NXP Semiconductors LPC1850FBD208,551

Overview

LPC1850FBD208 from NXP Semiconductors is a 32-bit ARM Cortex-M3 microcontroller operating at up to 180 MHz, featuring 200 kB on-chip SRAM, dual High-speed USB 2.0 interfaces (one OTG-capable), 10/100T Ethernet MAC with IEEE 1588 support, and an LCD controller - deployed in industrial gateways requiring real-time connectivity, secure boot, and multi-interface peripheral management.

For engineers reviewing the LPC1850FBD208 datasheet, LPC1850FBD208 pinout, LPC1850FBD208 application, or LPC1850FBD208 equivalent, key selection criteria include its LQFP208 package with 142 GPIOs, dual USB PHY integration (on-chip HS PHY + ULPI interface), EMC support for SDRAM/NOR flash, and hardware-accelerated SCT subsystem for deterministic timing control in motor drives and protocol stacks.

Technical Context

The LPC1850FBD208 implements a Harvard-architecture ARM Cortex-M3 core with 3-stage pipeline, integrated MPU and NVIC, and speculative branching via internal prefetch unit. It uses three independent PLLs: one for CPU clocking up to 180 MHz, one dedicated to USB0 high-speed operation, and a third configurable as audio PLL.

Its AHB multilayer matrix interconnect enables concurrent access to SRAM blocks, peripherals, and DMA channels. The State Configurable Timer (SCT) subsystem operates on AHB with event-driven state transitions, while the Global Input Multiplexer Array (GIMA) routes signals across timers, ADCs, and SCT without CPU intervention - enabling low-latency, deterministic I/O response.

Key Specifications

Pinout & Package

LPC1850FBD208 is housed in a plastic low-profile quad flat package (LQFP208) measuring 28 × 28 × 1.4 mm, with 208 leads and exposed thermal pad. Pin functions are multiplexed across 16 GPIO ports (P0–P9, PA–PF), each supporting up to eight digital peripheral modes via SCU configuration.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with LPC4350FET256 and LPC1788FBD208, the LPC1850FBD208 delivers highest single-core performance per mm² in the LPC18xx family, with unique integration of dual USB PHYs, SPIFI, and SCT - making it the preferred choice for new designs prioritizing interface density and deterministic timing over dual-core flexibility or legacy compatibility.

Availability

LPC1850FBD208 is available at Aetrix Electronics and suitable for industrial gateways, smart energy meters, color LCD HMIs, and RFID reader controllers requiring stable component supply across extended product lifecycles.

Supply support for LPC1850FBD208 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based microcontrollers and edge processing.

The LPC18xx series was designed for high-performance embedded applications demanding rich peripheral integration, real-time determinism, and secure firmware execution - targeting industrial control, networking infrastructure, and human-machine interface systems.

FAQ

What is the maximum CPU frequency supported by the LPC1850FBD208?

The LPC1850FBD208 supports a maximum CPU frequency of 180 MHz using its primary PLL. This is achieved with the ARM Cortex-M3 core's 3-stage pipeline and Harvard architecture, enabling deterministic real-time execution for time-critical tasks such as motor control and protocol stack processing. The LPC1850FBD208 maintains full peripheral functionality at this clock rate, including dual USB 2.0 and Ethernet MAC operation.

Does the LPC1850FBD208 include on-chip flash memory?

No, the LPC1850FBD208 does not include on-chip flash memory. It relies on external storage via the Quad SPI Flash Interface (SPIFI) for program code, which supports up to 52 MB/s read speeds and executes-in-place (XIP) operation. On-chip non-volatile storage consists of 64 kB ROM (containing boot code and drivers) and 32-bit One-Time Programmable (OTP) memory for device-specific configuration and security keys.

How many USB interfaces does the LPC1850FBD208 provide, and what are their capabilities?

The LPC1850FBD208 provides two High-speed USB 2.0 interfaces: USB0 supports Host/Device/OTG with an integrated on-chip high-speed PHY, while USB1 supports Host/Device operation with an on-chip full-speed PHY and ULPI interface for external high-speed PHY attachment. Both interfaces include DMA support and dedicated PLLs - enabling simultaneous high-bandwidth device enumeration and host stack operation without CPU overhead. The LPC1850FBD208 also includes USB test software in ROM.

What package type and pin count does the LPC1850FBD208 use?

The LPC1850FBD208 uses a plastic low-profile quad flat package (LQFP208) with 208 leads and a 28 × 28 × 1.4 mm body size. It provides 142 GPIO pins, all accessible via multiplexed functions controlled by the System Configuration Unit (SCU). The package includes an exposed thermal pad for enhanced heat dissipation in continuous high-CPU-load applications.

Does the LPC1850FBD208 support IEEE 1588 Precision Time Protocol?

Yes, the LPC1850FBD208 supports IEEE 1588-2008 v2 (PTPv2) through its integrated 10/100T Ethernet MAC with hardware timestamping capability. The MAC includes dedicated registers for ingress/egress timestamp capture at the physical layer, enabling sub-microsecond synchronization accuracy in industrial Ethernet applications such as motion control and distributed I/O systems. This feature is fully operational in both RMII and MII interface modes.