NXP Semiconductors LPC1768UKJ

Overview

LPC1768UKJ from NXP Semiconductors is a 32-bit ARM Cortex-M3 microcontroller designed for embedded control applications requiring integrated Ethernet, USB 2.0 Host/Device/OTG, dual CAN 2.0B, 12-bit ADC, and 10-bit DAC. It operates at up to 100 MHz, integrates 512 kB flash and 64 kB SRAM (32 kB AHB + 16 kB AHB + 16 kB APB), and is packaged in a 100-ball WLCSP (5.07 × 5.07 × 0.53 mm) for space-constrained industrial and consumer designs.

For engineers reviewing the LPC1768UKJ datasheet, LPC1768UKJ pinout, LPC1768UKJ application, or LPC1768UKJ equivalent, key selection considerations include its WLCSP100 package compatibility with high-density PCB layouts, dual-CAN support for automotive diagnostics, Ethernet MAC with RMII for industrial networking, and full-featured USB 2.0 OTG capability enabling host-peripheral role switching in portable devices.

Technical Context

The LPC1768UKJ implements an Arm Cortex-M3 core with 3-stage pipeline, Harvard architecture, and integrated Memory Protection Unit (MPU) supporting eight memory regions. Its multilayer AHB matrix enables concurrent access by CPU, GPDMA, Ethernet MAC, and USB controller without arbitration delay.

Peripheral subsystems include a dedicated DMA controller for SSP, I2S, UART, ADC, and DAC; split APB bus for low-stall CPU-DMA interaction; and clock generation with main oscillator (1–25 MHz), 4 MHz ±1% internal RC oscillator, and dual PLLs (CPU and USB). The device supports four power modes - Sleep, Deep-sleep, Power-down, and Deep power-down - managed by an integrated PMU.

Key Specifications

Pinout & Package

Package: WLCSP100 (Wafer Level Chip-Scale Package), 100-ball array, 0.4 mm pitch, 5.07 mm × 5.07 mm body, 0.53 mm height. Ball A1 marked with index area per Fig 4.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with LPC1769FBD100 and LPC1768FET100, the LPC1768UKJ delivers identical feature set in the smallest available package - making it optimal for space-constrained designs where LQFP or TFBGA footprints are prohibitive, while retaining full software compatibility across the LPC176x family.

Availability

LPC1768UKJ is available at Aetrix Electronics and suitable for industrial gateways, smart lighting controllers, portable diagnostic tools, and home appliance motor control systems requiring stable component supply and long-term lifecycle support.

Supply support for LPC1768UKJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with headquarters in Eindhoven, Netherlands.

The LPC176x series was engineered for high-integration embedded control in resource-constrained environments - emphasizing mixed-signal capability, multi-protocol connectivity, and ultra-low-power operation across industrial automation and consumer electronics.

FAQ

What is the maximum operating frequency of the LPC1768UKJ?

The LPC1768UKJ operates at a maximum CPU frequency of 100 MHz, enabled by its ARM Cortex-M3 core and integrated flash accelerator that delivers zero-wait-state execution. This frequency is confirmed in Table 2 of the official NXP datasheet Rev. 9.10 and applies specifically to the LPC1768 variant - the LPC1769 variant supports up to 120 MHz, but the LPC1768UKJ is rated at 100 MHz.

Does the LPC1768UKJ include an integrated USB PHY?

Yes, the LPC1768UKJ includes a full-speed USB 2.0 PHY integrated on-die, supporting Device, Host, and OTG modes without external transceiver components. This is explicitly stated in Section 2 "Features and benefits" and Table 2 of the NXP datasheet, and applies to the LPC1768UKJ as a member of the LPC1768 family.

What package type is used for the LPC1768UKJ?

The LPC1768UKJ is supplied in a Wafer Level Chip-Scale Package (WLCSP100) with 100 solder bumps, measuring 5.07 mm × 5.07 mm × 0.53 mm. This is documented in Table 1 ("Ordering information") and Figure 4 ("Pin configuration WLCSP100 package") of the NXP LPC1769_68_67_66_65_64_63 datasheet Rev. 9.10.

How much flash and SRAM does the LPC1768UKJ have?

The LPC1768UKJ integrates 512 kB of on-chip flash memory and 64 kB of total SRAM - structured as 32 kB AHB SRAM0, 16 kB AHB SRAM1, and 16 kB APB SRAM. These values are specified in Table 2 ("Ordering options") and confirmed in the "General description" section of the NXP datasheet Rev. 9.10.

Is the LPC1768UKJ pin-compatible with other LPC176x variants?

The LPC1768UKJ shares identical pin functionality and ball mapping with other WLCSP100-packaged LPC176x devices (e.g., LPC1768FET100 is TFBGA100, not pin-compatible), but is not pin-compatible with LQFP100 variants like LPC1768FBD100 due to differing package geometry and ball-to-lead mapping - verified via Tables 1 and 4 in the NXP datasheet.