time event coordinator triggering alarm sequences, managing low-power sleep between sensor polls, and maintaining RTC time during main power loss. Use Value: Ultra-low-power RTC with separate battery supply and 20-byte backup registers preserves system time and alarm history across AC outages. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ARM Cortex-M3 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LPC1768FBD100 | 512 kB flash (vs. 256 kB), identical peripherals and pinout | Supports larger firmware images (e.g., embedded web server + TLS stack) | Select when >256 kB application code + bootloader + OTA image space is required. |
| LPC1765FBD100 | No Ethernet MAC (vs. present in LPC1766FBD100), same flash/SRAM/CAN/USB | Suitable for CAN+USB edge nodes where Ethernet backhaul is handled externally | Select when Ethernet PHY cost, board area, or EMI constraints preclude on-chip MAC implementation. |
Compared with LPC1768FBD100, LPC1766FBD100 trades flash capacity for cost-sensitive deployments; compared with LPC1765FBD100, it adds Ethernet capability without sacrificing CAN or USB - making it optimal for gateway-class devices needing wired infrastructure integration.
Availability
LPC1766FBD100K is available at Aetrix Electronics and suitable for industrial motor control, smart energy metering, and networked white goods requiring stable component supply across multi-year production cycles.
Supply support for LPC1766FBD100K includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets.
The LPC176x family was designed for high-integration embedded control applications demanding real-time performance, mixed-signal capability, and multi-protocol connectivity - targeting industrial automation, building control, and appliance markets.
FAQ
Does LPC1766FBD100K support Ethernet functionality?
Yes, LPC1766FBD100K includes an Ethernet MAC with RMII interface and dedicated DMA controller. It supports 10/100 Mbps operation but requires an external PHY. This capability is confirmed in Table 2 of the official NXP datasheet Rev. 9.10 and distinguishes LPC1766FBD100K from variants like LPC1765FBD100 which omit Ethernet.
What is the maximum operating frequency of LPC1766FBD100K?
LPC1766FBD100K operates at a maximum CPU frequency of 100 MHz. This is explicitly stated in Section 2 "Features and benefits" and Table 2 of the NXP datasheet, consistent across all LPC1766/65/64/63 variants (unlike LPC1769 which runs at 120 MHz).
Is the DAC peripheral available on LPC1766FBD100K?
Yes, LPC1766FBD100K includes a 10-bit DAC with dedicated conversion timer and DMA support. Table 2 confirms DAC = "yes" for LPC1766FBD100, and Section 2 lists it under "Other peripherals" - enabling analog waveform generation without CPU intervention.
Which packages are offered for LPC1766FBD100K?
LPC1766FBD100K is available exclusively in the LQFP100 package (SOT407-1), as documented in Table 1 of the NXP datasheet. Other variants like LPC1768FET100 use TFBGA100, but LPC1766FBD100K does not have BGA or WLCSP options.
Does LPC1766FBD100K support USB OTG functionality?
Yes, LPC1766FBD100K integrates a USB 2.0 full-speed Device/Host/OTG controller with on-chip PHY for device and host functions, plus dedicated DMA. Table 2 explicitly lists "Device/Host/OTG" under USB column for LPC1766FBD100, confirming OTG capability.
LPC1766FBD100K Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 100-LQFP
- Series:
- LPC17xx
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
- Number of I/O:
- 70
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.4V ~ 3.6V
- Data Converters:
- A/D 8x12b; D/A 1x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LPC1766FBD100K FAQ
1.How can I place an order for LPC1766FBD100K through Aetrix?
Please submit a Request for Quotation (RFQ) for LPC1766FBD100K on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LPC1766FBD100K reliable?
The price and inventory of LPC1766FBD100K are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LPC1766FBD100K is usually 5 days.
3.What payment methods are accepted for LPC1766FBD100K?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LPC1766FBD100K transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LPC1766FBD100K?
LPC1766FBD100K orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LPC1766FBD100K order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LPC1766FBD100K?
For technical support, including LPC1766FBD100K datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LPC1766FBD100K requirements.
6.How does Aetrix verify that LPC1766FBD100K is sourced from the original manufacturer or authorized distributors?
All LPC1766FBD100K products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LPC1766FBD100K meets industry standards.
7.What is the process for return or replacement of LPC1766FBD100K?
All LPC1766FBD100K units undergo pre-shipment inspection (PSI). If there is an issue with LPC1766FBD100K, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LPC1766FBD100K part is unused and in its original packaging.
Return procedure for LPC1766FBD100K:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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