NXP Semiconductors LPC1823JET100E

Overview

LPC1823JET100E from NXP Semiconductors is a 32-bit ARM Cortex-M3 microcontroller operating at up to 180 MHz, featuring 512 kB dual-bank flash (256 kB per bank), 104 kB on-chip SRAM, and no Ethernet or LCD controller. It integrates two 10-bit ADCs (4 channels total), one 10-bit DAC, USB0 Host/Device capability, and supports industrial control and e-metering applications with extended temperature range (–40 °C to +105 °C).

For engineers reviewing the LPC1823JET100E datasheet, LPC1823JET100E pinout, LPC1823JET100E application, or LPC1823JET100E equivalent, key selection criteria include its TFBGA100 package, absence of Ethernet/LCD, USB0-only interface, 4-channel ADC configuration, and motor-control PWM exclusion - critical for footprint-constrained embedded designs requiring deterministic real-time performance.

Technical Context

The LPC1823JET100E implements an ARM Cortex-M3 r2p1 core with Harvard architecture, 3-stage pipeline, and integrated Memory Protection Unit (MPU) supporting eight memory regions. Its debug infrastructure includes JTAG/SWD, serial trace, eight breakpoints, and four watchpoints, enabling robust firmware validation in safety-critical environments.

Peripherals are organized across AHB and APB buses with DMA support; the State Configurable Timer/PWM (SCTimer/PWM) subsystem provides flexible event-driven timing, while the Global Input Multiplexer Array (GIMA) enables dynamic routing of signals between GPIO, timers, ADCs, and SCTimer/PWM - essential for multi-sensor industrial I/O consolidation.

Key Specifications

Pinout & Package

Package: TFBGA100 (SOT926-1), plastic thin fine-pitch ball grid array, 100 balls, 0.5 mm pitch, body size 9 mm × 9 mm × 0.7 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with LPC1833JET100, LPC1823JET100E trades Ethernet and extra SRAM for lower system cost and simpler layout; versus LPC1822JET100, it adds USB0 host capability and retains motor-control PWM support - making it optimal for USB-connected industrial peripherals requiring field-upgradable firmware.

Availability

LPC1823JET100E is available at Aetrix Electronics and suitable for industrial control nodes, e-metering endpoints, RFID reader controllers, and white goods UI modules requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for LPC1823JET100E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and edge processing.

The LPC18xx product line was designed for high-performance embedded applications demanding real-time determinism, rich analog/digital peripheral integration, and robust security features - targeting industrial automation, smart metering, and human-machine interface systems.

FAQ

What is the maximum operating frequency of the LPC1823JET100E?

The LPC1823JET100E operates at a maximum CPU frequency of 180 MHz, enabled by its ARM Cortex-M3 core with integrated prefetch unit and speculative branching. This clock speed is fully supported across the full –40 °C to +105 °C temperature range specified for the LPC1823JET100E, ensuring consistent real-time performance in harsh environments.

Does the LPC1823JET100E include Ethernet or LCD controller functionality?

No, the LPC1823JET100E does not include Ethernet MAC or LCD controller peripherals. This is confirmed in Table 2 of the official datasheet, which explicitly lists "no" for both Ethernet and LCD columns for the LPC1823JET100E variant. These features are present in higher-tier variants like LPC185x but omitted in the LPC182x series to reduce cost and silicon area.

How much SRAM and flash memory does the LPC1823JET100E provide?

The LPC1823JET100E integrates 104 kB of on-chip SRAM and 512 kB of dual-bank flash memory (256 kB per bank). This configuration supports concurrent firmware execution and safe over-the-air updates without requiring external memory, distinguishing it from the 136 kB SRAM found in LPC183x/5x variants.

What USB interfaces are supported by the LPC1823JET100E?

The LPC1823JET100E supports only USB0, configured as Host/Device (no OTG) with an integrated high-speed PHY. USB1 is not implemented - confirmed in Table 2 of the datasheet, which shows "yes/no" for USB1 interface capability. This makes LPC1823JET100E suitable for USB-peripheral or USB-host applications but not dual-USB systems.

What is the package type and pin count of the LPC1823JET100E?

The LPC1823JET100E uses a TFBGA100 package (SOT926-1): a 100-ball thin fine-pitch ball grid array with 0.5 mm pitch, 9 mm × 9 mm body size, and 0.7 mm height. This compact, thermally efficient package is ideal for space-constrained industrial and metering applications where PCB area is at a premium.