NXP Semiconductors LPC1788FET208,551

Overview

LPC1788FET208,551 from NXP Semiconductors is a 32-bit ARM Cortex-M3 microcontroller designed for high-integration embedded systems requiring Ethernet, USB Device/Host/OTG, LCD control, and real-time motor control. It operates at up to 120 MHz, integrates 512 kB flash, 96 kB SRAM, dual CAN, eight-channel 12-bit ADC, and 10-bit DAC, and targets industrial automation and medical imaging applications.

For engineers reviewing the LPC1788FET208,551 datasheet, LPC1788FET208,551 pinout, LPC1788FET208,551 application, or LPC1788FET208,551 equivalent, key selection criteria include TFBGA208 package compatibility, 165 GPIO count with Cortex-M3 bit-banding support, EMC interface width (32-bit), and LCD controller presence - all confirmed for this exact variant.

Technical Context

The LPC1788FET208,551 implements a Harvard-architecture ARM Cortex-M3 core with 3-stage pipeline, integrated Memory Protection Unit (MPU), and Nested Vectored Interrupt Controller (NVIC). Its multilayer AHB matrix enables concurrent access by CPU, Ethernet MAC, USB controller, and GPDMA without arbitration delay unless accessing the same slave.

Peripheral integration includes dedicated DMA channels for LCD, USB, Ethernet, and GPDMA servicing SSP, I2S, UART, ADC, DAC, and timer match signals. The device supports full-speed USB 2.0 dual-role operation with on-chip PHY and features a windowed watchdog timer, RTC with battery-backed registers, and event recorder in the RTC power domain.

Key Specifications

Pinout & Package

Package: TFBGA208 (plastic thin fine-pitch ball grid array; 208 balls; body 15 × 15 × 0.7 mm; SOT950-1).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with LPC1788FBD208, the LPC1788FET208,551 offers superior thermal dissipation and smaller PCB area in production designs, while LPC1778FET208,551 provides functional subset savings where Ethernet and LCD are excluded - both preserve identical software stack and peripheral register mapping.

Availability

LPC1788FET208,551 is available at Aetrix Electronics and suitable for industrial automation controllers, medical imaging systems, and networked point-of-sale terminals requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for LPC1788FET208,551 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The LPC178x series was engineered for high-performance embedded control applications demanding rich peripheral integration, real-time responsiveness, and industrial-grade reliability - particularly targeting human-machine interfaces, motor drives, and networked industrial equipment.

FAQ

What is the maximum operating frequency of the LPC1788FET208,551?

The LPC1788FET208,551 operates at up to 120 MHz CPU frequency using its ARM Cortex-M3 core. This maximum speed is achievable with the on-chip PLL driven by either the 1–25 MHz external crystal oscillator or the internal 12 MHz RC oscillator, and is sustained by the integrated flash accelerator delivering zero-wait-state execution from 512 kB on-chip flash memory.

Does the LPC1788FET208,551 support Ethernet connectivity?

Yes, the LPC1788FET208,551 includes a full-featured Ethernet MAC with MII/RMII interface and associated DMA controller. It supports 10/100 Mbps operation and resides on an independent AHB bus to avoid contention with CPU or other peripherals - a feature confirmed specifically for the LPC1788 variant in Table 2 of the datasheet.

What package type is used for the LPC1788FET208,551?

The LPC1788FET208,551 uses a TFBGA208 package (SOT950-1): a plastic thin fine-pitch ball grid array with 208 solder balls, 15 mm × 15 mm body size, and 0.7 mm height. This package is distinct from LQFP208 variants and requires compatible PCB layout and reflow profile for reliable assembly.

How much SRAM does the LPC1788FET208,551 provide, and how is it organized?

The LPC1788FET208,551 provides 96 kB total SRAM, structured as 64 kB main SRAM on the CPU local bus for high-speed code/data access, plus two 16 kB peripheral SRAM blocks with separate AHB access paths - enabling concurrent DMA transfers (e.g., to LCD or USB) without CPU stalling.

Is the LPC1788FET208,551 pin-compatible with earlier NXP microcontrollers?

The LPC1788FET208,551 shares functional pin compatibility with the LPC23xx and LPC24xx families, as stated in the General Description section. However, physical pinout differs due to TFBGA208 packaging - direct PCB replacement requires layout revision, though software migration benefits from retained peripheral register mapping and ARM Cortex-M3 instruction set compatibility.