NXP Semiconductors LPC1778FET208K

Overview

LPC1778FET208 from NXP Semiconductors is a 32-bit ARM Cortex-M3 microcontroller designed for embedded applications requiring high integration, low power, and Ethernet connectivity. It operates at up to 120 MHz, integrates 512 kB flash, 96 kB SRAM, dual CAN interfaces, USB Device/Host/OTG, five UARTs, and supports 165 GPIO pins - deployed in industrial motor control and networked HVAC systems.

For engineers reviewing the LPC1778FET208 datasheet, LPC1778FET208 pinout, LPC1778FET208 application, or LPC1778FET208 equivalent, key selection criteria include its TFBGA208 package compatibility with LPC23xx/LPC24xx pin functions, Ethernet MAC with MII/RMII, and absence of LCD controller - critical for legacy migration and real-time industrial gateway designs.

Technical Context

The LPC1778FET208 implements an ARM Cortex-M3 core with Harvard architecture, 3-stage pipeline, and integrated Memory Protection Unit (MPU) supporting eight memory regions. Its multilayer AHB matrix enables concurrent access by CPU, Ethernet, USB, and GPDMA without arbitration delay unless accessing the same slave.

System-level features include a dedicated USB PLL separate from the main CPU PLL, RTC with 20-byte battery-backed registers and event recorder in RTC power domain, and a General Purpose DMA controller supporting transfers across UART, SSP, I2C, ADC, DAC, timers, and memory-to-memory operations.

Key Specifications

Pinout & Package

Package: TFBGA208 - plastic thin fine-pitch ball grid array, 15 mm × 15 mm × 0.7 mm body, 208-ball layout with 0.65 mm pitch. Compatible with LQFP208 pin function mapping per NXP's pin compatibility guidance for LPC23xx/LPC24xx migration.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with LPC1788FET208, LPC1778FET208 removes LCD support to reduce die size and cost while retaining full Ethernet, dual CAN, and USB OTG capability; versus LPC1777FBD208, it adds Ethernet and switches to TFBGA208 for higher I/O density and thermal performance in compact industrial modules.

Availability

LPC1778FET208 is available at Aetrix Electronics and suitable for industrial motor control, networked HVAC gateways, and automotive telematics requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for LPC1778FET208 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and mixed-signal SoCs.

The LPC177x series targets cost-sensitive, high-integration industrial control applications - delivering Ethernet, dual CAN, USB, and rich analog peripherals in a single chip to replace multi-chip legacy designs based on LPC23xx/LPC24xx.

FAQ

What is the maximum operating frequency of the LPC1778FET208?

The LPC1778FET208 operates at up to 120 MHz CPU frequency using its on-chip PLL, which can be driven by either the 1–25 MHz crystal oscillator or the internal 12 MHz RC oscillator trimmed to ±1% accuracy - enabling flexible clock source selection without external high-frequency crystals.

Does the LPC1778FET208 include an LCD controller?

No, the LPC1778FET208 does not include an LCD controller. Unlike the LPC1788 variant, the LPC1778 part number explicitly omits LCD functionality as confirmed in Table 2 of the datasheet - making it suitable for applications where display output is handled externally or not required.

How many CAN interfaces does the LPC1778FET208 support?

The LPC1778FET208 supports two independent CAN 2.0B controllers, each with full message object RAM and acceptance filtering - enabling simultaneous communication on two separate CAN buses, such as OBD-II and chassis control networks in automotive aftermarket systems.

What package type is used for the LPC1778FET208?

The LPC1778FET208 uses a TFBGA208 package: plastic thin fine-pitch ball grid array with 208 balls, 15 mm × 15 mm body size, and 0.65 mm pitch - offering higher I/O density and better thermal performance than LQFP208 variants while maintaining pin function compatibility with LPC23xx/LPC24xx.

Is the LPC1778FET208 pin-compatible with LPC24xx microcontrollers?

Yes, the LPC1778FET208 pinout is intentionally designed for functional pin compatibility with LPC24xx family devices in the same package variant (e.g., TFBGA208 or LQFP208), allowing direct migration paths - though software adaptation is required due to ARM7-to-Cortex-M3 architecture differences and peripheral register re-mapping.